Vincent
Adrien Vincent, Plan D'Orgon FR
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20150060006 | REGENERATOR WITH COMPOSITE INSULATING WALL - The present invention relates to a regenerator comprising a bed of energy storage media placed in a chamber, the chamber comprising a shell and an insulating layer placed between said shell and said energy storage media, the insulating layer comprising a structure defining a plurality of cavities, each cavity having a volume greater than 5 cm | 03-05-2015 |
Anita Lind Vincent, Jerome, ID US
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20140322797 | Method for Removing Endotoxin from Proteins - Disclosed is a method for removing endotoxin from proteins. Also disclosed are products made by using the method. The method may be used, for example, to produce endotoxin-free lactoferrin. Bovine milk-derived lactoferrin may be produced in commercial quantities by the method, and endotoxin-free bovine lactoferrin may be used for a variety of therapeutic uses, including improving wound healing. | 10-30-2014 |
Anne-Marie Vincent, Les Bons Villers BE
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20100310496 | METHOD OF PRODUCING AMINO ACID-MODIFIED ORGANOPOLYSILOXANE EMULSIONS - The present invention relates to an amino acid-modified organopolysiloxane emulsion obtainable by reacting (a) a carboxy-unprotected amino acid, and (b) organopolysiloxane having an epoxy group in the molecule in an aqueous medium in the presence of a surfactant, is incorporated in a cosmetic product. The present invention also relates to the simple and highly efficient production of emulsions of amino acid-modified polysiloxane, as well as the use of the emulsions as beautifying components. | 12-09-2010 |
20110150818 | Silicone-Organic Hybrid Emulsions In Personal Care Applications - Personal care compositions containing silicone polymer and organic polymer containing alloy and/or hybrid emulsions are disclosed. The silicone organic hybrid emulsions are particularly useful in hair care formulations to simultaneously provide conditioning and styling benefits. The silicone organic hybrid emulsions are also useful in color cosmetic formulations to provide shine and wash-off resistance benefits. | 06-23-2011 |
20150190516 | Aqueous Silicone Dispersions And Films And Their Preparation - An aqueous dispersion, useful for forming a film, comprises a silicone composition dispersed in an aqueous phase. The silicone composition comprises a product of a reaction of (a) an alkenyl-containing organopolysiloxane having an average per molecule of at least 2 alkenyl groups and (b) an Si H containing siloxane having an average per molecule of at least 2 Si H moieties. The dispersion also comprises a hydrosilylation catalyst and polyvinyl alcohol. The composition is stabilised in dispersion form by the polyvinyl alcohol dissolved in the aqueous phase. The dispersion is an effective method of delivering a pharmaceutically or cosmetically active ingredient by topical application. | 07-09-2015 |
Benjamin Vincent, Leuven BE
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20140020619 | Method for Growing a Monocrystalline Tin-Containing Semiconductor Material - Disclosed are methods for growing Sn-containing semiconductor materials. In some embodiments, an example method includes providing a substrate in a chemical vapor deposition (CVD) reactor, and providing a semiconductor material precursor, a Sn precursor, and a carrier gas in the CVD reactor. The method further includes epitaxially growing a Sn-containing semiconductor material on the substrate, where the Sn precursor comprises tin tetrachloride (SnCl | 01-23-2014 |
20140024204 | Method for Selective Growth of Highly Doped Group IV - Sn Semiconductor Materials - Disclosed are methods for selective deposition of doped Group IV-Sn materials. In some embodiments, the method includes providing a patterned substrate comprising at least a first region and a second region, where the first region includes an exposed first semiconductor material and the second region includes an exposed insulator material, and performing at least two cycles of a grow-etch cyclic process. Each cycle includes depositing a doped Group IV-Tin (Sn) layer, where depositing the doped Group IV-Sn layer includes providing a Group IV precursor, a Sn precursor, and a dopant precursor, and using an etch gas to etch back the deposited doped Group IV-Sn layer. | 01-23-2014 |
Benjamin Vincent, Ixelles BE
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20090170295 | MANUFACTURING METHOD FOR A SEMI-CONDUCTOR ON INSULATOR SUBSTRATE COMPRISING A LOCALISED Ge ENRICHED STEP - The invention relates to a manufacturing method of a semi-conductor on insulator substrate from an SOI substrate comprising a surface layer of silicon on an electrically insulating layer, called buried insulating layer, wherein a layer of Si | 07-02-2009 |
20100068869 | METHOD FOR FABRICATING A MICRO-ELECTRONIC DEVICE EQUIPPED WITH SEMI-CONDUCTOR ZONES ON AN INSULATOR WITH A HORIZONTAL GE CONCENTRATION GRADIENT - A method for the realization of a microelectronic device which includes at least one semi-conductor zone which rests on a support and which exhibits a Germanium concentration gradient in a direction parallel to the principal plane of the support, | 03-18-2010 |
Benjamin Vincent, Elsene BE
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20120175741 | Method for Direct Deposition of a Germanium Layer - The present disclosure is related to a method for the deposition of a continuous layer of germanium on a substrate by chemical vapor deposition. According to the disclosure, a mixture of a non-reactive carrier gas and a higher order germanium precursor gas, i.e. of higher order than germane (GeH | 07-12-2012 |
20120184088 | Method for Selective Deposition of a Semiconductor Material - A method for selective deposition of semiconductor materials in semiconductor processing is disclosed. In some embodiments, the method includes providing a patterned substrate comprising a first region and a second region, where the first region comprises an exposed first semiconductor material and the second region comprise an exposed insulator material. The method further includes selectively providing a film of the second semiconductor material on the first semiconductor material of the first region by providing a precursor of a second semiconductor material, a carrier gas that is not reactive with chlorine compounds, and tin-tetrachloride (SnCl | 07-19-2012 |
20130233238 | Methods and Mask Structures for Substantially Defect-Free Epitaxial Growth - Disclosed are methods and mask structures for epitaxially growing substantially defect-free semiconductor material. In some embodiments, the method may comprise providing a substrate comprising a first crystalline material, where the first crystalline material has a first lattice constant; providing a mask structure on the substrate, where the mask structure comprises a first level comprising a first opening extending through the first level (where a bottom of the first opening comprises the substrate), and a second level on top of the first level, where the second level comprises a plurality of second trenches positioned at a non-zero angle with respect to the first opening. The method may further comprise epitaxially growing a second crystalline material on the bottom of the first opening, where the second crystalline material has a second lattice constant different than the first lattice constant and defects in the second crystalline material are trapped in the first opening. | 09-12-2013 |
Brian J. Vincent, Essex Junction, VT US
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20140359383 | ADDRESS WINDOWING FOR AT-SPEED BITMAPPING WITH MEMORY BUILT-IN SELF-TEST - Integrated circuits with memory built-in self-test (BIST) logic and methods of testing using the same are disclosed. The method includes setting an address window for locating defects in a memory array. The method further includes comparing output data of the memory array to expected data to determine that a defect exists at location “M” in the memory array within the address window. The method further includes storing, in registers, the address M and a resultant bit fail vector associated with the location “M” of the defect found in the memory array. The method further includes resetting the registers to a null value and resetting the address window with a new minimum and maximum address pair, to compare the output data of the memory array to the expected data within the reset address window which excludes address M. | 12-04-2014 |
Célien Vincent, Gennevilliers FR
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20160006585 | CONTINUOUS PHASE MODULATION METHOD AND EMITTER IMPLEMENTING SAID METHOD - A continuous phase modulation method comprises the following steps: receiving a sequence of digital data symbols a(n) to be emitted; transforming the sequence of symbols a(n) to be emitted into a transformed sequence of symbols b(n), each symbol b(n) of which is equal to the sum of a symbol a(n) to be emitted and of a corrective factor equal to a transformation Tf applied to a plurality of differences (a(n)-a(n−1)) between two consecutive symbols to be emitted, the transformation Tf applied being a combination c of at least two differences between two consecutive symbols of the sequence to be emitted, transformed by the application of a non-linear function ƒ; filtering the sequence of transformed symbols b(n) with a shaping filter and modulating the filtered sequence with a phase modulator; said transformation Tf being defined so as to minimize interference between modulated symbols filtered by a receiving filter. | 01-07-2016 |
Christian Jean-Gabriel Vincent, Fonsorbes FR
