Patent application number | Description | Published |
20090240459 | INDENTIFYING SEQUENTIAL FUNCTIONAL PATHS FOR IC TESTING METHODS AND SYSTEM - A method and system of identifying sequential functional paths for IC testing methods are disclosed. In one embodiment, a method may include a method of sequential functional path identification for at-speed structural test, the method comprising: using a timing tool to enumerate a plurality of critical paths in a circuit; identifying which of the plurality of critical paths are sequential functional paths that will function during functional operation of the IC by identifying which of the plurality of critical paths a test can be generated for using a test sequence having n functional capture cycles, where n is greater than 2; performing path test generation for the sequential functional paths using launch-off-scan test sequences; and performing path test generation for critical paths not tested by the launch-of-scan test sequences, using launch-off-capture test sequences having two functional captures. | 09-24-2009 |
20090241124 | ONLINE MULTIPROCESSOR SYSTEM RELIABILITY DEFECT TESTING - A multiprocessor system comprising a plurality of processors is disclosed. The plurality of processors includes a first processor including first monitor on-chip and a second processor including a including a second monitor on-chip. The first monitor on-chip is configured to measure load on the second processor and the second monitor on-chip is configured to measure load on the first processor. The first monitor on-chip is configured to cause the second monitor on-chip to perform a self-test on the second processor if the load on the second processor is below a second processor load threshold value and the second monitor on-chip is configured to cause the first monitor on-chip to perform a self-test on the first processor if the load on the first processor is below first processor load threshold value. | 09-24-2009 |
20090265677 | INTEGRATED TEST WAVEFORM GENERATOR (TWG) AND CUSTOMER WAVEFORM GENERATOR (CWG), DESIGN STRUCTURE AND METHOD - Disclosed are embodiments of a clock generation circuit, a design structure for the circuit and an associated method that provide deskewing functions and that further provide precise timing for both testing and functional operations. Specifically, the embodiments incorporate a deskewer circuit that is capable of receiving waveform signals from both an external waveform generator and an internal waveform generator. The external waveform generator can generate and supply to the deskewer circuit a pair of waveform signals for functional operations. The internal waveform generator can be uniquely configured with control logic and counter logic for generating and supplying a pair of waveform signals to the deskewer circuit for any one of built-in self-test (BIST) operations, macro-test operations, other test operations or functional operations. The deskewer circuit can selectively gate an input clock signal with the waveform signals from either the external or internal waveform generator in order to generate the required output clock signal. | 10-22-2009 |
20110055650 | Hold Transition Fault Model and Test Generation Method - A method of hold fault modeling and test generation. The method includes first modeling a fast-to-rise and a fast-to-fall hold fault for a plurality of circuit nets. Testing a fast-to-rise hold fault is accomplished by: setting up a logic value on each of the plurality of circuit nodes to 0; transitioning each of the plurality of circuit nodes from 0 to 1 with a single clock pulse; and determining if at least one downstream node was inadvertently impacted by the transitioning from 0 to 1. Testing a fast-to-fall hold is accomplished by: setting up a logic value on each of the plurality circuit nodes to 1; transitioning each of the plurality of circuit nodes from 1 to 0 with a single clock pulse; and determining if at least one downstream node was inadvertently impacted by the transitioning from 1 to 0. | 03-03-2011 |
20120150473 | CLOCK EDGE GROUPING FOR AT-SPEED TEST - A method of grouping clock domains includes: separating a plurality of test clocks into a plurality of domain groups by adding to each respective one of the plurality of domain groups those test clocks that originate from a same clock source and have a unique clock divider ratio; sorting the domain groups in decreasing order of size; and creating a plurality of parts by adding the respective one of the plurality of domain groups to a first one of the plurality of parts in which already present test clocks have a different clock source, and creating a new part and adding the respective one of the plurality of domain groups to the new part when test clocks present in the respective one of the plurality of domain groups originate from a respective same clock source and have a different clock divider ratio as test clocks present in all previously-created parts. | 06-14-2012 |
20120176144 | AT-SPEED SCAN ENABLE SWITCHING CIRCUIT - A circuit for providing a local scan enable signal includes a first transistor having a first gate coupled to a general scan enable signal, a first source and a first drain and a second transistor having a second gate coupled to a scan clock, a second source coupled to the first drain and a second drain. The circuit also includes a third transistor having a third gate coupled to the general scan enable signal, a third drain coupled to the second drain and a third source and an output stabilizer coupled to the second drain, the output stabilizer including a first inverter and a second inverter coupled together in opposite orientations. | 07-12-2012 |
