Patent application number | Description | Published |
20110185257 | SEMICONDUCTOR MEMORY HAVING NON-STANDARD FORM FACTOR - A semiconductor memory chip including error correction circuitry configured to receive data words from an external device, each data word comprising a binary number of data bits, and configured to error encode each data word to form a corresponding coded word comprising a non-binary number of data bits including the data bits of the data word and a plurality of error correction code bits. At least one memory cell array is configured to receive and store the coded word and partitioned based on the non-binary number of bits of the coded word so as to have a non-binary number of wordlines and provide the memory chip with an aspect ratio other than a 2:1 aspect ratio. | 07-28-2011 |
20120166753 | CONFIGURABLE MEMORY BANKS OF A MEMORY DEVICE - A memory device has a storage array having a plurality of accessible memory banks and a configurable first set of memory segments. The plurality of accessible memory banks include a second set of memory segments. During a first mode of operation, the first set of memory segments is configured to be an additional accessible memory bank. During a second mode of operation, a pair of memory segments in the first set of memory segments are configured to be an additional set of memory segments in each of the plurality of accessible memory banks. | 06-28-2012 |
20120170356 | Semiconductor Memory Device with Hierarchical Bitlines - A dynamic random access memory (DRAM) device has a hierarchical bitline structure with local bitlines and global bitlines formed on different metal layers. The local bitlines are separated into a plurality of local bitline sections, and bitline isolation switches are configured to connect or disconnect the local bitline sections to or from the global bitlines. As a result, the local bitlines with higher per-length capacitance can be made shorter, since the global bitline with lower per-length capacitance is used to route the signal from the cell capacitances of the memory cells to the remote sense amplifiers. | 07-05-2012 |
20120221902 | BIT-REPLACEMENT TECHNIQUE FOR DRAM ERROR CORRECTION - The disclosed embodiments provide a dynamic memory device, comprising a set of dynamic memory cells and a set of replacement dynamic memory cells. The set of replacement dynamic memory cells includes data cells which contain replacement data bits for predetermined faulty cells in the set of dynamic memory cells, and address cells which contain address bits identifying the faulty cells, wherein each data cell is associated with a group of address cells that identify an associated faulty cell in the set of dynamic memory cells. The dynamic memory device also includes a remapping circuit, which remaps a faulty cell in the set of dynamic memory cells to an associated replacement cell in the set of replacement cells. | 08-30-2012 |
20120230134 | DRAM SENSE AMPLIFIER THAT SUPPORTS LOW MEMORY-CELL CAPACITANCE - The disclosed embodiments provide a sense amplifier for a dynamic random-access memory (DRAM). This sense amplifier includes a bit line to be coupled to a cell to be sensed in the DRAM, and a complement bit line which carries a complement of a signal on the bit line. The sense amplifier also includes a p-type field-effect transistor (PFET) pair comprising cross-coupled PFETs that selectively couple either the bit line or the complement bit line to a high bit-line voltage. The sense amplifier additionally includes an n-type field effect transistor (NFET) pair comprising cross-coupled NFETs that selectively couple either the bit line or the complement bit line to ground. This NFET pair is lightly doped to provide a low threshold-voltage mismatch between NFETs in the NFET pair. In one variation, the gate material for the NFETs is selected to have a work function that compensates for a negative threshold voltage in the NFETs which results from the light substrate doping. In another variation, the sense amplifier additionally includes a cross-coupled pair of latching NFETs. These latching NFETs are normally doped and are configured to latch the voltage on the bit line after the lightly doped NFETs finish sensing the voltage on the bit line. | 09-13-2012 |
20120314520 | Memory Architecture With Redundant Resources - A hierarchical memory architecture includes an array of memory sub-arrays, each of which includes an array of memory cells. Each sub-array is supported by local wordlines, local column-select lines, and bitlines. The local wordlines are controlled using main wordlines that extend past multiple sub-arrays in a direction parallel to a first axis, whereas the local column-select lines are controlled using main column-select lines that extend between sub-arrays in a direction perpendicular to the first axis. At the direction of signals presented on the local wordlines and column-select lines, subsets of the bitlines in each sub-array are connected to main data lines that extend over a plurality of the sub-arrays in parallel with the second axis. Some embodiments include redundant data resources that are selected based on a decoding of row addresses. | 12-13-2012 |