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20160109510 | TEST BOARD SUPPORT PLATFORM FOR SUPPORTING A TEST BOARD - The invention provides a test board support platform for supporting a test board during tests, the platform comprising a heat conductive interface arranged to contact a bottom side of the test board at a first side of the heat conductive interface. The support platform also comprises a thermal conditioner coupled to a second side of the heat conductive interface, the second side being opposite the first side. By using this test board support platform a test board can be supported and thermally controlled in a way so that a DUT positioned on the test board can be probed from above, while the temperature is controlled from below. | 04-21-2016 |
Claude Vincent, Bordeaux FR
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20140287057 | DIETARY PRODUCT INTENDED FOR THE PREVENTION OF CARDIOMETABOLIC RISK - A dietary product for preventing cardiometabolic risk in humans, in particular for reducing visceral fat and deep subcutaneous fat, includes in particular a mixture of: a whey hydrolysate having a molecular weight of between 200 and 10,000 daltons, an isolate and/or concentrate of whey, and calcium caseinate. | 09-25-2014 |
20140308369 | DIETARY PRODUCT INTENDED TO REDUCE VISCERAL FAT DURING THE PRE-OPERATIVE PHASE PRIOR TO BARIATRIC SURGERY - An orally administered dietary product intended to reduce an obese person's visceral fat during the pre-operative phase prior to bariatric surgery, the product includes in particular a mixture of: a whey hydrolysate having a molecular weight of between 200 and 10,000 daltons, an isolate and/or a concentrate of whey, and calcium caseinate. | 10-16-2014 |
20160114002 | COMPOSITIONS COMPRISING PLANT PROTEINS AND METHODS FOR PREVENTION OF METABOLIC AND CARDIOVASCULAR PATHOLOGIES IN PATIENT WITH CARDIOMETABOLIC RISK, INCLUDING HYPERGLYCEMIA - A composition for oral administration in humans comprising at least one plant protein chosen from pea proteins, rice proteins or a mixture thereof, and: | 04-28-2016 |
Darin Charles Vincent, Salt Lake City, UT US
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20140276462 | MULTIPLE-USE INTRAVENOUS CATHETER ASSEMBLY SEPTUM AND SEPTUM ACTUATOR - The present invention relates to a multiple-use intravenous (IV) catheter assembly septum and septum actuator. In particular, the present invention relates to an IV catheter assembly having a stationary septum actuator and a blood control septum, wherein the blood control septum is configured to slide within a catheter adapter of the IV catheter assembly between a compressed state and an uncompressed state. When in the compressed state, a slit of the blood control septum is opened and the septum comprises stored compressive potential energy. When the septum is released from the compressed state, the stored compressive potential energy is release and the blood control septum is restored to its original shape, thereby closing the septum's slit. | 09-18-2014 |
Darlene Vincent, Rincon, GA US
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20160031453 | TANK CAR HEATING DEVICE AND METHOD - A tank car heating device is provided, which comprises a heat exchanger configured to insert through an entry point, e.g., a manway, of a tank car in communication with a heat source. | 02-04-2016 |
Darrell L. Vincent, Oklahoma City, OK US
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20160101491 | Apparatus and Method for Assembling, Measuring, and Monitoring Integrity of Mechanical Pipe Joints - Processes and systems for preparing pipe for machine processing to form pin and box ends for assembly into pipelines using mechanical press-fit pipe joints that are fully measured and documented during both manufacturing and assembly. Installed pipelines include pipeline data monitoring systems coupled to a pipeline data management center for receiving, archiving, and analysis of the data records to aid in administration, operation and management, and troubleshooting of pipelines. | 04-14-2016 |
Denis Vincent, Neuchatel CH
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20140305164 | TIMEPIECE OR PIECE OF JEWELLERY MADE OF GOLD - A timepiece or piece of jewellery made of a nickel free and cobalt free gold alloy, the composition of which includes by weight between 75% and 77.5% gold, between 1.2 and 1.6% palladium, and between 20.1 and 23.8% copper. | 10-16-2014 |
20160138134 | PALLADIUM-BASED ALLOY - A palladium-based alloy including, expressed in weight, between 50 and 55% of palladium, between 45% and 50% of rhodium; a quantity x of silver where 0%≦x≦5%, and a quantity R of a balance including at least one element selected from among iridium, ruthenium, platinum, titanium, zirconium and rhenium and combinations thereof, where 0%≦R≦5%. The invention also relates to a A timepiece or piece of jewellery including at least one component made of such an alloy. | 05-19-2016 |
Emmanuel Vincent, St-Imier CH
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20120073712 | MACHINABLE COPPER-BASED ALLOY AND METHOD FOR PRODUCING THE SAME - Alloy containing between 1% and 20% by weight of Ni, between 1% and 20% by weight of Sn, between 0.5%, 3% by weight of Pb in Cu which represents at least 50% by weight of the alloy; characterized in that the alloy further contains between 0.01% and 5% by weight of P or B alone or in combination. The invention also pertains to a metallic product having enhanced mechanical resistance at intermediate temperatures (300° C. to 700° C.) and excellent machinability. The metallic product of the invention can be advantageously used for the fabrication of connectors, electromechanical, or micromechanical pieces. | 03-29-2012 |
Eric Vincent, Angers FR
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20140238912 | DIALYSIS MACHINE INCLUDING ULTRAFILTRATION AND BACKFILTRATION MEANS - A dialysis machine includes a dialyzer ( | 08-28-2014 |
20150110655 | LINEAR PERISTALTIC PUMP - A peristaltic pump ( | 04-23-2015 |
Francois Vincent, Cugy CH
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20110228269 | Apparatus and Methods for Optical Emission Spectroscopy - The invention provides a spark generator for generating a spark for optical emission spectroscopy (OES), wherein the spark has a current waveform comprising a first modulated portion which comprises a plurality of relatively high current and high gradient peaks of variable amplitude and/or inter-peak duration and a second modulated portion of relatively low current and low gradient which is substantially without modulated peaks. The spark is preferably generated from two or more programmable current sources. The invention also provides an optical emission spectrometer comprising the spark generator and a method of optical emission spectroscopy using the spark generator. | 09-22-2011 |
Francois Vincent, Le Cheylas FR
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20140239941 | SYSTEM FOR MEASURING ELECTRIC POWER, TRANSFORMER SUBSTATION COMPRISING ONE SUCH SYSTEM AND METHOD FOR MEASURING ELECTRIC POWER WITH SUCH A SYSTEM - A system to measure electrical energy of current in a secondary electrical conductor connected to a primary electrical conductor, the primary and secondary conductors having substantially same voltage. The system includes a primary module including an emitter and a unit for measuring voltage of the primary conductor, at least one secondary module including a receiver, an intensity sensor of current in the secondary conductor, and a unit for calculating energy of the current. The primary module compresses the measured voltage value and emits, to each secondary module, a first message containing the compressed measured voltage value. A time synchronization mechanism performs time synchronization of each intensity sensor with the voltage measuring unit. The calculating unit is connected to the receiver and can calculate energy from the measured voltage and intensity values. | 08-28-2014 |
20150070026 | METHOD FOR DETERMINING A CAUSE OF A VOLTAGE OUTAGE LOAD-SIDE FROM A CIRCUIT BREAKER, AUXILIARY UNIT FOR A CIRCUIT BREAKER, ELECTRIC SYSTEM COMPRISING A CIRCUIT BREAKER AND ONE SUCH AUXILIARY UNIT - In this method, the voltage outage load-side is an opening of the circuit breaker, and the circuit breaker is able to interrupt the flow of electric current in an electric connection including an electric conductor. The auxiliary unit comprises a current sensor for measuring the intensity of the current flowing in the electric conductor and a first detection means for detecting the voltage outage load-side from the circuit breaker. The method comprises the following steps: measuring the intensity of the current flowing in the electric conductor, detecting the voltage outage load-side from the electric circuit breaker, determining a cause of the detected voltage outage load-side from the circuit breaker, said cause being selected from the group consisting in: an electric overload, a short-circuit and a voltage drop. | 03-12-2015 |
20150077122 | SAFETY DEVICE AND METHOD FOR AN ELECTRIC INSTALLATION - The invention relates to a safety device ( | 03-19-2015 |
Graeme Vincent, New South Wales AU
