Uselding
Jean-Philippe Uselding, Habay-La-Neuve BE
Patent application number | Description | Published |
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20150197847 | ENDBLOCK FOR ROTATABLE TARGET WITH ELECTRICAL CONNECTION BETWEEN COLLECTOR AND ROTOR AT PRESSURE LESS THAN ATMOSPHERIC PRESSURE - An endblock for a rotatable sputtering target, such as a rotatable magnetron sputtering target, is provided. A sputtering apparatus, including one or more such endblock(s), includes locating the electrical contact(s) (e.g., brush(es)) between the collector and rotor in the endblock(s) in an area under vacuum (as opposed to in an area at atmospheric pressure). | 07-16-2015 |
John Uselding, Port Washington, WI US
Patent application number | Description | Published |
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20090220904 | TOUCHLESS FILL LARGE FLAME TORCH - An apparatus having a fuel container, a flame bowl, and a wick holder disposed proximate the flame bowl is disclosed. An open fuel filling port disposed in the flame bowl prevents entry of ignition sources into the fuel container but allows for the flow of liquid thereinto, whereby a user of the torch may refuel the torch without need to touch the torch. | 09-03-2009 |
20100104995 | NO TOUCH POUR TORCH TOP - An apparatus having a shrouded funnel for fueling. A flow barrier is provided in the funnel that controls vapor release from a fuel canister and allows for refueling of liquid fuel without touching the apparatus. | 04-29-2010 |
20110097676 | TWIN WICK TORCH - An apparatus having a flame bowl, a shroud surrounding the flame bowl, and a fitting connected to an underside of the flame bowl is disclosed. At least two wick holders are disposed in the flame bowl. The shroud connects to the flame bowl along a top thereof and is spaced apart from the flame bowl along a bottom thereof. | 04-28-2011 |
Philippe Uselding, Habay-La-Neuve BE
Patent application number | Description | Published |
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20110024284 | Sputtering apparatus including cathode with rotatable targets, and related methods - Certain example embodiments relate to sputtering apparatuses that include a plurality of targets such that a first one or ones of target(s) may be used for sputtering in a first mode, while a second one or ones of target(s) may be used for sputtering in a second mode. Modes may be switched in certain example embodiments by rotating the position of the targets, e.g., such that one or more target(s) to be used protrude into the main chamber of the apparatus, while one or more target(s) to be unused are recessed into a body portion of a cathode of (e.g., integrally formed with) the sputtering apparatus. The targets may be cylindrical magnetic targets or planar targets. At least one target location also may be made to accommodate an ion beam source. | 02-03-2011 |