20120327726 | Methods and Circuits for Dynamically Scaling DRAM Power and Performance - A memory system supports high-performance and low-power modes. The memory system includes a memory core and a core interface. The memory core employs core supply voltages that remain the same in both modes. Supply voltages and signaling rates for the core interface may be scaled down to save power. Level shifters between the memory core and core interface level shift signals as needed to accommodate the signaling voltages used by the core interface in the different modes. | 12-27-2012 |
20130032950 | Techniques for Interconnecting Stacked Dies Using Connection Sites - An integrated circuit die includes conductive connection sites located at least on a surface of the integrated circuit die within a contiguous region thereof. The integrated circuit also includes a core circuit located outside the contiguous region. The core circuit is coupled to at least one of the connection sites. | 02-07-2013 |
20130114353 | MEMORY METHODS AND SYSTEMS WITH ADIABATIC SWITCHING - A memory system includes wordlines and pairs of complementary bitlines that provide access to memory storage elements. Capacitive and resistive loads associated with wordlines and bitlines are driven relatively slowly between voltage levels to reduce peak current, and thus power dissipation. Power dissipation is further reduced by charging complementary bitlines at substantially different rates. | 05-09-2013 |
20130132685 | MEMORY CONTROLLER AND MEMORY DEVICE COMMAND PROTOCOL - Embodiments generally relate to a command protocol and/or related circuits and apparatus for communication between a memory device and a memory controller. In one embodiment, the memory controller includes an interface for transmitting commands to the memory device, wherein the memory device includes bitline multiplexers, and accessing of memory cells within the memory device is carried out by a command protocol sequence that includes a wordline selection, followed by bitline selections by the bitline multiplexers. In another embodiment, a memory device includes bitline multiplexers and further includes an interface for receiving a command protocol sequence that specifies a wordline selection followed by bitline selections by the bitline multiplexers. | 05-23-2013 |
20130168674 | Methods and Systems for Repairing Interior Device Layers in Three-Dimensional Integrated Circuits - A three-dimensional integrated circuit (3D-IC) includes a stack of semiconductor wafers, each of which includes a substrate and a device layer. Programmable components, such as memory arrays or logic circuits, are formed within the device layers. Some of the programmable components are redundant, and can be substituted for defective components by programming passive memory elements in a separate conductive layer provided for this purpose. The separate conductive layer is devoid of active devices, and is therefore relatively reliable and inexpensive. | 07-04-2013 |
20130201770 | MEMORY WITH DEFERRED FRACTIONAL ROW ACTIVATION - Row activation operations within a memory component are carried out with respect to subrows instead of complete storage rows to reduce power consumption. Further, instead of activating subrows in response to row commands, subrow activation operations are deferred until receipt of column commands that specify the column operation to be performed and the subrow to be activated. | 08-08-2013 |
20130229848 | MULTI-DIE DRAM BANKS ARRANGEMENT AND WIRING - A memory die for use in a multi-die stack having at least one other die. The memory die includes a plurality of contacts arranged in a field and configured to interface to the other dies of the multi-die stack. A first subset of the buffer lines of a number of buffer lines are connected to respective contacts in the field. The memory die also includes a number of buffers and cross-bar lines. The buffers are coupled between respective signal lines and respective buffer lines. The cross-bar lines interconnect respective pairs of buffer lines in a second subset of the buffer lines that is distinct from the first subset of the buffer lines. | 09-05-2013 |
20130254475 | MEMORY REFRESH METHOD AND DEVICES - The present disclosure describes DRAM architectures and refresh controllers that allow for scheduling of an opportunistic refresh of a DRAM device concurrently with normal row activate command directed toward the DRAM device. Each activate command affords an “opportunity” to refresh another independent row (i.e., a wordline) within a memory device with no scheduling conflict. | 09-26-2013 |
20130279280 | STACKED MEMORY DEVICE WITH REDUNDANT RESOURCES TO CORRECT DEFECTS - A memory device includes a stack of circuit layers, each circuit layer having formed thereon a memory circuit configured to store data and a redundant resources circuit configured to provide redundant circuitry to correct defective circuitry on at least one memory circuit formed on at least one layer in the stack. The redundant resources circuit includes a partial bank of redundant memory cells, wherein an aggregation of the partial bank of redundant memory cells in each of the circuit layers of the stack includes at least one full bank of redundant memory cells and wherein the redundant resources circuit is configured to replace at least one defective bank of memory cells formed on any of the circuit layers in the stack with at least a portion of the partial bank of redundant memory cells formed on any of the circuit layers in the stack. | 10-24-2013 |