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20110266713 | METHOD OF ENCAPSULATION OF A FLEXIBLE COMPONENT - A method of encapsulation of a flexible component having a preferred shape and dimensions including a void within the flexible component is disclosed. The method includes at least partially encapsulating the flexible component in a first mould using a curable material which shrinks in volume as it cures distorting the flexible component. The method includes an additional step of at least partially encapsulating the flexible component in a second mould using a curable material at a pressure so as to at least fill and expand unoccupied volume of the void such that the flexible component substantially conforms to the preferred shape and preferred dimensions of the flexible component. The flexible component may be of shape memory material. The method can be used to encapsulate medical devices which include a flexible component such as a coil/wire antenna such that the encapsulated medical device can be inserted into a human or animal body whilst achieving a preferred shape and configuration of the flexible component such as a coil antenna. | 11-03-2011 |
Graeme Vincent, Strathfield AU
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20140163626 | IMPLANTABLE DEVICE MIGRATION CONTROL - Devices and methods are disclosed for a stimulator unit in a medical device, such as an implantable component of a cochlear implant. In embodiments, the stimulator unit comprises a bottom wall configured to be substantially contacting a temporal bone of a recipient, and a top wall positioned opposite the bottom wall, wherein a cross section of the stimulator unit has an outer profile substantially parallel to the bottom wall and the top wall. | 06-12-2014 |
Heather Vincent, Carrboro, NC US
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20150087545 | DETECTION OF METHICILLIN-RESISTANT STAPHYLOCOCCUS AUREUS IN BIOLOGICAL SAMPLES - Disclosed are methods of identifying a methicillin-resistant | 03-26-2015 |
Herve Vincent, Alcobendas ES
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20110089591 | Methods and Systems for Manufacturing Composite Parts - Methods and apparatuses for manufacturing a composite part are provided. One method includes cutting a material into a plurality of pieces and marking each of the plurality of pieces of material with a unique indicium. This method also includes placing one of the pieces of material in a mold cavity, detecting a signal from the indicium on the piece of material, and verifying that the piece of material was placed in the mold cavity in the correct location based on the signal from the indicium. The placing, detecting, and verifying steps are performed for each of the plurality of pieces of material. The pieces of material are then molded together to form the composite part. | 04-21-2011 |
Ignatius Vincent, Nagercoil IN
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20090275402 | INFORMATION DISTRIBUTION IN GAMING NETWORKS - Patron information generated at an originating gaming property may be transmitted to a requesting gaming property based on a set of permissions associated with a group of gaming properties. Vouchers generated at a first gaming property may also be redeemed at a second gaming property. | 11-05-2009 |
Jacques Vincent, Toulouse FR
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20160134211 | VENTILATEUR COMPORTANT UN DISPOSITIF DE TRANSFORMATION D'UN COURANT ELECTRIQUE TRIPHASE - A fan, characterized in that the conversion device ( | 05-12-2016 |
Jan Vincent, Stockholm SE
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20100330000 | ENZYMES FOR TREATMENT OF GINGIVITIS - The invention relates to a method for treating, controlling and/or preventing diseases of the oral cavity, particularly diseases and disorders induced accumulation of plaque, by administering a chewing gum composition comprising at least one krill enzyme. Specifically, the invention is directed to a method for preventing, treating and controlling the development of gingivitis, gum disease and symptoms thereof using a composition having a krill enzyme concentration of about 0.005 U/g to about 0.05 U/g of the chewing gum composition. | 12-30-2010 |
20110135625 | CONTROLLED RELEASE ENZYMATIC COMPOSITION AND METHODS OF USE - The invention relates to an enzyme-containing gel composition capable of controlling enzymatic release and increasing the enzymatic activity level. When the composition includes at least one enzyme derived from Antarctic krill, it is efficient in cleansing wounds and accelerating healing, achieved in significant part by a glycol and/or glycerol gel capable of sustaining enzymatic release and/or enzymatic activity. The krill enzyme-containing gel may also be used to correct skin disorders, sterilize instruments, and facilitate transplants and treating fungal infections, bacterial infections, parasitic infections, hemorrhoids, corneal scarring, dental plaque, acne, cystic fibrosis, blood clots, immune disorders, autoimmune diseases and cancer. | 06-09-2011 |
20150093369 | MIXTURE OF ENZYMES FROM ANTARCTIC KRILL FOR USE IN THE REMOVAL OF A BIOFILM - The invention concerns a mixture of enzymes from krill for use in the treatment of a soft tissue including epithelial tissue and mucosa on which soft tissue a biofilm has formed or is expected to form, which soft tissue is a soft tissue of a mammal and which treatment comprises the removal of the biofilm or preventing a formation of the biofilm. | 04-02-2015 |
Jim Vincent, Wichita, KS US
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20140184911 | SCREEN TIME CONTROL DEVICE AND METHOD - A screen time control device includes a source interface for receiving a video signal, a processor connected to the video source interface for overlaying the video signal with a translucent signal to produce an overlaid video signal, and a device interface connected to the processor for receiving the overlaid video signal and providing the overlaid video signal to the display device. The processor substitutes the translucent signal in the overlaid video signal with a parental signal, where the parental signal can be a substantially opaque overlay signal that masks an image on the screen of the display device to prohibit viewing of the screen, a textual message, or a combination of both. | 07-03-2014 |
John B. Vincent, Tuscaloosa, AL US
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20130330422 | METHODS FOR INCREASING INSULIN SENSITIVITY AND TREATING DIABETES WITH A BIOACTIVE CHROMIUM BINDING PEPTIDE - Disclosed are methods and compositions related to increasing insulin sensitivity and treating diabetes. | 12-12-2013 |
John H. Vincent, Hillsboro, OR US
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20160063480 | METHODS AND ARRANGEMENTS TO COMPLETE ONLINE TRANSACTIONS - Logic to perform a point of sale (POS) transaction as Card Present. Logic may communicate with a web site of an online vendor to process a payment to the online vendor as a certified POS device. Logic may communicate with a payment service provider associated with the online vendor to process the payment in response to communicating with the web site. Logic may interact with a card reader to obtain a packet to process the payment with a payment instrument to verify the presence of the payment instrument. Logic may encrypt communications to transmit an authorization request to the payment service provider to process the payment with encrypted communications via a secure element agent of the certified POS device, the authorization request to comprise the packet to verify that the payment instrument is present for the transaction. And logic may receive an approval of the authorization request for the payment. | 03-03-2016 |
John Paul Vincent, Boksburg ZA
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20100320654 | TAP HOLE PLUG GUN - The embodiments of the invention relate to a tap hole plug gun for metallurgical furnaces, having a pressure cylinder for receiving the plugging compound, which has a closable filling opening for the plugging compound, and having a plugging piston for pressing the plugging compound out from a mouthpiece of the pressure cylinder pressed against the tap hole of a furnace. The pivotable safety flap for closing the filling opening of the pressure cylinder for the plugging compound is equipped with a stop, which is pivoted into the cylinder chamber of the pressure cylinder upon opening of the flap to decelerate an unintentional forward stroke of the plugging piston for pre-compression and expulsion of the plugging compound, and is pivoted out of the cylinder chamber upon closing of the safety flap. | 12-23-2010 |
Julia Vincent, Aachen DE
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20160002100 | PANE WITH THERMAL RADIATION REFLECTING COATING - The present invention relates to a pane with thermal radiation reflecting coating, comprising a substrate ( | 01-07-2016 |
Karen Vincent, Basel CH
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20130064823 | COMPOSITIONS AND METHODS OF USE FOR THERAPEUTIC LOW DENSITY LIPOPROTEIN - RELATED PROTEIN 6 (LRP6) MULTIVALENT ANTIBODIES - The present disclosure relates to an antibody or antigen binding fragment having at least two receptor binding do mains for two different binding sites of LRP6 and compositions and methods of use thereof. | 03-14-2013 |
Kenneth Blaine Vincent, Fairmont, WV US
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20150239098 | Scaffold Workstation Tool - A scaffold workstation tool is provided that provides hands-free support of a work piece from a vertical member of a scaffolding tower. The tool comprises a vice tool that can clamp a work piece between a support surface and a movable jaw, whereby the vice is supported by an elongated member terminating at an attachment end. The attachment end is adapted to secure to a vertical member of a scaffold tower, which is a vertical post generally having a rounded profile. Two embodiments of the attachment end are contemplated: a cup-lock attachment and a clamp attachment. Both embodiments support the tool in a horizontal condition such that work pieces can be supported by the vise for the user to operate thereon without using hands to support the same. | 08-27-2015 |
