Patent application number | Description | Published |
20120132870 | Indeno-Fused Naphthopyrans Having Ethylenically Unsaturated Groups - The present invention relates to indeno-fused naphthopyrans, and in particular indeno[2′,3′:3,4]naphtho[1,2-b]pyrans having certain groups bonded to the 3, 6, 7, 11, and 13 positions thereof. The indeno-fused naphthopyrans of the present invention have an ethylenically unsaturated group selected from (C | 05-31-2012 |
20120145973 | Photochromic Materials That Include Indeno-Fused Naphthopyrans - The present invention relates to photochromic materials that include one or more indeno-fused naphthopyrans that have particular groups at the 7, 11, and 13 positions thereof, and at the position alpha to the oxygen of the pyran ring thereof. With some embodiments, hydrogen or an alkoxy group is bonded to the 7 position, an optionally substituted phenyl is bonded to the 11 position, two alkyl groups are bonded to the 13 position, and two optionally substituted phenyl groups are bonded to the position alpha to the oxygen of the pyran ring of the indeno-fused naphthopyran compound. The 13 position of the indeno-fused naphthopyrans is free of ether groups in which an ether oxygen is bonded to the 13 position, and hydroxyl. The present invention also relates to photochromic articles and compositions that include such indeno-fused naphthopyrans. | 06-14-2012 |
20120157696 | METHOD OF MAKING INDENO-FUSED NAPHTHOL MATERIALS - The present invention relates to a method of making indeno-fused naphthol materials, that involves, with some embodiments, forming an indanone acid intermediate, which can be represented by the following general Formula V, | 06-21-2012 |
20140364618 | Method of Making Indeno-Fused Naphthol Materials - The present invention relates to a method of making indeno-fused naphthol materials, that involves, with some embodiments, forming an indanone acid intermediate, represented by the following general Formula V, | 12-11-2014 |
Patent application number | Description | Published |
20090032782 | PHOTOCHROMIC MATERIALS HAVING EXTENDED PI-CONJUGATED SYSTEMS AND COMPOSITIONS AND ARTICLES INCLUDING THE SAME - Various non-limiting embodiments disclosed herein relate to photochromic materials having extended pi-conjugated systems, such as an indeno-fused naphthopyran, which comprises a group that extends the pi-conjugated system of the indeno-fused naphthopyran bonded at the 11-position thereof. Further, the photochromic materials according to certain non-limiting embodiments disclosed herein may display hyperchromic absorption of electromagnetic radiation as compared to conventional photochromic materials and/or may have a closed-form absorption spectrum that is bathochromically shifted as compared to conventional photochromic materials. Other non-limiting embodiments relate to photochromic compositions and photochromic articles, such as optical elements, made using the disclosed photochromic materials, and methods of making the same. | 02-05-2009 |
20090072206 | OPHTHALMIC DEVICES COMPRISING PHOTOCHROMIC MATERIALS HAVING EXTENDED PI-CONJUGATED SYSTEMS - Various non-limiting embodiments disclosed herein relate to ophthalmic devices comprising photochromic materials having extended pi-conjugated systems. For example, various non-limiting embodiments disclosed herein provide a photochromic material, such as an indeno-fused naphthopyran, which comprises a group that extends the pi-conjugated system of the indeno-fused naphthopyran bonded at the 11-position of thereof. Further, the photochromic materials according to certain non-limiting embodiments disclosed herein may display hyperchromic absorption of electromagnetic radiation as compared to conventional photochromic materials and/or may have a closed-form absorption spectrum that is bathochromically shifted as compared to conventional photochromic materials. Other non-limiting embodiments relate to methods of making the ophthalmic devices comprising photochromic materials. | 03-19-2009 |
20150241601 | OPHTHALMIC DEVICES COMPRISING PHOTOCHROMIC MATERIALS WITH REACTIVE SUBSTITUENTS - Various non-limiting embodiments of the present disclosure relate to ophthalmic devices comprising photochromic materials comprising a reactive substituent. For example, the present disclosure contemplates ophthalmic devices comprising photochromic materials, such as photochromic naphthopyrans and indeno-fused naphthopyrans having a reactive substituent comprising a reactive moiety linked to the photochromic naphthopyran by one or more linking groups. In certain non-limiting embodiments, the reactive moiety comprises a polymerizable moiety. In other non-limiting embodiments, the reactive moiety comprises a nucleophilic moiety. Other non-limiting embodiments of the present disclosure relate to methods of making the photochromic ophthalmic device, wherein the photochromic ophthalmic devices comprise the photochromic naphthopyrans described herein. | 08-27-2015 |
Patent application number | Description | Published |