20130290812 | SEMICONDUCTOR MEMORY HAVING NON-STANDARD FORM FACTOR - A semiconductor memory chip including error correction circuitry configured to receive data words from an external device, each data word comprising a binary number of data bits, and configured to error encode each data word to form a corresponding coded word comprising a non-binary number of data bits including the data bits of the data word and a plurality of error correction code bits. At least one memory cell array is configured to receive and store the coded word and partitioned based on the non-binary number of bits of the coded word so as to have a non-binary number of wordlines and provide the memory chip with an aspect ratio other than a 2:1 aspect ratio. | 10-31-2013 |
20140063887 | STACKED DRAM DEVICE AND METHOD OF MANUFACTURE - A memory stack includes a number of memory dies including a master die and one or more slave dies. The slave die can be converted to a master die by further processing. The slave die includes a memory core having memory cell arrays. The slave die also includes first and second metal layers that form first and second distribution lines in the memory core, respectively. An interface circuit in the slave die is decoupled from the first and second metal layers. | 03-06-2014 |
20140175264 | Pixel Structure and Reset Scheme - An image sensor that includes a pixel array with image pixels with conditional reset circuitry. The pixels can be reset by a combination of row select and column reset signals, which implements the reset function while minimizing the number of extra signal lines. The pixels may also include pinned photodiodes. The manner in which the pinned photodiodes are used reduces noise and allows the quantization of the pixel circuits to be programmable. | 06-26-2014 |
20140219008 | Semiconductor Memory Device with Hierarchical Bitlines - A dynamic random access memory (DRAM) device has a hierarchical bitline structure with local bitlines and global bitlines formed on different metal layers. The local bitlines are separated into a plurality of local bitline sections, and bitline isolation switches are configured to connect or disconnect the local bitline sections to or from the global bitlines. As a result, the local bitlines with higher per-length capacitance can be made shorter, since the global bitline with lower per-length capacitance is used to route the signal from the cell capacitances of the memory cells to the remote sense amplifiers. | 08-07-2014 |
20140289574 | DRAM RETENTION TEST METHOD FOR DYNAMIC ERROR CORRECTION - A method of operation in an integrated circuit (IC) memory device is disclosed. The method includes refreshing a first group of storage rows in the IC memory device at a first refresh rate. A retention time for each of the rows is tested. The testing for a given row under test includes refreshing at a second refresh rate that is slower than the first refresh rate. The testing is interruptible based on an access request for data stored in the given row under test. | 09-25-2014 |
20140301151 | DISTRIBUTED SUB-PAGE SELECTION - Described are dynamic, random-access memories (DRAM) architectures and methods for subdividing memory activation into fractions of a page. Circuitry in support of sub-page activation is placed in the intersections of local wordline drivers and sense-amplifier stripes to allow independent control of adjacent arrays of memory cells without significant area overhead. | 10-09-2014 |
20140376324 | TESTING THROUGH-SILICON-VIAS - Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TS V to at least one of a test input and a test evaluation circuit. | 12-25-2014 |
20150033044 | Methods and Circuits for Dynamically Scaling DRAM Power and Performance - A memory system supports high-performance and low-power modes. The memory system includes a memory core and a core interface. The memory core employs core supply voltages that remain the same in both modes. Supply voltages and signaling rates for the core interface may be scaled down to save power. Level shifters between the memory core and core interface level shift signals as needed to accommodate the signaling voltages used by the core interface in the different modes. | 01-29-2015 |
20150070544 | OVERSAMPLED IMAGE SENSOR WITH CONDITIONAL PIXEL READOUT - In a pixel array within an integrated-circuit image sensor, each of a plurality of pixels is evaluated to determine whether charge integrated within the pixel in response to incident light exceeds a first threshold. N-bit digital samples corresponding to the charge integrated within at least a subset of the plurality of pixels are generated, and then applied to a lookup table to retrieve respective M-bit digital values (M being less than N), wherein a stepwise range of charge integration levels represented by possible states of the M-bit digital values extends upward from a starting charge integration level that is determined based on the first threshold. | 03-12-2015 |