Laith Anthony Vincent, Charlottesville, VA US
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20130305517 | CAPTURED THREADED CONNECTOR SYSTEM AND METHOD FOR MECHANICALLY COUPLING COMPONENTS - Systems and methods for mechanically coupling multiple components using captured threaded connectors are provided. The attachment points between components are aligned along a common central axis about which the channels are aligned. Threaded connectors are provided and contained within a pocket within each component, prior to assembly of the system. As a result, components of the system can be detached without disassembly of other components, or without the use of special thread patterns to allow clearance for the driver for the head of each. Threaded connectors are kept from falling out and are also allowed to float along their axis within the channel so that components can be aligned first, and then anchored together. Drivers used to couple components have a diameter smaller than the channel. | 11-21-2013 |
20140078673 | HEAT TRANSFER ASSEMBLY WITH HEAT PIPE BRACE AND METHOD FOR ASSEMBLING A HEAT TRANSFER ASSEMBLY - An electronics device and method for assembling a heat transfer assembly of the same. An electronics device includes a circuit board, a chassis that houses the circuit board, a heat pipe configured to transfer heat from the circuit board to a wall of the chassis, and a brace configured to press the heat pipe against the wall. A brace includes a medial portion configured to contact a heat pipe and an end portion including a protrusion that is configured to be received in a depression of a chassis. | 03-20-2014 |
Lars Vincent, Upplands Vasby SE
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20140221522 | COATING FOR SUBSTRATE - There is provided inter alia a substrate with a surface having a hydrophilic coating comprising a cross-linked copolymer of components A and B, and optional components C and D; wherein | 08-07-2014 |
Laurent Vincent, La Ville Du Bois FR
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20150056622 | EDITING PROFILING OF PDE8A PRE -MRNA: USE AS SPECIFIC BIOMARKER OF ADARS ACTIVITIES IN HUMAN TISSUES TO DIAGNOSE AND TO PREDICT AND ASSESS THERAPEUTIC EFFICACY AND/OR EFFICIENCY OR POTENTIAL DRUG SIDE EFFECTS - The present invention relates to the use of the editing profile of PDE8A pre-mRNA as a specific bio marker of ADARs activities in evolved primate, particularly in Human tissues. The present invention also relates to an in vitro method for predicting in Human an alteration of the mechanism of the ADARs catalysed pre-mRNA editing of target genes, by analysing the PDE8A pre-mRNA editing profile in a peripheral tissue sample containing cells expressing said PDE8A pre-mRNA, such as blood sample. The present invention is also directed to an in vitro method for the screening of potential therapeutic compound and to predict and assess therapeutic efficacy and/or efficiency or to diagnose potential severe brain or peripheral drug side effects implementing said PDE8A pre-mRNA editing profile as specific biomarker. The present invention is further directed to a method for determining the PDE8A pre-mRNA editing profile in Human, particularly by capillary electrophoresis single-strand conformation polymorphism (CE-SSCP) method after amplification by a nested PCR. Finally the invention relates to particular nucleic acid primers implemented in said nested PCR and kit comprising such sets of primers and human cells capable of expressing PDE8A and ADARs. | 02-26-2015 |
Loïc Vincent, Paris FR
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20140275078 | COMPOSITIONS AND METHODS FOR TREATING CANCER USING PI3KB INHIBITOR AND MAPK PATHWAY INHIBITOR, INCLUDING MEK AND RAF INHIBITORS - The present invention relates to compositions comprising at least one MAPK pathway inhibitor including MEK and RAF inhibitors and at least one PI3Kβ inhibitor, and also to uses thereof for the treatment of cancer. | 09-18-2014 |
Loïc Vincent, Venlssieux FR
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20100007461 | METHOD FOR PASSIVE KEYLESS ENTRY OF A MOTOR VEHICLE ESPECIALLY OF AN INDUSTRIAL VEHICLE - A vehicle unlocking sequence includes passively authenticating a vehicle user, granting the authenticated vehicle user access to the vehicle and setting the vehicle main switch into an on-state. A vehicle locking sequence includes passively authenticating the vehicle user, configuring the vehicle, upon a first action from the authenticated vehicle user, into a first locking mode whereby access to the vehicle is denied to a non authenticated user, or configuring the vehicle, upon a second action from the authenticated vehicle user, into a second locking mode whereby access to the vehicle is denied to a non authenticated user and the vehicle main switch is set into an off-state. | 01-14-2010 |
Mason Vincent, Charlotte, NC US
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20130181405 | Method of Conducting a Racing Series - A method of conducting a racing series for competitors and team owners is disclosed. The racing series has a plurality of races divided into a first and second set of races with competitors racing in both sets of races. The competitors and team owners are awarded points after each race, with those points being adjusted between the two sets of races. The points of only a predetermined number of competitors and/or team owners are adjusted between the sets of races. Awards, including a championship, are awarded based on the points accumulated during the racing series. | 07-18-2013 |
Matt Vincent, Tampa, FL US
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20150058996 | Gap Services Router (GSR) - A gap services router (GSR) that is a drop-in replacement of an end of life Cisco™ 2811 integrated services router (ISR). The GSR is a routing, switching, and computing platform that provides a technology refresh in the same form factor as the legacy 2811 router. The GSR is one rack unit in size and comprises the latest routing and switching technology from Cisco™, preferably a Cisco™ 5915 embedded services router (ESR) and a Cisco™ embedded services 2020 switch. The GSR contains two WAN ports and twenty-five LAN ports, with power over ethernet capability on all ports. The GSR also optionally includes an embedded server module capable of running the latest virtualization technology. An embedded server module in the GSR includes a removable solid state drive (SSD) that is zeroed upon removal. The GSR is preferably used to replace 2811 ISRs integrated in deployed military equipment. | 02-26-2015 |
Matthew Vincent, Chesterfield, MO US
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20130216671 | CONTAINER CLOSURE - A crown system includes a crown having a top surface and a bottom surface and a liner having a top surface that contacts a bottom surface of the crown. The liner is configured to absorb oxygen in a headspace and includes at least about 2.2 micromoles of sodium sulfite per cubic millimeter in a volume of the liner to a depth of about 0.003 millimeter from a bottom surface of the liner. | 08-22-2013 |
20160107811 | BEVERAGE CONTAINER SEALING SYSTEM - A system for sealing a beverage container includes a crown defining a bottom surface. A liner that includes an oxygen scavenger is coupled to the crown such that a top surface of the liner contacts the bottom surface of the crown. The bottom surface of the liner supports printed indicia where the bottom surface of the liner and the printed indicia are exposed to a beverage contained in the beverage container. | 04-21-2016 |
Matthew Vincent, Auckland NZ
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20090043733 | SYSTEMS AND METHODS FOR EFFICIENTLY STORING, RETRIEVING AND QUERYING DATA STRUCTURES IN A RELATIONAL DATABASE SYSTEM - A database system is disclosed. The database system includes a common data repository, a document indexing database and a query engine. The common data repository is configured to store data in a common data table and is associated with a data object. The document indexing database is configured to store a data structure model that is associated with a unique document type. The data structure model is configured to facilitate retrieval of data stored in the common data table. The query engine is communicatively linked to the document indexing database and the common data repository. The query engine is configured to use the data structure model to retrieve data from the common data table. | 02-12-2009 |
Matthew J.t. Vincent, Saginaw, MI US
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20140251059 | STEERING COLUMN ROLL STRAP - In an exemplary embodiment of the invention, an energy absorbing device for a steering column assembly is provided. The device includes a first end configured to couple to a first component of the steering column assembly, a second end configured to couple to a second component of the steering column, and an intermediate portion extending between the first and second ends. The intermediate portion includes a curved portion having a radius, and an aperture extending through the intermediate portion. The aperture is configured to shift a collapse characteristic of the energy absorbing device and to facilitate maintaining the radius constant when a force moves the first end relative to the second end and deforms the energy absorbing device. | 09-11-2014 |
Michael Vincent, Providence, RI US