20130327864 | JAW ASSEMBLY FOR A DEMOLITION TOOL - A jaw assembly for a demolition tool is disclosed. The jaw assembly comprising at least one seating portion disposed on a second jaw. The seating portion having a slot; and at least one work module removably mounted in the at least one seating portion. The at least one first work module comprises a base; at least one tooth extending from the base; and a mounting element extending from the base in a direction opposite to the at least one tooth and engaging the seating portion. The work module may be replaced when worn out. | 12-12-2013 |
20140231564 | DEMOLITION APPARATUS - A demolition apparatus and an adapter frame of the demolition apparatus are disclosed. The adapter frame may be formed with coupling seats which engage pins on a jaw set to assemble the demolition apparatus. The openings of the coupling seats face different directions for quick and simple assembly of the demolition apparatus. A rotatable locking element may be provided on the adapter frame to lock a pin on the jaw set. | 08-21-2014 |
20150115086 | JAW ASSEMBLY FOR A DEMOLITION TOOL - A jaw assembly for a demolition tool is disclosed. The jaw assembly may have a support portion centrally disposed on a second jaw. The support portion may have a first contact surface and an aperture disposed thereon. A work plate may be mounted on the support portion and may have a plate member in abutting contact with the support portion. The work plate may also have a tooth member and a boss extending in a direction opposite to the tooth member. The boss may be engaged to the aperture. The jaw assembly may have a pair of seating portions disposed on the second jaw, each seating portion having a slot. The jaw assembly may also have a work module mounted in each seating portion. The work module may have a base, a tooth, and a mounting element extending in a direction opposite to the tooth and engaging the seating portion. | 04-30-2015 |
20150144724 | JAW ASSEMBLY FOR A DEMOLITION TOOL - A jaw assembly for a demolition tool is disclosed. The jaw assembly comprises at least one first coupling portion and at least one second coupling portion disposed on a first jaw. The first coupling portion comprises an intermediate contact member and side contact members laterally extending from opposite sides of the intermediate contact member. A wear plate comprises a body element saddling the intermediate contact member, a pair of spaced apart first engagement elements extending from an end of the body, and a pair of spaced apart second engagement elements extending from an opposite end for engaging the side contact members. An active module is removably coupled to the second coupling portion and comprises a body member and a pair of braces disposed on opposite sides of the body member, wherein a brace extends over the second coupling elements. The wear plate may be replaced when worn out. | 05-28-2015 |
Patent application number | Description | Published |
20130264691 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, the RDL defining a signal routing circuit. The method comprises the steps of: depositing the electrically conductive RDL so as to form an electrically conductive ring surrounding the signal routing circuit; and coating the side and lower surfaces of the die with an electrically conductive shielding material. | 10-10-2013 |
20140091458 | ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING - Consistent with an example embodiment, there is semiconductor device assembled to resist mechanical damage. The semiconductor device comprises an active circuit defined on a top surface, contact areas providing electrical connection to the active circuit. There is a pedestal structure upon which the active circuit is mounted on an opposite bottom surface; the pedestal structure has an area smaller than the area of the active device. An encapsulation, consisting of a molding compound, surrounds the sides and the underside of the active device and it surrounds the contact areas. The encapsulation provides a resilient surface protecting the active device from mechanical damage. A feature of the embodiment is that the contact areas may have solder bumps defined thereon. | 04-03-2014 |
20140110842 | USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) - Consistent with an example embodiment, there is a semiconductor device, with an active device having a front-side surface and a backside surface; the semiconductor device of an overall thickness, comprises an active device with circuitry defined on the front-side surface, the front-side surface having an area. The back-side of the active device has recesses f a partial depth of the active device thickness and a width of about the partial depth, the recesses surrounding the active device at vertical edges. There is a protective layer of a thickness on to the backside surface of the active device, the protective material having an area greater than the first area and having a stand-off distance. The vertical edges have the protective layer filling the recesses flush with the vertical edges. A stand-off distance of the protective material is a function of the semiconductor device thickness and the tangent of an angle (θ) of tooling impact upon a vertical face the semiconductor device. | 04-24-2014 |