20150103605 | DRAM SENSE AMPLIFIER THAT SUPPORTS LOW MEMORY-CELL CAPACITANCE - The disclosed embodiments provide a sense amplifier for a dynamic random-access memory (DRAM). This sense amplifier includes a bit line to be coupled to a cell to be sensed in the DRAM, and a complement bit line which carries a complement of a signal on the bit line. The sense amplifier also includes a p-type field-effect transistor (PFET) pair comprising cross-coupled PFETs that selectively couple either the bit line or the complement bit line to a high bit-line voltage. The sense amplifier additionally includes an n-type field effect transistor (NFET) pair comprising cross-coupled NFETs that selectively couple either the bit line or the complement bit line to ground. This NFET pair is lightly doped to provide a low threshold-voltage mismatch between NFETs in the NFET pair. In one variation, the gate material for the NFETs is selected to have a work function that compensates for a negative threshold voltage in the NFETs which results from the light substrate doping. In another variation, the sense amplifier additionally includes a cross-coupled pair of latching NFETs. These latching NFETs are normally doped and are configured to latch the voltage on the bit line after the lightly doped NFETs finish sensing the voltage on the bit line. | 04-16-2015 |
20150201142 | Image sensor with threshold-based output encoding - In a pixel array within an integrated-circuit image sensor, each of a plurality of pixels is evaluated to determine whether charge integrated within the pixel in response to incident light exceeds a first threshold. N-bit digital samples corresponding to the charge integrated within at least a subset of the plurality of pixels are generated, and then applied to a lookup table to retrieve respective M-bit digital values (M being less than N), wherein a stepwise range of charge integration levels represented by possible states of the M-bit digital values extends upward from a starting charge integration level that is determined based on the first threshold. | 07-16-2015 |
20150229859 | FEEDTHROUGH-COMPENSATED IMAGE SENSOR - A control pulse is generated a first control signal line coupled to a transfer gate of a pixel to enable photocharge accumulated within a photosensitive element of the pixel to be transferred to a floating diffusion node, the first control signal line having a capacitive coupling to the floating diffusion node. A feedthrough compensation pulse is generated on a second signal line of the pixel array that also has a capacitive coupling to the floating diffusion node. The feedthrough compensation pulse is generated with a pulse polarity opposite the pulse polarity of the control pulse and is timed to coincide with the control pulse such that capacitive feedthrough of the control pulse to the floating diffusion node is reduced. | 08-13-2015 |
20150234707 | Error Correction In A Memory Device - A dynamic random access memory (DRAM) array is configured for selective repair and error correction of a subset of the array. Error-correcting code (ECC) is provided to a selected subset of the array to protect a row or partial row of memory cells where one or more weak memory cells are detected. By adding a sense amplifier stripe to the edge of the memory array, the adjacent edge segment of the array is employed to store ECC information associated with the protected subsets of the array. Bit replacement is also applied to defective memory cells. By implementing ECC selectively rather than to the entire array, integrity of the memory array is maintained at minimal cost to the array in terms of area and energy consumption. | 08-20-2015 |
20150281613 | CONDITIONAL-RESET, MULTI-BIT READ-OUT IMAGE SENSOR - An image sensor architecture with multi-bit sampling is implemented within an image sensor system. A pixel signal produced in response to light incident upon a photosensitive element is converted to a multiple-bit digital value representative of the pixel signal. If the pixel signal exceeds a sampling threshold, the photosensitive element is reset. During an image capture period, digital values associated with pixel signals that exceed a sampling threshold are accumulated into image data. | 10-01-2015 |
20150348613 | Multi-Die DRAM Banks Arrangement and Wiring - The various embodiments described herein include memory dies and methods for memory die communications. In one aspect, a method is performed at a first memory die with a plurality of memory banks and a plurality of contacts. The method includes: (1) coupling a first memory bank of the plurality of memory banks to a second memory die via the plurality of contacts; (2) transmitting data between the first memory bank and the second memory die via the plurality of contacts; and (3) receiving a control signal to couple a second memory bank of the plurality of memory banks to the second memory die. The method further includes, in response to receiving the control signal, coupling the second memory bank to the second memory die via the plurality of contacts; and transmitting data between the second memory bank and the second memory die via the plurality of contacts. | 12-03-2015 |