Van Grunsven
Eric Van Grunsven, Someren NL
Patent application number | Description | Published |
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20110156237 | FAN-OUT CHIP SCALE PACKAGE - A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads. | 06-30-2011 |
20130273731 | FAN-OUT CHIP SCALE PACKAGE - A chip scale package has a semiconductor die having an array of die bond pads arranged with a bond pad density per unit area, embedded in a molded die support body having a surface supporting an array of conducting contacts, each of the contacts connected by an electrical lead to a corresponding one of the die bond pads. | 10-17-2013 |
Eric C.e. Van Grunsven, Someren NL
Patent application number | Description | Published |
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20090279575 | CARRIER SUBSTRATE FOR MICRO DEVICE PACKAGING - A carrier substrate ( | 11-12-2009 |
Eric C. E. Van Grunsven, Someren NL
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20090267232 | METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT - An integrated circuit ( | 10-29-2009 |
Eric Cornelis Egbertus Van Grunsven, Eindhoven NL
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20080265348 | Method of Manufacturing an Image Sensor and Image Sensor - A method of manufacturing a back-side ( | 10-30-2008 |
20080278061 | Light Emitting Diode Module - The present invention relates to a LED module ( | 11-13-2008 |
20080298061 | Light Emitting Module and Manufacturing Method - A light emitting module ( | 12-04-2008 |
Eric Cornelis Egbertus Van Grunsven, Someren NL
Patent application number | Description | Published |
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20080280435 | Producing a Covered Through Substrate Via Using a Temporary Cap Layer - The present invention relates to a method for producing a substrate with at least one covered via that electrically and preferably also thermally connects a first substrate side with an opposite second substrate side. The processing involves forming a trench on a the first substrate side remains and covering the trench with a permanent layer on top of a temporary, sacrificial cap-layer, which is decomposed in a thermal process step. The method of the invention provides alternative ways to remove decomposition products of the sacrificial cap-layer material without remaining traces or contamination even in the presence of the permanent layer This is, according to a first aspect of the invention, achieved by providing the substrate trench with an overcoat layer that has holes. The holes in the overcoat layer leave room for the removal of the decomposition products of the cap-layer material. According to the second aspect of the invention, opening the covered trench from the second substrate side and allowing the cap-layer material to be removed through that opening provides a solution. Both methods of the present invention are based on the common idea of using a temporary cap-layer even in a situation where the substrate opening is permanently covered before the removal of the temporary cap-layer | 11-13-2008 |
20110210452 | THROUGH-SUBSTRATE VIA AND REDISTRIBUTION LAYER WITH METAL PASTE - The invention relates to a semiconductor device for use in a stacked configuration of the semiconductor device and a further semiconductor device. The semiconductor device comprises: a substrate ( | 09-01-2011 |
Eric Cornelis Egbertus Van Grunsven, Horst NL
Patent application number | Description | Published |
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20140252405 | LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES - In a wafer bonding process, one or both of two wafer substrates are scored prior to bonding. By creating slots in the substrate, the wafer's characteristics during bonding are similar to that of a thinner wafer, thereby reducing potential warpage due to differences in CTE characteristics associated with each of the wafers. Preferably, the slots are created consistent with the singulation/dicing pattern, so that the slots will not be present in the singulated packages, thereby retaining the structural characteristics of the full-thickness substrates. | 09-11-2014 |
Eric Cornelis Egertus Van Grunsven, Someren NL
Patent application number | Description | Published |
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20100265030 | INDUCTIVE COMPONENTS FOR DC/DC CONVERTERS AND METHODS OF MANUFACTURE THEREOF - An inductive component for a DC/DC converter is made by transferring a copper track ( | 10-21-2010 |