Patent application number | Description | Published |
20140374767 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode (LED) structure includes a substrate, an LED element, a reverse current protection element, a third conductor, and a fourth conductor. The LED element includes a first N-type semiconductor layer, a first lighting layer, a first P-type semiconductor layer, a first transparent conductive layer, a first electrode, and a second electrode. The reverse current protection element is located on the substrate and surrounds the LED element. The reverse current protection element includes a stack layer, a first conductor, and a second conductor. The stack layer is formed on the substrate by sequentially stacking a second N-type semiconductor layer, a second lighting layer, and a second P-type semiconductor layer. The third conductor is electrically connected to the first conductor and the second electrode. The fourth conductor is electrically connected to the second conductor and the first electrode. | 12-25-2014 |
20140377899 | LIGHT EMITTING DIODE CHIP MANUFACTURING METHOD - A light emitting diode chip manufacturing method includes the following steps: a substrate is provided. A first semiconductor layer is formed on the substrate. A light-emitting layer is formed on a portion of the first semiconductor layer, and the surface of the first semiconductor layer not covered by the light-emitting layer is exposed. A second semiconductor layer is formed on the light-emitting layer. A hard shielding layer is formed on the second semiconductor layer and the exposed surface of the first semiconductor layer, such that a multi-layer stacked structure is formed on the substrate. A cutting treatment is performed. An etching treatment is performed. The hard shielding layer is patterned to form a current blocking layer on the second semiconductor layer, and the current blocking layer is made of the hard shielding layer. | 12-25-2014 |
20150034982 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure is provided. The light emitting diode structure comprises a substrate, a light emitting multi-layer structure, a first current blocking layer, a first current spreading layer, a second current blocking layer and a second current spreading layer. The light emitting multi-layer structure is formed on the substrate by way of stacking. The first current blocking layer is formed on part of the light emitting multi-layer structure. The first current spreading layer covers the first current blocking layer and the light emitting multi-layer structure. The second current blocking layer is formed on part of the first current spreading layer. An orthogonal projection of the second current blocking layer is disposed in an orthogonal projection of the first current blocking layer. The second current spreading layer covers the second current blocking layer and the first current spreading layer. | 02-05-2015 |
20150048303 | LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THEREOF - The disclosure provides a light-emitting diode (LED) and a method for manufacturing the same. The LED includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first current spreading layer, a current blocking having a plurality of nitrogen vacancies, and a second current spreading layer, wherein the second spreading layer includes a current spreading area and a current blocking area. The current blocking area is formed the nitrogen vacancies by high power sputtering on the current blocking area of the second semiconductor layer, so as to increase the resistance of the current blocking area and occur the efficiency of current blocking. | 02-19-2015 |
20150129913 | ELECTRODE STRUCTURE - An electrode structure includes a first diffusion barrier layer, an aluminum reflective layer formed over the first diffusion barrier layer. The aluminum reflective layer has a thickness from about 500 angstroms (Å) to less than 2,000 Å, a second diffusion barrier layer formed over the aluminum reflective layer, and an electrode layer overlying the second diffusion barrier layer. The electrode structure is applicable in a light emitting diode device. | 05-14-2015 |
20150340556 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure is provided. The light emitting diode structure comprises a substrate, a light emitting multi-layer structure, a first current blocking layer, a first current spreading layer, a second current blocking layer and a second current spreading layer. The light emitting multi-layer structure is formed on the substrate by way of stacking. The first current blocking layer is formed on part of the light emitting multi-layer structure. The first current spreading layer covers the first current blocking layer and the light emitting multi-layer structure. The second current blocking layer is formed on part of the first current spreading layer. An orthogonal projection of the second current blocking layer is disposed in an orthogonal projection of the first current blocking layer. The second current spreading layer covers the second current blocking layer and the first current spreading layer. | 11-26-2015 |
Patent application number | Description | Published |
20150270702 | POWER SUPPLY DEVICE WITH OVER-VOLTAGE PROTECTION - A power supplying device includes a power supplying unit, a first switching element, a compensating unit, a controller, and an over-voltage protecting unit. The power supplying unit includes a main power-outputting terminal, a standby power-outputting terminal, a DC to DC power converter, and a first sensing resistor. The DC to DC power convertor includes a power-outputting terminal The first sensing resistor is electrically connected to the power-outputting terminal and the main power-outputting terminal The first switching element is electrically connected to the first sensing resistor and the main power-outputting terminal The compensating unit is electrically connected to the main power-outputting terminal The controller is electrically connected to the compensating unit and the power supplying unit. The over-voltage protecting unit is electrically connected to the main power-outputting terminal, the first switching element, the standby power-outputting terminal, the power-outputting terminal, and the compensating unit. | 09-24-2015 |
20150326107 | ELECTRIC POWER FEEDBACK APPARATUS AND ELECTRIC POWER FEEDBACK METHOD - An electric power feedback apparatus is electrically connected to a power supply apparatus. The power supply apparatus includes a power supply module, a main power output terminal and a standby power output terminal. The main power output terminal and the standby power output terminal output electric power to a power conversion system respectively. The electric power feedback apparatus includes a constant voltage compensating module, a compensating and clamping module, an adaptive current weighting module and a controller. The constant voltage compensating module is electrically connected to the main power output terminal. The compensating and clamping module is electrically connected to the standby power output terminal, the constant voltage compensating module and the power conversion system. The adaptive current weighting module is electrically connected to the standby power output terminal, the constant voltage compensating module and the power conversion system. | 11-12-2015 |
20160028322 | POWER SUPPLYING SYSTEM, LINEAR CONTROLLING MODULE THEREOF, AND CONTROLLING METHOD OF SWITCHING COMPONENT - The linear controlling module of the present invention includes a controlling switch, a first resistor, a capacitor, and a second resistor. The controlling switch is electrically connected to a controlling signal outputting terminal of a power supplying device, the first resistor is electrically connected to the controlling switch, the capacitor is electrically connected to a electric power outputting terminal of the power supplying device and the first resistor, and the second resistor is electrically connected to the switch component of the power supplying device, the first resistor, and the capacitor. The switch component is electrically connected to an electric power outputting terminal. | 01-28-2016 |
20160064918 | OUTPUT SHORT CIRCUIT PROTECTING DEVICE - An output short circuit protecting device electrically connected to a power supplying device includes a first output short circuit protecting unit. The first output short circuit protecting unit includes a sensing unit, a comparing unit, a judging element, and a latching unit. The sensing unit is electrically connected to a switching unit, a first outputting resistor, and a second outputting resistor of the power supplying device. The comparing unit is electrically connected to the sensing unit. The judging element is electrically connected to the comparing unit, and a controller and a signal-controlling terminal of the power supplying device. The latching unit is electrically connected to the judging element and the signal-controlling terminal. | 03-03-2016 |
20160079880 | POWER SUPPLY APPARATUS WITH AUXILIARY BOOST CIRCUIT - A power supply apparatus includes a rectification circuit, a power factor correction circuit, an auxiliary boost circuit and a direct current to direct current conversion circuit. The auxiliary boost circuit includes an input contact, an output contact, a voltage detection unit, a control unit, a boost unit and a boost bypass unit. When a voltage value of a power factor correction power is not greater than a predetermined voltage value, the control unit is configured to turn off the boost bypass unit and turn on the boost unit, so that the boost unit boosts the power factor correction power and then the power factor correction power is sent to the direct current to direct current conversion circuit through the boost unit and the output contact. | 03-17-2016 |