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20140330969 | System and Method for As Needed Connection Escalation - A method includes selecting a first connection between a connection manager and a managed system, the first connection being associated with a first privilege level, communicating by the connection manager a first command to the managed system via the first connection, determining that a second command is executable on the managed system using a connection that is associated with a second privilege level, the second privilege level being a lower privilege level than the first privilege level, selecting a second connection between the connection manager and the managed system, the second connection being associated with the second privilege level, and communicating, by the connection manager, the second command to the managed system via the second connection. | 11-06-2014 |
20140331049 | Secure Shell Authentication - A first information handling system receives a security challenge and forwards it to a second information handling system. The second information handling system retrieves a private key from a public/private encryption key pair and satisfies the challenge with the private key. The second information handling system forwards the satisfied challenge without divulging the private key. The second information handling system is in a more secure environment than the first information handling system. The challenge may be satisfied by signing the challenge with the private key. Satisfying the challenge may be a step in creating a secure shell connection between the first information handling system and an organization maintaining the first information handling system and the second information handling system. | 11-06-2014 |
Michael B. Vincent, Chandler, AZ US
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20130215583 | Embedded Electrical Component Surface Interconnect - An electrical component package is disclosed comprising: an electrical component having an embedded surface, a structure attached to the electrical component opposite the embedded surface, a conductive adhesive directly attached to the embedded surface, where the conductive adhesive is shaped to taper away from the embedded surface, and an encapsulation material covering the conductive adhesive and the electrical component. In various embodiments, the tapered conductive adhesive facilitates the securing of the conductive adhesive to the electrical component by the encapsulation material. Also disclosed are various methods of forming an electrical component package having a single interface conductive interconnection on the embedded surface. The conductive interconnection is configured to maintain an interconnection while under stress forces. Further disclosed in a method of applied a conductive adhesive that enables design flexibility regarding the shape and depth of the conductive interconnection. | 08-22-2013 |
20140054783 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - Methods for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging a plurality of microelectronic device panels in a panel stack. Each microelectronic device panel contains plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are created in the panel stack exposing the plurality of package edge conductors, and a plurality of sidewall conductors is formed interconnecting different ones of the package edge conductors exposed through the trenches. The panel stack is then separated into a plurality of stacked microelectronic packages each including at least two microelectronic devices electrically interconnected by at least one of the plurality of sidewall conductors included within the stacked microelectronic package. | 02-27-2014 |
20140054796 | STACKED MICROELECTRONIC PACKAGES HAVING PATTERENED SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of a stacked microelectronic package. In one embodiment, the method includes arranging microelectronic device panels in a panel stack. Each microelectronic device panel includes a plurality of microelectronic devices and a plurality of package edge conductors extending therefrom. Trenches are formed in the panel stack exposing the plurality of package edge conductors. An electrically-conductive material is deposited into the trenches and contacts the plurality of package edge conductors exposed therethrough. The panel stack is then separated into partially-completed stacked microelectronic packages. For at least one of the partially-completed stacked microelectronic packages, selected portions of the electrically-conductive material are removed to define a plurality of patterned sidewall conductors interconnecting the microelectronic devices included within the stacked microelectronic package. | 02-27-2014 |
20140054797 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of stacked microelectronic packages. In one embodiment, the method includes producing a partially-completed stacked microelectronic package including a package body having a vertical package sidewall, a plurality microelectronic devices embedded within the package body, and package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the vertical package sidewall. A flowable conductive material is applied on the vertical package sidewall and contacts the package edge conductors. Selected portions of the flowable conductive material are then removed to define, at least in part, electrically-isolated sidewall conductors electrically coupled to different ones of the package edge conductors. | 02-27-2014 |
20140070415 | MICROELECTRONIC PACKAGES HAVING TRENCH VIAS AND METHODS FOR THE MANUFACTURE THEREOF - Embodiments of a microelectronic package including at least one trench via are provided, as are embodiments of a method for fabricating such a microelectronic package. In one embodiment, the method includes the step of depositing a dielectric layer over a first microelectronic device having a plurality of contact pads, which are covered by the dielectric layer. A trench via is formed in the dielectric layer to expose the plurality of contact pads therethrough. The trench via is formed to include opposing crenulated sidewalls having a plurality of recesses therein. The plurality of contact pads exposed through the trench via are then sputter etched. A plurality of interconnect lines is formed over the dielectric layer, each of which is electrically coupled to a different one of the plurality of contact pads. | 03-13-2014 |
20140264945 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - A stacked microelectronic package can comprise a package body having an external vertical package sidewall, a plurality of microelectronic devices embedded within the package body, and package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the external vertical package sidewall. A cavity is formed on an external surface of the package body between a first one of the package edge conductors and a second one of the package edge conductors. Electrically conductive material is in the cavity and in electrical contact with a first and a second one of the package edge conductors, wherein the conductive material in the cavity is within planform dimensions of the microelectronic package. | 09-18-2014 |
20140353840 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - A method for fabricating a stacked microelectronic device includes attaching a first package layer to a second package layer to form stacked microelectronic layers. Saw streets of the first package layer overlie and are aligned with saw streets of the second package layer. The first and second package layers include respective edge connectors formed between the saw streets and electronic components in the first and second package layers. A through package via is formed in one of the saw streets of the first and second package layers. The via is filled with conductive material. The stacked package layers are singulated along the saw streets in a manner that retains a portion of the conductive material to form a sidewall connector between at least two of the edge connectors. | 12-04-2014 |
20150092372 | DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PARALLEL CONDUCTORS AND INTRA-CONDUCTOR ISOLATOR STRUCTURES AND METHODS OF THEIR FABRICATION - Embodiments of devices and methods of their manufacture include coupling first and second package surface conductors to a package surface with an intra-conductor insulating structure between the package surface conductors. The package surface conductors extend between and electrically couple sets of pads that are exposed at the package surface. Elongated portions of the package surface conductors are parallel with and adjacent to each other. The intra-conductor insulating structure is coupled between the package surface conductors along an entirety of the parallel and adjacent elongated portions, and the intra-conductor insulating structure electrically insulates the elongated portions of the package surface conductors from each other. Some embodiments may be implemented in conjunction with a stacked microelectronic package that includes sidewall conductors and an intra-conductor insulating structure between and electrically insulating the sidewall conductors from each other. | 04-02-2015 |
20150092377 | DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION - Embodiments of methods for forming microelectronic device packages include forming a trench on a surface of a package body between exposed ends of first and second device-to-edge conductors, and forming a package surface conductor in the trench to electrically couple the first and second device-to-edge conductors. In one embodiment, the package surface conductor is formed by first forming a conductive material layer over the package surface, where the conductive material layer substantially fills the trench, and subsequently removing portions of the conductive material layer from the package surface adjacent to the trench. In another embodiment, the package surface conductor is formed by dispensing one or more conductive materials in the trench between the first and second exposed ends (e.g., using a technique such as spraying, inkjet printing, aerosol jet printing, stencil printing, or needle dispense). Excess conductive material may then be removed from the package surface adjacent to the trench. | 04-02-2015 |