20140138855 | PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) - Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) wafer; The wafer has a topside surface and an back-side surface, and a plurality of device die having electrical contacts on the topside surface. The method comprises back-grinding, to a thickness, the back-side surface the wafer. A protective layer of a thickness is molded onto the backside of the wafer. The wafer is mounted onto a sawing foil; along saw lanes of the plurality of device die, the wafer is sawed, the sawing occurring with a blade of a first kerf and to a depth of the thickness of the back-ground wafer. Again, the wafer is sawed along the saw lanes of the plurality of device die, the sawing occurring with a blade of a second kerf, the second kerf narrower than the first kerf, and sawing to a depth of the thickness of the protective layer. The plurality of device die are separated into individual device die. Each individual device die has a protective layer on the back-side, the protective layer having a stand-off distance from a vertical edge of the individual device die. | 05-22-2014 |
20150069587 | INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Presented is an integrated circuit packaged at the wafer level wafer (also referred to as a wafer level chip scale package, WLCSP), and a method of manufacturing the same. The WLCSP comprises a die having an electrically conductive redistribution layer, RDL, formed above the upper surface of the die, the RDL defining a signal routing circuit. The method comprises the steps of: depositing the electrically conductive RDL so as to form an electrically conductive ring surrounding the signal routing circuit; and coating the side and lower surfaces of the die with an electrically conductive shielding material. | 03-12-2015 |
20150162306 | ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING - Consistent with an example embodiment, there is semiconductor device assembled to resist mechanical damage. The semiconductor device comprises an active circuit defined on a top surface, contact areas providing electrical connection to the active circuit. There is a pedestal structure upon which the active circuit is mounted on an opposite bottom surface; the pedestal structure has an area smaller than the area of the active device. An encapsulation, consisting of a molding compound, surrounds the sides and the underside of the active device and it surrounds the contact areas. The encapsulation provides a resilient surface protecting the active device from mechanical damage. A feature of the embodiment is that the contact areas may have solder bumps defined thereon. | 06-11-2015 |
20150279803 | DIE INTERCONNECT - One example embodiment discloses a chip having a chip area, wherein the chip area includes: an overhang area; a rigid coupling area, having a set of rigid coupling points, located on one side of the overhang area; and a flexible coupling area, having a set of flexible coupling points, located on a side of the overhang area opposite to the a rigid coupling area. Another example embodiment discloses a method for fabricating a die interconnect, comprising: fabricating a rigid coupler area, having a set of rigid coupler points, within a chip having a chip area; defining an overhang area within the chip area and abutted to the rigid coupler area; and fabricating a flexible coupler area, having a set of flexible coupler points, within the chip area abutted to a side of the overhang area opposite to the rigid coupler area. | 10-01-2015 |
20160005626 | EXPOSED DIE CLIP BOND POWER PACKAGE - In an example embodiment, an integrated circuit (IC) comprises a device die having a top-side surface and an under-side surface, the top-side surface having bond pads connected to active circuit elements, the under-side surface having a conductive surface. A first set of lead frame clips having upper portions and lower portions, are solder-anchored, on the upper portions, to a first set of bond pads; the lower portions are flush with the conductive surface. Wires are bonded to an additional set of bond pads opposite the first set of bond pads and to lower lead frame portions of a second set of lead frame clips opposite the first set of lead frame clips; the lower lead frame portions of the second set of lead frame clips are flush with the conductive surface. The device is encapsulated in a molding compound leaving exposed the conductive surface and underside surfaces of the first and second sets of the lead frame portions. | 01-07-2016 |
20160005679 | EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE - Consistent with an example embodiment, there is a method for packaging an integrated circuit (IC) device. The method comprises attaching a lead frame to the carrier tape; the lead frame has an array of device positions on the carrier tape and pad landings surround the device positions for making electrical connections to the plurality of active device die. A plurality of active device die are mounted on the carrier tape within the array of device positions; each said active device die has bond pads, each of said active device die has been subjected to back-grinding to a prescribed thickness and has a solderable conductive surface on its underside. On the bond pads, the plurality of active devices are wire bonded to the pad landings on the lead frame. The lead frame and wire bonded active devices are encapsulated, leaving the solderable die backside and lead frame backside exposed. | 01-07-2016 |