Patent application number | Description | Published |
20140144883 | Gas Circuit Breaker - A gas circuit breaker includes a circuit-breaking portion provided within a tank. The tank is filled with insulating gas and disposed in an upright position. The circuit-breaking portion is connected to a bus through a main circuit conductor. The circuit-breaking portion has an operation unit disposed outside the tank. The operation unit is an electric linear motor operation unit composed of a driving portion and a driving energy storage portion. The driving portion is adjacent to the tank. The driving energy storage portion is separated from the driving portion. The driving energy storage portion and the driving portion are electrically connected. | 05-29-2014 |
20140367360 | WEAR-RESISTANT MATERIAL, PUFFER CYLINDER, AND PUFFER-TYPE GAS CIRCUIT BREAKER - The present invention includes a wear-resistant material including: a base material formed of pure aluminum or an aluminum alloy having a finely asperity structure on a surface thereof; and a coat including a hydrated oxide coat of aluminum, the coat being formed on the surface of the base material. Further, the present invention including a puffer cylinder including: a finely asperity structure on an inner-wall surface thereof; and a coat including a hydrated oxide coat of aluminum, the coat being formed on the inner-wall surface of the puffer cylinder. The present invention also includes a puffer-type gas circuit breaker includes the above puffer cylinder. | 12-18-2014 |
20150060408 | Wear-Resistant Material, Method for Producing the Same, Puffer Cylinder and Puffer-Type Gas Circuit Breaker - The present invention includes a wear-resistant material including: a base material formed of pure aluminum or an aluminum alloy having a projection, and a depression in a pit-like shape on a surface thereof; and a coat including a dehydrate of a hydrated oxide of aluminum, the coat being formed on a surface of the base material. Further, the present invention including a method for producing a wear-resistant material including the steps of: forming a hydrated oxide coat of aluminum on a surface of the base material by a chemical conversion coating; and heating the hydrated oxide coat. Further, the present invention also includes a puffer cylinder and a puffer-type gas circuit breaker applied to the above wear-resistant material. | 03-05-2015 |
Patent application number | Description | Published |
20120107531 | COATED PRINTING PAPER - A coated printing paper has a favorable offset printability, which can achieve good ink fixing and ink absorption properties even in ink jet printing, which has suitable dot diffusion even when printed by an ink jet printer using pigment ink, and can prevent the occurrence of white lines. The coated printing paper comprises a base paper and a coating layer which is applied to at least one surface of the base paper and contains a pigment and a binder as major components, wherein the base paper comprises a cationic compound, the coating layer contains, as a pigment, 50 parts by mass or more of ground calcium carbonate based on 100 parts by mass of total pigments in the coating layer, and the applied amount of the coating layer is 2.0 g/m | 05-03-2012 |
20120114880 | COATED PRINTING PAPER - The object of the present invention is to provide a coated printing paper used for ink jet printing machines, which has an ink fixing property and ink absorption property corresponding to ink jet printing, which inhibits poor dot diffusion, and which is excellent in abrasion resistance property of printed portions. According to the present invention, provided is a coated printing paper comprising a base paper, an undercoating layer which is applied on at least one surface of the base paper and contains a pigment and a binder, and one or more coating layers on the undercoating layer, wherein the base paper contains at least one selected from a cationic resin and a multivalent cation salt; the uppermost coating layer contains at least a colloidal silica; and the 75° gloss according to JIS Z8741 of the surface of the uppermost coating layer is 40% or more. | 05-10-2012 |
Patent application number | Description | Published |
20090095969 | Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof - A substrate for mounting optical semiconductor elements is provided, including a base substrate having an insulating layer and a plurality of wiring circuits formed on the upper face of the insulating layer, and having at least one external connection terminal formation opening portion which penetrates the insulating layer and reaches the wiring circuits; and an optical reflection member, which is provided on the upper face of the base substrate, and which forms at least one depressed portion serving as an area for mounting an optical semiconductor element. | 04-16-2009 |
20110241055 | OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME - An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes. | 10-06-2011 |
20130001622 | SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF, OPTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THEREOF - A substrate for mounting optical semiconductor elements is provided, including a base substrate having an insulating layer and a plurality of wiring circuits formed on the upper face of the insulating layer, and having at least one external connection terminal formation opening portion which penetrates the insulating layer and reaches the wiring circuits; and an optical reflection member, which is provided on the upper face of the base substrate, and which forms at least one depressed portion serving as an area for mounting an optical semiconductor element. | 01-03-2013 |
20140319569 | OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME - An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes. | 10-30-2014 |
Patent application number | Description | Published |
20110031527 | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate - The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer. | 02-10-2011 |
20110039978 | THERMOSETTING RESIN COMPOSITION, EPOXY RESIN MOLDING MATERIAL, AND POLYVALENT CARBOXYLIC ACID CONDENSATE - The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer. | 02-17-2011 |