20150108661 | MICROELECTRONIC PACKAGES CONTAINING STACKED MICROELECTRONIC DEVICES AND METHODS FOR THE FABRICATION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes encapsulating a device stack within a molded panel having a frontside and a backside. The device stack contains an upper semiconductor die and an interconnect buffer layer, which is formed over the upper semiconductor die and which is covered by the frontside of the molded panel. Material is removed from the frontside the molded panel to expose the interconnect buffer layer therethrough. One or more frontside redistribution layers are produced over the frontside of the molded panel and electrically coupled to the upper semiconductor die through the interconnect buffer layer. The molded panel is then singulated to yield a microelectronic package including a molded package body containing the device stack. | 04-23-2015 |
20150115454 | MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND METHODS FOR THE MANUFACTURE THEREOF - Microelectronic packages having layered interconnect structures are provided, as are methods for the fabrication thereof. In one embodiment, the method includes forming a first plurality of interconnect lines in ohmic contact with a first bond pad row provided on a semiconductor. A dielectric layer is deposited over the first plurality of interconnect lines, the first bond pad row, and a second bond pad row adjacent the first bond pad row. A trench via is then formed in the dielectric layer to expose at least the second bond pad row therethrough. A second plurality of interconnect lines is formed in ohmic contact with the second bond pad row within the trench via. The second plurality of interconnect lines extends over the first bond pad row and is electrically isolated therefrom by the dielectric layer to produce at least a portion of the layered interconnect structure. | 04-30-2015 |
20150162309 | DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION - Embodiments of methods for forming a device include performing an oxidation inhibiting treatment to exposed ends of first and second device-to-edge conductors, and forming a package surface conductor to electrically couple the exposed ends of the first and second device-to-edge conductors. Performing the oxidation inhibiting treatment may include applying an organic solderability protectant coating to the exposed ends, or plating the exposed ends with a conductive plating material. The method may further include applying a conformal protective coating over the package surface conductor. An embodiment of a device formed using such a method includes a package body, the first and second device-to-edge conductors, the package surface conductor on a surface of the package body and extending between the first and second device-to-edge conductors, and the conformal protective coating over the package surface conductor. | 06-11-2015 |
20150162310 | DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND ADJACENT TRENCHES AND METHODS OF THEIR FABRICATION - Embodiments of methods for forming microelectronic device packages include forming a trench on a surface of a package body in an area adjacent to where first and second package surface conductors will be (or have been) formed on both sides of the trench. The method also includes forming the first and second package surface conductors to electrically couple exposed ends of various combinations of device-to-edge conductors. The trench may be formed using laser cutting, drilling, sawing, etching, or another suitable technique. The package surface conductors may be formed by dispensing (e.g., coating, spraying, inkjet printing, aerosol jet printing, stencil printing, or needle dispensing) one or more conductive materials on the package body surface between the exposed ends of the device-to-edge conductors. | 06-11-2015 |
20150243635 | STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF - Embodiments of a method for fabricating stacked microelectronic packages are provided, as are embodiments of stacked microelectronic packages. In one embodiment, the method includes producing a partially-completed stacked microelectronic package including a package body having a vertical package sidewall, a plurality microelectronic devices embedded within the package body, and package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the vertical package sidewall. A flowable conductive material is applied on the vertical package sidewall and contacts the package edge conductors. Selected portions of the flowable conductive material are then removed to define, at least in part, electrically-isolated sidewall conductors electrically coupled to different ones of the package edge conductors. | 08-27-2015 |
20150262931 | MICROELECTRONIC PACKAGES HAVING MOLD-EMBEDDED TRACES AND METHODS FOR THE PRODUCTION THEREOF - Methods for fabricating microelectronic packages, such as Fan-Out Wafer Level Packages, and microelectronic packages are provided. In one embodiment, the method includes placing a first semiconductor die on a temporary substrate, forming an electrically-conducive trace in contact with at least one of the first semiconductor die and the temporary substrate, and encapsulating the first semiconductor die and the electrically-conductive trace within a molded panel. The temporary substrate is removed to reveal a frontside of the molded panel through which the electrically-conducive trace is at least partially exposed. At least one redistribution layer is formed over the frontside of the molded panel, the at least one redistribution layer comprises an interconnect line in ohmic contact with the electrically-conducive trace. | 09-17-2015 |
20150270233 | WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES HAVING DELAMINATION-RESISTANT REDISTRIBUTION LAYERS - Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers are provided. In one embodiment, the method includes building inner redistribution layers over a semiconductor die. Inner redistribution layers include a body of dielectric material containing metal routing features. A routing-free dielectric block is formed in the body of dielectric material and is uninterrupted by the metal routing features. An outer redistribution layer is produced over the inner redistribution layers and contains a metal plane, which is patterned to include one or more outgassing openings overlying the routing-free dielectric block. The routing-free dielectric block has a minimum width, length, and depth each at least twice the thickness of the outer redistribution layer. | 09-24-2015 |
20150348865 | MICROELECTRONIC PACKAGES HAVING SIDEWALL-DEPOSITED HEAT SPREADER STRUCTURES AND METHODS FOR THE FABRICATION THEREOF - Microelectronic packages and methods for producing microelectronic packages having sidewall-deposited heat spreader structures are provided. In one embodiment, the method includes providing a package body containing a microelectronic device. A heat spreader structure is printed or otherwise formed over at least one sidewall of the package body. The heat spreader structure is thermally coupled to the microelectronic device and is configured to dissipate heat generated thereby during operation of the microelectronic package. | 12-03-2015 |
20150380386 | MICROELECTRONIC PACKAGES HAVING EMBEDDED SIDEWALL SUBSTRATES AND METHODS FOR THE PRODUCING THEREOF - Methods for fabricating microelectronic packages and microelectronic packages are provided. In one embodiment, the microelectronic package fabrication method includes producing a molded panel containing a sidewall substrate. The molded panel is singulated to produce a Fan-Out Wafer Level Package core including a molded body having a fan-out region in which the sidewall substrate is embedded. A side connect trace is printed or otherwise formed on a sidewall of the Fan-Out Wafer Level Package core and extends at least partially across the embedded sidewall substrate. | 12-31-2015 |
20160005628 | WAFER LEVEL PACKAGING METHOD AND INTEGRATED ELECTRONIC PACKAGE - A wafer level packaging method entails providing electronic devices and providing a platform structure having cavities extending through the platform structure. The platform structure is mounted to a temporary support. One or more electronic devices are placed in the cavities with an active side of each electronic device facing the temporary support. The platform structure and the electronic devices are encapsulated in an encapsulation material to produce a panel assembly. Redistribution layers may be formed over the panel assembly, after which the panel assembly may be separated into a plurality of integrated electronic packages. The platform structure may be formed from a semiconductor material, and platform segments within each package provide a fan-out region for conductive interconnects, as well as provide a platform for a metallization layer and/or for forming through silicon vias. | 01-07-2016 |
20160073496 | FAN-OUT WAFER LEVEL PACKAGES HAVING PREFORMED EMBEDDED GROUND PLANE CONNECTIONS AND METHODS FOR THE FABRICATION THEREOF - Fan-Out Wafer Level Packages (FO-WLPs) and methods for fabricating FO-WLPs having Embedded Ground Plane (EGP) connections are provided. In one embodiment, the method includes forming a molded panel around an EGP array from which a plurality of preformed EGP connections project. One or more Redistribution Layers (RDLs) are produced over the molded panel. The molded panel is then singulated to yield a plurality of FO-WLPs each including a molded package body containing an EGP from the EGP array and one or more of preformed EGP connections. | 03-10-2016 |
