Patent application number | Description | Published |
20080309900 | Method of making patterning device, patterning device for making patterned structure, and method of making patterned structure - A method and apparatus to fabricate a patterned structure using a template supported on a carrier. The method includes patterning a material to conform to the patterned structure. The patterned material is cured while remaining on the template. The carrier is removable during the curing process. The template is later removed from the patterned material to obtain the patterned structure. A patterning device is also provided, which is formed by a template and a carrier releasably attached to each other. The template and the carrier can be separated from each other when the patterning device is subjected to curing of the patterned structure. | 12-18-2008 |
20090034083 | Method of forming a microlens array and imaging device and system containing such a microlens array - Method of forming a microlens array and an imaging device and system containing such a microlens array. The microlens array is formed with a plurality of substantially gapless microlenses. A plurality of overlying portions are formed on the microlenses and have substantially the same curvature and/or height. | 02-05-2009 |
20090147379 | Microlenses with patterned holes to produce a desired focus location - A method, apparatus and system providing a microlens having a substantially flat upper surface and having a plurality of holes arranged in a pattern in a microlens material which produces a focal point at a desired location. | 06-11-2009 |
20100123209 | Apparatus and Method of Manufacture for Movable Lens on Transparent Substrate - A lens stack having a movable lens attached to a MEMS structure and method of fabricating the same. The method comprises attaching at least one MEMS structure to a transparent substrate. The method further comprises forming a movable lens in contact with the at least one MEMS structure. | 05-20-2010 |
20100177408 | METHOD OF FORMING LENS ARRAYS AND TRANSFERRING SUCH ONTO MOVABLE-MEMS STRUCTURES - Micro-electrical-mechanical (MEMS) wafers in which a lens is formed on a micro-electrical-mechanical structure. The micro-electrical-mechanical wafers can comprise a substrate, MEMS structures, and a lens array. A method of forming a micro-electrical-mechanical wafer comprises providing a substrate, forming a micro-electrical-mechanical structure on the substrate, forming a carrier, forming a lens array on the carrier, and transferring the lens array from the carrier onto the micro-electrical-mechanical structure. The lens array is placed above the micro-electrical-mechanical structure. | 07-15-2010 |
20110180695 | LAYERED LENS STRUCTURES AND METHODS OF PRODUCTION - A microlens structure includes lower lens layers on a substrate. A sputtered layer of glass, such as silicon oxide, is applied over the lower lens layers at an angle away from normal to form upper lens layers that increase the effective focal length of the microlens structure. The upper lens layers can be deposited in an aspherical shape with radii of curvature longer than the lower lens layers. As a result, small microlenses can be provided with longer focal length. The microlenses are arranged in arrays for use in imaging devices. | 07-28-2011 |
20120044339 | OPTO-FLUIDIC MICROSCOPE SYSTEM WITH EVALUATION CHAMBERS - An image sensor integrated circuit may contain image sensor pixels. A channel containing a fluid with particles such as cells may be formed on top of the image sensor. The image sensor pixels may form light sensors and imagers. The imagers may gather images of the cells or other particles as the fluid passes over the imagers. The channel may have multiple branches. Gating structures and other fluid control structures may control the flow of fluid through the channel branches. Portions of the channel may be used to form chambers. The chambers may each be provided with one or more light sensors, light sources, and color filters to alter the color of illumination form a light source, one or more reactants such as dyes, antigens, and antibodies, and heaters. The branches may route the fluid to respective chambers each of which has a different set of capabilities. | 02-23-2012 |
20120045103 | SYSTEM FOR TARGETING CELLS OR OTHER MATERIALS - An image sensor integrated circuit may contain image sensor pixels. A channel containing a fluid with particles such as cells may be formed on top of the image sensor. Some of the image sensor pixels may form a calibration sensor and some of the image sensor pixels may form an imager. As the fluid and particles flow through the channel at a flow rate, the calibration sensor may measures the flow rate and illumination intensity in the channel. Based on calibration data such as measured flow rate and measured illumination intensity, adjustments may be made to ensure that the imager acquires satisfactory image data. The adjustments may include flow rate adjustments, image acquisition data rate adjustments, and illumination adjustments. A processing unit in the channel may contain a laser or other component to destroy selected cells. A flared region in the channel may be used as a chromatograph. | 02-23-2012 |
20120045787 | FLEXIBLE MICRO-CARRIER SYSTEM - Micro-carrier systems may be used to carry and identify sample materials through an analysis system. Analysis systems may include an image sensor integrated circuit containing image sensor pixels. A channel containing a fluid with particles such as cells may be formed on top of the image sensor. Micro-carriers may be used to carry the cells in the fluid. Micro-carriers may have identifier regions and active regions. Identifier regions may include coded information identifying cells, fluid samples, or other materials carried in the active region. Active regions may carry reagents, trapping agents, cells or other sample materials. Active regions may be formed on a surface of a micro-carrier or may be formed in a cavity inside the micro-carrier. Micro-carriers may include magnetic control structures that can be used to guide, rotate, accelerate or position micro-carriers. | 02-23-2012 |
20120147228 | IMAGING SYSTEMS WITH OPTICAL CROSSTALK SUPPRESSION STRUCTURES - An imaging system may include an image sensor and lenses on a substrate. The lenses may focus light onto the image sensor. The imaging system may include multiple optical channels, each of which directs light at a particular wavelength or range of wavelengths to a particular region of the image sensor. The imaging system may include optical crosstalk suppression structures that reduce or minimize optical crosstalk between the optical channels. The optical crosstalk suppression structures may include, for each optical channel, at least a pair of matching color filters. The color filters may keep any light that leaks between optical channels from reaching the image sensor. | 06-14-2012 |
20120188421 | IMAGING SYSTEMS WITH ARRAYS OF ALIGNED LENSES - An imaging system may include an array of lenses, each of which is aligned over a respective one of a plurality of imaging pixels. The array of lenses may be formed in two layers. The first layer may include a first set of non-adjacent lenses and centering structures between the first lenses. The centering structures may be aligned with the first set of lenses as part of a mask design with a high level of accuracy. The second layer may include a second set of lenses, each of which is formed on a respective one of the centering structures. Forming the second set of lenses may include a reflow process in which surface tension forces center the second set of lenses on their respective centering structures, thereby aligning the second set of lenses with the first set of lenses with a high level of accuracy. | 07-26-2012 |
20120194719 | IMAGE SENSOR UNITS WITH STACKED IMAGE SENSORS AND IMAGE PROCESSORS - An image sensor unit has stacked imager and processor integrated circuits. The imager may have an image sensor pixel array on its front surface. Processor die may be mounted back-to-back with respective imagers on a wafer. A photodefinable dielectric film may cover the rear surface of the wafer. Metal traces in the photodefinable dielectric and through-silicon vias in each imager may be used to interconnect the processing circuitry on the front surface of a processor to the image sensor pixel array on the front surface of the imager. Openings may be formed in the photo definable dielectric to allow solder balls to form electrical connections with the metal traces. A cavity may be formed in a photo definable dielectric layer or an imager to accommodate the processor. The processor may also be mounted in a cavity in a separate silicon standoff structure before attaching the standoff structure to the imager. | 08-02-2012 |