20130080108 | AUTOMATIC GENERATION OF VALID AT-SPEED STRUCTURAL TEST (ASST) TEST GROUPS - A method and system is provided for automatically generating valid at speed structural test (ASST) test groups. The method includes loading a netlist for an integrated circuit into a processor. The method further includes determining a plurality of clock domain crossings between a plurality of clock domains within the integrated circuit. The method further includes generating a first test group. The method further includes adding a first clock domain of the plurality of clock domains to the first test group. The method further includes adding a second clock domain of the plurality of clock domains to the first test group when the second clock domain does not have a clock domain crossing into the first clock domain. | 03-28-2013 |
20130125073 | TEST PATH SELECTION AND TEST PROGRAM GENERATION FOR PERFORMANCE TESTING INTEGRATED CIRCUIT CHIPS - A method of test path selection and test program generation for performance testing integrated circuits. The method includes identifying clock domains having multiple data paths of an integrated circuit design having multiple clock domains; selecting, from the data paths, critical paths for each clock domain of the multiple clock domains; using a computer, for each clock domain of the multiple clock domain, selecting the sensitizable paths of the critical paths; for each clock domain of the multiple clock domain, selecting test paths from the sensitizable critical paths; and using a computer, creating a test program to performance test the test paths | 05-16-2013 |
20130125076 | DISPOSITION OF INTEGRATED CIRCUITS USING PERFORMANCE SORT RING OSCILLATOR AND PERFORMANCE PATH TESTING - A method and system for dispositioning integrated circuit chips. The method includes performing a performance path test on an integrated circuit chip having one or more clock domains, the performance path test based on applying test patterns to selected sensitizable data paths of the integrated circuit chip at different clock frequencies; and dispositioning the integrated circuit chip based on results of the performance path test. | 05-16-2013 |
20130211769 | REDUCING POWER CONSUMPTION DURING MANUFACTURING TEST OF AN INTEGRATED CIRCUIT - Aspects of the invention provide for reducing power consumption during manufacturing testing of an IC. In one embodiment, aspects of the invention include a method for reducing power consumption during a manufacturing test of an integrated circuit (IC), the method including: providing a plurality of domains, each domain associated with a clock phase; grouping, based on each domain, a first plurality of scan chains into a first test group; grouping, based on each domain, a second plurality of scan chains into a second test group, wherein the grouping of the first test group and of the second test group includes determining which domains can be tested simultaneously; and performing the manufacturing test of the IC. | 08-15-2013 |
20140024145 | METHOD AND STRUCTURE FOR MULTI-CORE CHIP PRODUCT TEST AND SELECTIVE VOLTAGE BINNING DISPOSITION - Operating speeds of integrated circuit devices are tested to establish maximum and minimum frequency at maximum and minimum voltage. The devices are sorted into relatively-slow and relatively-fast devices to classify the devices into different voltage bins. A bin-specific voltage limit is established for each of the voltage bins needed for core performance at system use conditions. The bin-specific voltage limit is compared to core minimum chip-level functionality voltage at system maximum and minimum frequency specifications. The method correlates system design evaluation of design maximum and minimum frequency at design maximum and minimum voltage conditions with evaluation of tested maximum and minimum frequency at tested maximum and minimum voltage conditions. A chip-specific functionality voltage limit is established for the device. Initial system voltage for all devices from a voltage bin is set at a greater of the bin-specific voltage limit and the chip-specific functionality voltage limit consistent with the evaluation conditions. | 01-23-2014 |
20140046466 | INTEGRATED CIRCUIT PRODUCT YIELD OPTIMIZATION USING THE RESULTS OF PERFORMANCE PATH TESTING - Disclosed are embodiments of a method, system and computer program product for optimizing integrated circuit product yield by re-centering the manufacturing line and, optionally, adjusting wafer-level chip dispositioning rules based on the results of post-manufacture (e.g., wafer-level or module-level) performance path testing. In the embodiments, a correlation is made between in-line parameter measurements and performance measurements acquired during the post-manufacture performance path testing. Then, based on this correlation, the manufacturing line can be re-centered. Optionally, an additional correlation is made between performance measurements acquired during wafer-level performance testing and performance measurements acquired particularly during module-level performance path testing and, based on this additional correlation, adjustments can be made to the wafer-level chip dispositioning rules to further minimize yield loss. | 02-13-2014 |
20140195995 | SYSTEMS AND METHODS FOR SINGLE CELL PRODUCT PATH DELAY ANALYSIS - Methods and systems for qualifying a single cell with product path delay analysis are provided. A method includes designing a product using a model from an initial test site. The method also includes creating performance path tests for one or more paths on the product. The method further includes measuring performance path parameters of the product. The method includes determining that the measured performance path parameters match predicted performance path parameters. | 07-10-2014 |
20150033199 | SYSTEMS AND METHODS FOR SINGLE CELL PRODUCT PATH DELAY ANALYSIS - Methods and systems for qualifying a single cell with product path delay analysis are provided. A method includes designing a product using a model from an initial test site. The method also includes creating performance path tests for one or more paths on the product. The method further includes measuring performance path parameters of the product. The method includes determining that the measured performance path parameters match predicted performance path parameters. | 01-29-2015 |