20160099212 | Through Package Circuit in Fan-Out Wafer Level Package - A method and apparatus are provided for manufacturing a packaged electronic device ( | 04-07-2016 |
20160133608 | DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION - Embodiments of methods for forming a device include performing an oxidation inhibiting treatment to exposed ends of first and second device-to-edge conductors, and forming a package surface conductor to electrically couple the exposed ends of the first and second device-to-edge conductors. Performing the oxidation inhibiting treatment may include applying an organic solderability protectant coating to the exposed ends, or plating the exposed ends with a conductive plating material. The method may further include applying a conformal protective coating over the package surface conductor. An embodiment of a device formed using such a method includes a package body, the first and second device-to-edge conductors, the package surface conductor on a surface of the package body and extending between the first and second device-to-edge conductors, and the conformal protective coating over the package surface conductor. | 05-12-2016 |
Nadine Vincent, Injoux-Genissiat FR
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20150275290 | NON-INVASIVE METHOD FOR DETECTING A FETAL CHROMOSOMAL ANEUPLOIDY - The invention relates to a method for obtaining a set of reference samples and/or a set of reference parameters for the diagnosis of fetal aneuploidy from a maternal biological sample, containing cell-free DNA, said method comprising:—extracting cell-free DNA from a set of biological samples obtained from euploid pregnant women carrying a euploid fetus;—after the extraction step, analyzing the size distribution of the DNA molecules within each sample and selecting a set of samples based on the size distribution of the DNA molecules within said samples;—performing a massively parallel sequencing of DNA of each size-selected sample;—mapping the obtained sequences to the human genome for each sample;—calculating a set of reference parameters, wherein each reference parameter is indicative of the number of unique exact sequences mapped to a chromosome or chromosomal region of interest for each sample;—obtaining a set of reference samples and/or a set of reference parameters. | 10-01-2015 |
Paul Vincent, Paris FR
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20150240429 | PAVEMENT FOR VEHICLES AND PEDESTRIANS - A pavement for vehicles and pedestrians, which is formed by a conventional foundation of stones and sand on which there are placed parallel alignments of elongate construction elements having an upper part and a lower part that are connected together by a narrowed intermediate part, the space between the narrowed parts of two adjacent alignments being filled with soil or compost in which a decorative plant is planted and a mechanism being arranged to achieve the regularity of the spacing between the alignments and the stability thereof. | 08-27-2015 |
Paul Vincent, Oberstdorf DE
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20130189728 | Identification of pathogens in body fluids - Identification of infectious pathogens, particularly viruses, bacteria and other microorganisms is effected with a method whereby pathogens of acute infections can be identified, without first culturing them in external nutrient media, by mass spectrometric measurement of their protein profiles obtained from pathogens directly precipitated from body fluid into pellets by centrifuging. With this method, pathogens which cause acute infections can be identified in less than one hour. | 07-25-2013 |
Paul Reuben Vincent, Hyderabad IN
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20160119116 | Symbol Boundary Detection - A symbol boundary in a data packet having a guard interval preceding a preamble having a predetermined sequence of symbols is detected by receiving a signal representing a data packet; sampling the received signal at a sampling rate; estimating channel impulse responses from a set of samples in dependence on the predetermined sequence of symbols of the preamble; determining an energy value for each of a plurality of windows of channel impulse responses, each of the windows corresponding to W number of consecutive samples, the energy value for each of the windows being indicative of the total energy associated with the channel impulse responses of that window; determining which of the windows has the greatest energy value; and identifying the earliest sample of the consecutive W samples in said determined greatest energy window, the earliest sample being indicative of a symbol boundary for the preamble. | 04-28-2016 |
Paul Reuben Vincent, Trichy IN
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20090323511 | Combined OFDMA Preamble Index Identification, Integer Frequency Offset Estimation, and Preamble CINR Measurement - A wireless signal processor for use in identifying a maximum Carrier to Noise Interference Ratio (CINR) associated with a plurality of received OFDMA subcarriers has a candidate generator for forming a plurality of candidate values from a particular set of received subcarriers by forming candidate values based on the received subcarriers in combination with possible integer preamble offsets and possible preamble values. A candidate evaluator selects which of the possible preamble values and integer frequency offset values have the maximum CINR, and provides the maximum CINR with IFO and preamble index as outputs. | 12-31-2009 |
Paul Ruben Vincent, Trichy IN
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20090323512 | Combined OFDMA Preamble Index Identification, Integer Frequency Offset Estimation, and Preamble CINR Measurement - A wireless signal processor for use in identifying a maximum Carrier to Noise Interference Ratio (CINR) associated with a plurality of received OFDMA subcarriers has a candidate generator for forming a plurality of candidate values from a particular set of received subcarriers by forming candidate values based on the received subcarriers in combination with possible integer preamble offsets and possible preamble values. A candidate evaluator selects which of the possible preamble values and integer frequency offset values have the maximum CINR, and provides the maximum CINR with IFO and preamble index as outputs. | 12-31-2009 |
Peter Vincent, Hagersten US
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20130184080 | METHOD OF CONTROLLING AN UPDATE OF GAME CODE IN A GAMING SYSTEM - Methods of controlling migration to new version game code during an active game session are disclosed. In an embodiment, new version game code is received at a game server. In response to receipt of a game request from a gaming client at a gaming server, the current version code an active game session is employing is determined. The active gaming session is migrated to the new version code if the new version code is compatible. The migration to be performed is controlled by a reconnect if the new version code contains a new sub-component related to the client. Also, related gaming servers, gaming systems, methods of controlling game code updates in gaming systems, and game version distribution controllers are disclosed. | 07-18-2013 |
Peter Vincent, Hagersten SE
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20090075736 | Method Of Controlling An Update Of Game Code In A Gaming System - Methods of controlling migration to new version game code during an active game session are disclosed. In an embodiment, new version game code is received at a game server. In response to receipt of a game request from a gaining client at a gaming server, the current version code an active game session is employing is determined. The active gaming session is migrated to the new version code if the new version code is compatible. The migration to be performed is controlled by a reconnect if the new version code contains a new sub-component related to the client. Also, related gaming servers, gaining systems, methods of controlling game code updates in gaming systems, and game version distribution controllers are disclosed. | 03-19-2009 |
20090131174 | Game Session Management - A computerized gaming system operates a plurality of gaming machine terminals coupled to a gaming server. A game session is initiated by a player for one gaming machine terminal. The game player thereafter identifies a second gaming machine terminal to be coupled to the same game session. | 05-21-2009 |
20120172135 | Gaming System - A method and a system for operating a gaming application in a computer based gaming system having a client gaming machine connected to a gaming server, wherein: a client module of a game application program is executed in the client gaming machine; game parameters are determined in response to player input signals and dependent on logical rules for the game defined in said client module; a server module of said game application program is executed in the gaming server in response to said game parameters being communicated to said server module; outcome parameters are determined depended on conditions for the game defined in said server module, dependent on said communicated game parameters and dependent on a random number generated in the gaming server. | 07-05-2012 |
20140045598 | Game Session Management - A computerized gaming system operates a plurality of gaming machine terminals coupled to a gaming server. A game session is initiated by a player for one gaming machine terminal. The game player thereafter identifies a second gaming machine terminal to be coupled to the same game session. | 02-13-2014 |
