Van Den Boomen
René Wilhelmus Johannes Maria Van Den Boomen, Asten NL
Patent application number | Description | Published |
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20110147925 | PRE-SOLDERED LEADLESS PACKAGE - The invention relates to a method of manufacturing a semiconductor device, the method comprising: i) providing a substrate carrier comprising a substrate layer and a patterned conductive layer, wherein the patterned conductive layer defines contact pads; ii) partially etching the substrate carrier using the patterned conductive layer as a mask defining contact regions in the substrate layer; iii) providing the semiconductor chip; iv) mounting said semiconductor chip with the adhesive layer on the patterned conductive layer such that the semiconductor chip covers at least one of the trenches and part of the contact pads neighboring the respective trench are left uncovered for future wire bonding; v) providing wire bonds between respective terminals of the semiconductor chip and respective contact pads of the substrate carrier; vi) providing a molding compound covering the substrate carrier and the semiconductor chip, and vii) etching the backside (S | 06-23-2011 |
20110309514 | PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED LOCKING PROPERTIES - The invention relates to a method of manufacturing a semiconductor device ( | 12-22-2011 |
20120116189 | BATTERY - A battery comprises a carrier foil, with solid state battery elements spaced along the foil and mounted on opposite sides of the foil in pairs, with the battery elements of a pair mounted at the same position along the foil. The carrier foil is folded to define a meander pattern with battery element pairs that are adjacent each other along the foil arranged back to back. | 05-10-2012 |
René Wilhelmus Johannes Maria Van Den Boomen, Asten NL
Patent application number | Description | Published |
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20140211442 | PRE-SOLDERED LEADLESS PACKAGE - Consistent with an example embodiment, a semiconductor device comprises a patterned conductive layer defining contact pads for being connected to terminals of a semiconductor chip. The semiconductor chip comprises the terminals at a first side and an adhesive layer at a second side opposite to the first side; wherein, the semiconductor chip is mounted with an adhesive layer on a patterned conductive layer such that the semiconductor chip part of each respective contact pad leaves part thereof uncovered by the chip for wire bonding. Wire bonds connect respective terminals of the semiconductor chip and respective contact pads at the first side thereof. A molding compound covers the semiconductor chip, the wire bonds and the contact pads; wherein, the molding compound is also located on the second side of the semiconductor device, separating the contact regions that are located directly on a backside of the contact pads. | 07-31-2014 |
R.w.j. Van Den Boomen, Asten NL
Patent application number | Description | Published |
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20090103274 | WARPAGE PREVENTING SUBSTRATES AND METHOD OF MAKING SAME - Consistent with an example embodiment, there is an apparatus comprising a circuit ( | 04-23-2009 |
Wilhelmus Henrica Gerarda Maria Van Den Boomen, Valkenswaard NL
Patent application number | Description | Published |
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20130336565 | 2D/3D IMAGE REGISTRATION - The present invention relates to interactive registration of 2D images with 3D volume data, and in particular relates to the registration of two 2D images with 3D volume data. In order to provide 2D/3D registration with a facilitated workflow for the user, an example of a method is provided comprising the steps of providing ( | 12-19-2013 |