Patent application number | Description | Published |
20110193573 | INTEGRATED SENSOR SYSTEM - An integrated sensor system for a lithography machine, the system comprising a projection lens system ( | 08-11-2011 |
20110193574 | CAPACITIVE SENSING SYSTEM - A capacitive sensing system, comprising a sensor having thin film structure, the thin film structure comprising a sensor having a first insulating layer and a first conductive film comprising a sensing electrode formed on a first surface of the first insulating layer and a second conductive film comprising a back guard electrode. The back guard electrode is formed in a single plane and comprises a peripheral portion in the same plane, and is disposed on a second surface of the first insulating layer and a first surface of a second insulating layer or protective layer. The peripheral portion of the back guard electrode extends beyond the sensing electrode to form a side guard electrode which substantially or completely surrounds the sensing electrode. | 08-11-2011 |
20110254565 | CAPACITIVE SENSING SYSTEM WITH DIFFERENTIAL PAIRS - A capacitive sensing system comprising two or more capacitive sensors, one or more AC power sources for energizing the capacitive sensors, and a signal processing circuit for processing signals from the sensors. The sensors are arranged in pairs, wherein the one or more AC power sources are arranged to energize a first sensor of a pair of the sensors with an alternating current or voltage 180 degrees out of phase to a current or voltage for a second sensor of the pair of sensors, and wherein a pair of the sensors provides a measuring unit for a single measured distance value, the signal processing circuit receiving an output signal from each sensor of the pair and generating a measured value related to the average distance between the sensors of the pair and the target. | 10-20-2011 |
20110261344 | EXPOSURE METHOD - A method for exposing a surface of a target in a system comprising a set of sensors ( | 10-27-2011 |
20120249984 | LITHOGRAPHY SYSTEM WITH DIFFERENTIAL INTERFEROMETER MODULE - The invention relates to a lithography system comprising an optical column, a moveable target carrier for displacing a target such as a wafer, and a differential interferometer module, wherein the interferometer module is adapted for emitting three reference beams towards a first mirror and three measurement beams towards a second mirror for determining a displacement between said first and second mirror. In a preferred embodiment the same module is adapted for measuring a relative rotation around two perpendicular axes as well. The present invention further relates to an interferometer module and method for measuring such a displacement and rotations. | 10-04-2012 |
20120250026 | INTERFEROMETER MODULE - The invention relates to a differential interferometer module adapted for measuring a direction of displacement between a reference mirror and a measurement mirror. In an embodiment the differential interferometer module is adapted for emitting three reference beams towards a first mirror and three measurement beams towards a second mirror for determining a displacement between said first and second mirror. In a preferred embodiment the same module is adapted for measuring a relative rotation around two perpendicular axes as well. The present invention further relates to a lithography system comprising such a interferometer module and a method for measuring such a displacement and rotations. | 10-04-2012 |
20120250030 | ALIGNMENT OF AN INTERFEROMETER MODULE FOR USE IN AN EXPOSURE TOOL - The invention relates to alignment of an interferometer module for use in an exposure tool. An alignment method is provided for aligning an interferometer to the tool while outside of the too. Furthermore, the invention provides a dual interferometer module, an alignment frame use in the alignment method, and an exposure tool provided with first mounting surfaces for cooperative engagement with second mounting surfaces of an interferometer module. | 10-04-2012 |
20120267802 | POSITION DETERMINATION IN A LITHOGRAPHY SYSTEM USING A SUBSTRATE HAVING A PARTIALLY REFLECTIVE POSITION MARK - The invention relates to a substrate for use in a lithography system, said substrate being provided with an at least partially reflective position mark comprising an array of structures, the array extending along a longitudinal direction of the mark, characterized in that said structures are arranged for varying a reflection coefficient of the mark along the longitudinal direction, wherein said reflection coefficient is determined for a predetermined wavelength. In an embodiment a specular reflection coefficient varies along the substrate, wherein high order diffractions are substantially absorbed by the substrate. A position of a beam on a substrate can thus be determined based on the intensity of its reflection in the substrate. The invention further relates to a positioning device and lithography system for cooperation with the substrate, and a method of manufacture of the substrate. | 10-25-2012 |
20120268724 | LITHOGRAPHY SYSTEM FOR PROCESSING A TARGET, SUCH AS A WAFER, A METHOD FOR OPERATING A LITHOGRAPHY SYSTEM FOR PROCESSING A TARGET, SUCH AS A WAFER AND A SUBSTRATE FOR USE IN SUCH A LITHOGRAPHY SYSTEM - The invention relates to a lithography system for processing a target, such as a wafer and a substrate for use in such a lithography system. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system arranged for detecting a position mark on a surface. | 10-25-2012 |
20120268725 | LITHOGRAPHY SYSTEM FOR PROCESSING A TARGET, SUCH AS A WAFER, AND A METHOD FOR OPERATING A LITHOGRAPHY SYSTEM FOR PROCESSING A TARGET, SUCH AS A WAFER - The invention relates to a lithography system for processing a target, such as a wafer. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system connected to the final projection system and arranged for detecting a position mark on a surface. | 10-25-2012 |
20120287411 | LITHOGRAPHY SYSTEM FOR PROCESSING AT LEAST A PART OF A TARGET - The invention relates to a lithography system for processing a target, wherein the lithography system comprises a final projection system arranged for projecting a pattern on the target surface. The lithography system comprises a mark position detection system arranged for detecting a position of a position mark on the target surface. The mark position detection system comprises an optical element arranged for projecting a light beam on the target surface and a light detector arranged for detecting a reflected light beam. The optical element may be positioned adjacent to the final projection system and the light detector may be positioned inside a frame. | 11-15-2012 |
20140049276 | CAPACITIVE SENSING SYSTEM - The invention relates to a lithography system. The lithography system has a projection lens system and a capacitive sensing system. The projection lens system is provided with a final projection lens. The capacitive sensing system is arranged for making a measurement related to a distance between the final projection lens and a target. The capacitive sensing system includes at least one capacitive sensor. Additional, the capacitive sensing system is provided with a flexible printed circuit structure and at least one integrated flex print connector. The at least one sensor is located in the flexible printed circuit structure. The flexible printed circuit structure has a flexible base provided with conductive electrodes for the at least one sensor and conductive tracks. The conductive tracks extend from the electrodes along the at least one integrated flex print connector. | 02-20-2014 |
20150109598 | LITHOGRAPHY SYSTEM AND METHOD FOR PROCESSING A TARGET, SUCH AS A WAFER - A method for operating a target processing system for processing a target ( | 04-23-2015 |
20150109601 | CHARGED PARTICLE LITHOGRAPHY SYSTEM WITH ALIGNMENT SENSOR AND BEAM MEASUREMENT SENSOR - A multi-beamlet charged particle beamlet lithography system for transferring a pattern to a surface of a substrate. The system comprises a projection system ( | 04-23-2015 |
20150241200 | MULTI-AXIS DIFFERENTIAL INTERFEROMETER - The invention relates to a multi-axis differential interferometer ( | 08-27-2015 |