Vasoya
Kalu K. Vasoya, Santa Ana, CA US
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20100319969 | LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES - Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes. | 12-23-2010 |
20120097431 | LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES - Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes. | 04-26-2012 |
Kalu K. Vasoya, Huntington Beach, CA US
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20090090465 | PRINTED WIRING BOARD WITH CONDUCTIVE CONSTRAINING CORE INCLUDING RESIN FILLED CHANNELS - Printed wiring boards and methods of manufacturing printed wiring boards are disclosed. In one aspect of the invention, the printed wiring boards include electrically conductive constraining cores having at least one resin filled channel. The resin filled channels perform a variety of functions that can be associated with electrical isolation and increased manufacturing yields. | 04-09-2009 |
Kalu K. Vasoya, Yorba Linda, CA US
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20110272179 | Printed Circuit Board with Embossed Hollow Heatsink Pad - A printed circuit board includes a dielectric layer having a first surface and an opposing second surface and a circuit layer laminated to the first surface of the dielectric layer. Cut-out windows provide openings through the dielectric and circuit layers. A thermally conductive layer is laminated to the second surface of the dielectric layer. The thermally conductive layer includes at least one sinkpad that passes through the cut-out windows. The sinkpad is an embossed, hollow feature of the thermally conductive layer. A surface of the sinkpad may be substantially coplanar with a surface of the circuit layer and be prepared for compatibility with a solder reflow process. A heat generating electronic component may be electrically coupled to the circuit layer and thermally coupled to the sinkpad of the thermally conductive layer to form an electronic assembly. | 11-10-2011 |
Kalu K. Vasoya, Placentia, CA US
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20120241202 | BUILD-UP PRINTED WIRING BOARD SUBSTRATE HAVING A CORE LAYER THAT IS PART OF A CIRCUIT - Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates having a core layer that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole. | 09-27-2012 |
Milan Mohanbhai Vasoya, Baroda IN
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20160081972 | PARENTERAL DOSAGE FORM OF AMIODARONE - The present invention relates to a stable, sterile, ready to administer parenteral dosage form of amiodarone or its pharmaceutically acceptable salt. Particularly, the present invention provides a stable, sterile, ready to administer parenteral dosage form of amiodarone comprising an aqueous solution comprising amiodarone or its pharmaceutically acceptable salt, an acid, and a polyol, wherein the pH of the solution is in the range of about 2.0 to 4.0, wherein the solution is filled in a plastic container and wherein the solution is free of a solubilizer. | 03-24-2016 |
Sanjay Vasoya, Gujarat IN
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20140094604 | NEW INTERMEDIATES AND PROCESSES FOR PREPARING TICAGRELOR - The present invention is related to new intermediates and processes for preparing Ticagrelor disclosed in this patent application. | 04-03-2014 |
Sanjay L. Vasoya, Gujarat IN
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20080242877 | Intermediates and processes for the synthesis of Ramelteon - Provided are intermediates and processes for preparation of Ramelteon. | 10-02-2008 |
20090069581 | PROCESS FOR THE SYNTHESIS OF RAMELTEON AND ITS INTERMEDIATES - The present invention provides processes and intermediates for the synthesis of ramelteon. | 03-12-2009 |
20090281176 | PROCESS FOR THE SYNTHESIS OF RAMELTEON AND ITS INTERMEDIATES - A process for the preparation of ramelteon and intermediates useful in the process. The process suitable for industrial scale provides increased yield and/or greater purity with fewer process steps. | 11-12-2009 |
20100016590 | NILOTINIB INTERMEDIATES AND PREPARATION THEREOF - Intermediates of Nilotinib were prepared, including, for example, 3-(trifluoromethyl-5-(4-methyl-1H-imidazole-1-yl)-benzeneamine; 3-(4-(pyridin-3-yl)pyrimidin-2-ylamino) -4-methylbenzoyl halogen dihydrochloride; and N-(3-Bromo-5-trifluoromethylphenyl)-4-methyl-3-[[4-(3-pyridinyl)-2-pyrimidinyl]amino]benzamide. Nilotinib.3HCl and its crystalline forms are also described. | 01-21-2010 |
20100152468 | PROCESS FOR THE SYNTHESIS OF RAMELTEON AND ITS INTERMEDIATES - The present invention provides processes and intermediates for the synthesis of ramelteon. | 06-17-2010 |
Sanjay Lakhabhai Vasoya, Vadodara IN
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20100249430 | PROCESS FOR PREPARING VALSARTAN - The invention relates to novel compound of formula (IV), which is an organic acid salt of N-[(2′-cyanobipheny1-4-yl)methyl]-(L)-valine ester. This compound is an useful intermediate for process of preparation of Valsartan of formula (I), chemically known as (S)-N-(1-Carboxy-2-methylprop-1-yl)-N-pentanoyl-N-[2′-(1H-terazol-5-yl)biphenyl-4-ylmethyl]amine. This invention also relates to a process for preparing Valsartan using novel intermediate of formula (IV). | 09-30-2010 |