20110284915 | Electronic device incorporating the white resin - The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours. | 11-24-2011 |
20110294241 | Method of using white resin in an electronic device - The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours. | 12-01-2011 |
20140128621 | THERMOSETTING RESIN COMPOSITION, EPOXY RESIN MOLDING MATERIAL, AND POLYVALENT CARBOXYLIC ACID CONDENSATE - The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer. | 05-08-2014 |
Patent application number | Description | Published |
20090315049 | OPTICAL SEMICONDUCTOR ELEMENT MOUNTING PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME - An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes. | 12-24-2009 |
20100200882 | THERMOSETTING LIGHT-REFLECTING RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT MOUNTING BOARD PRODUCED THEREWITH, METHOD FOR MANUFACTURE THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE - There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously. | 08-12-2010 |
20110278630 | COATING AGENT, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT USING SAME, AND OPTICAL SEMICONDUCTOR DEVICE - The coating agent of the invention is a coating agent to be used between conductor members, comprising a thermosetting resin, a white pigment, a curing agent and a curing catalyst, the coating agent to be used between conductor members having a white pigment content of 10-85 vol % based on the total solid volume of the coating agent, and a whiteness of at least 75 when the cured product of the coating agent has been allowed to stand at 200° C. for 24 hours. | 11-17-2011 |
20110297424 | WIRING BOARD, ELECTRONIC DEVICE PACKAGE, AND METHODS OF PRODUCTION OF THE SAME - A wiring board which uses both conductor patterns and reflection members provided at gaps therebetween to suppress unevenness in the reflection rate so as to raise the overall reflection rate and provide a reflection function on the surface of the wiring board at the side where an electronic device is mounted; facilitates shaping of the reflection members, controlling of the thickness of the reflection members, and controlling of the surface shape of the reflection members so as to stabilize the reflection rate; and secures close contact between the reflection members and sealing members so as to improve reliability. The wiring board comprises a plurality of wiring layers provided with conductor patterns disposed on base members, and base members which electrically insulate the plurality of wiring layers. At the outermost wiring layer among the plurality of wiring layers, reflection members are formed on the portions of the base member where there are no conductor patterns, the surface of these reflection members and the surface of the conductor patterns are made level and the surface of the conductor patterns are exposed from the reflection members. | 12-08-2011 |
Patent application number | Description | Published |
20090040298 | LIVING BODY OBSERVATION DEVICE - A light source unit, which is connected to a control unit and an endoscope, radiates a pre-determined light quantity of white light based on a signal from the control unit. The light source unit includes a lamp as a white light source, an infrared cut filter, a light quantity limiting filter, being inserted/removed on an optical path, for limiting light quantity in a pre-determined wavelength region of white light, a filter insertion/removal driving unit for inserting/removing the light quantity limiting filter on an optical path, and a condensing lens for outputting white light. For example, when a transmission rate of a blue band is 100%, the light quantity limiting filter limits transmission rates of other bands to 50%. This improves S/N in discrete spectral image generation with illumination light in a visible light region. | 02-12-2009 |
20090073261 | IMAGE PROCESSING APPARATUS, ENDOSCOPE APPARATUS AND COLOR BALANCE ADJUSTING METHOD - There are provided an image processing apparatus, an endoscope apparatus, and a color balance adjusting method capable of obtaining a good observation image. An image processing apparatus of the invention includes: an image signal input unit for inputting an image signal of a subject image picked up by an image pickup unit, the subject image including at least an image of a color balance adjustment tool; a control unit for calculating a value of coefficient to change brightness value of the image signal, based on a correction value to correct characteristic variation of the color balance adjustment tool, the correction value being shown in a correction value display portion included by the color balance adjustment tool, and a brightness value of the image of the color balance adjustment tool; and a color balance process unit for performing color balance adjustment by changing the brightness value of the image signal based on the coefficient value. | 03-19-2009 |
20120200683 | SYSTEM FOR RECORDING AND REPRODUCING IMAGES - An image recording and reproducing system that records and reproduces a combined image of images input from plural input sources outputs a combined image data group including component images forming the combined image, information related to the combined image, and image layout information of the combined image, records the output combined image data group, changes reproduction image designation information including information for designating component images forming a reproduction image, information related to the reproduction image, and image layout information of the reproduction image, forms a reproduction image from the recorded combined image data group on the basis of the changed reproduction image designation information, outputs the formed reproduction image, and receives the output reproduction image and reproduces the reproduction image. | 08-09-2012 |
20130300829 | ENDOSCOPE SYSTEM - An endoscope system includes processors, and settings in the processors are at least partially in common And a setting content in a processor determined to have a higher priority is transmitted to a processor determined to have a lower priority, based on a predetermined operation, and the processor changes a setting content that is in common with a setting content in the processor among the received setting contents. | 11-14-2013 |