Peter Vincent, Magersten SE
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20100087255 | GAMING SYSTEM - A method and a system for operating a gaming application in a computer based gaming system having a client gaming machine connected to a gaming server, wherein: a client module of a game application program is executed in the client gaming machine; game parameters are determined in response to player input signals and dependent on logical rules for the game defined in said client module; a server module of said game application program is executed in the gaming server in response to said game parameters being communicated to said server module; outcome parameters are determined depended on conditions for the game defined in said server module, dependent on said communicated game parameters and dependent on a random number generated in the gaming server. | 04-08-2010 |
20100151934 | GAMING INTERRUPTION AND RECONNECTION MANAGEMENT - A method, system and computer program product for managing interruption and reconnection of a game session in a computer based gaming system having a computerized gaming machine devised for executing a game and being communicatively connected to a remote data storage, wherein: the execution of a game comprises at least one instance of determining a set of associated game session data; an identity code is reserved for identification of each execution instance of a game; each determined set of associated game session data is associated with said identity code and stored in the remote data storage; and if an interruption occurs in the execution of a game, then the identity code for the current game execution instance is associated with a status indicator indicating that said game execution has been interrupted. | 06-17-2010 |
Ramzi Vincent, Owings Mills, MD US
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20150060898 | METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS - A method for bonding an LED assembly | 03-05-2015 |
Ronald J. Vincent, East Amherst, NY US
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20140093413 | COMPRESSOR ASSEMBLY HAVING OIL SEPARATION FEATURE - A compressor assembly for compressing a working fluid and lubricated with an oil, including a housing having a suction plenum and a discharge plenum that defines a discharge chamber and an exhaust chamber in fluid communication through a discharge chamber outlet, and a compression mechanism disposed in the housing. A baffle member proximate the discharge chamber outlet and against which a compressed admixture of working fluid and oil expelled from the discharge chamber is impactable for separating oil from the impacting admixture. The baffle member has an oil-impingement surface for collecting oil separated from the impacting admixture and directing the flow of oil separated from the impacting admixture. Working fluid substantially at a discharge pressure and devoid of the oil collected on the oil-impingement surface is exhaustable from the exhaust chamber through the discharge port. | 04-03-2014 |
Ross Albert Vincent, Auckland NZ
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20090302727 | Storage Unit for Electronic Devices - A storage unit ( | 12-10-2009 |
Sammarco James Vincent, Cincinnati, OH US
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20130150903 | DEVICES AND METHODS FOR BONE FIXATION USING AXIAL IMPLANTS - The invention comprises a method for fixating bones in the foot by aligning the bones in their desired position, inserting a screw in the aligned bones, inserting at least one transverse element near the head or tip of the screw, and tightening the screw to compress the bones. The screw comprises a shaft having first and second ends with spirally wound screw threads beginning near the first end and extending along the shaft. Advantageously, the screw is cannulated and screw threads are formed on an interior surface of the cannulation. Illustratively, the transverse elements may be staples, open-ended washers, or open-ended nuts. Reduction instruments and drill guides used in the invention are also disclosed. | 06-13-2013 |
Stéphane Vincent, Hyon BE
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20140024576 | HEPTOSE DERIVATIVES FOR USE IN THE TREATMENT OF BACTERIAL INFECTIONS - Compounds having the general formula (I) pharmaceutical compositions containing them for use in inhibiting bacterial heptose biosynthesis and thereby lowering or suppressing bacterial virulence. | 01-23-2014 |
Stephen M. Vincent, Portland, OR US
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20150332212 | METHOD OF PROVIDING DIGITAL CONTENT FOR USERS OF PHYSICAL ITEMS - Systems, apparatuses, and methods are provided for enhancing users' overall experiences with physical items by supplementing their physical experiences with digital experiences. According to an embodiment, a user uses an electronic device to scan a smart tag associated with an item to obtain an item identifier of the item. The electronic device sends the item identifier to a server, which selects digital content related to the item. | 11-19-2015 |
20150334201 | METHOD OF PROVIDING DIGITAL CONTENT FOR USERS OF PHYSICAL ITEMS - Systems, apparatuses, and methods are provided for enhancing users' overall experiences with physical items by supplementing their physical experiences with digital experiences. According to an embodiment, an electronic device scans a smart tag associated with an item to obtain an item identifier of the item, and sends the item identifier to a server, which selects digital content to be made available to a user of the item. | 11-19-2015 |
Thibault Vincent, Rueil Malmaison FR
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20150202075 | INTRABUCCAL DEVICE COMPRISING BITE TRAYS AND CONNECTING RODS - Bite trays ( | 07-23-2015 |
Thomas Vincent, Atlanta, GA US
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20150360861 | Lawn and Leaf Pocket Bag - A lawn and leaf bag that converts into a bag and pocket configuration or bin that allows user to rake or sweep leaves or yard debris directly into bag and pocket configuration without having to manually place leaves into bag by hand. The lawn and leaf bag is converted into a bag and pocket configuration by placing the bag on the ground on its side with the side opening facing upward or skyward and by then folding the left and right bag walls downward at an angle and pulling them outward to form sidewalls, back wall and floor of the bag and pocket configuration. After creating the bag and pocket configuration the user then sweeps or rakes leaves or debris into the configuration and once filled the configuration is then sealed and placed upright for disposal. | 12-17-2015 |
Valentin Vincent, Toulouse FR
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20140343760 | METHOD AND DEVICE FOR AUTOMATICALLY DETERMINING AN OPTIMIZED APPROACH AND/OR DESCENT PROFILE - A method and device for automatically determining an optimised approach and/or descent profile for an aircraft are provided. The device comprises means for optimising an approach and/or descent profile of an aircraft avoiding long and steep geometric segments, the device to this end inserting an idle segment, if it satisfies the restrictions, in the profile relating to the descent phase and/or to the approach phase, wherein said idle segment can be followed by a geometric segment. | 11-20-2014 |
20140343766 | METHOD AND DEVICE FOR AUTOMATICALLY DETERMINING AN OPTIMIZED APPROACH PROFILE FOR AN AIRCRAFT - Method and device for automatically determining an optimized approach profile for an aircraft. The device provides for a flexible configuration change speed which is not limited to the standard single predetermined configuration change speed in order to prevent segments which are not authorized, in particular segments which are too steep, the following configuration (Ci+1) being able to be maintained during a configuration change in an upstream direction until the corresponding speed profile reaches a maximum speed. | 11-20-2014 |
20150308834 | Method and system for adjusting the descent trajectory of an aircraft - A system comprising an adjustment unit installed in an aircraft and configured to adjust a descent trajectory and associated prediction calculations as a function of an adjustment parameter. The system comprises information processing units for automatically calculating, on the ground and from recorded flight data, an effective value of a calculation parameter, and a corresponding theoretical value of the calculation parameter, with the help of an auxiliary performance database which is identical to a performance database installed in the aircraft, for identical flight conditions, and for deriving therefrom the adjustment parameter that will be used subsequently by the adjustment unit. | 10-29-2015 |
Villeret Vincent, Wannebecq BE
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20110136823 | COMPOUNDS HAVING A POTENTIATING EFFECT ON THE ACTIVITY OF ETHIONAMIDE AND USES THEREOF - The present invention relates to the use of compounds with a potentiating effect on the activity of antibiotics that are activatable via the EthA enzymatic pathway, for the preparation of a medicament for preventing and/or treating mycobacterial infections such as tuberculosis and leprosy, to pharmaceutical compositions comprising them in combination with an antibiotic that is activatable via the EthA pathway, to compounds having a potentiating effect on the activity of antibiotics that are activatable via the EthA enzymatic pathway, to pharmaceutical compositions comprising them and to their use as medicaments, especially medicaments for preventing and/or treating mycobacterial infections such as tuberculosis and leprosy. | 06-09-2011 |