Tzu-Heng
Tzu-Heng Chen, Guishan Township TW
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20110249452 | COMPOUND LIGHT CONDENSING APPARATUS - Provided is a compound light-condensing apparatus preferably including a lens body with refractive index n, and light-incident surface and light-ejected surface. The light-ejected surface has one set of Fresnel lens. When an incident light passes through the Fresnel lens structure, a focus with focal length F is formed. Two types of Fresnel lens structure are disposed on a light-ejected surface. More particularly, plural prism bodies are orderly disposed on the second type of Fresnel lens structure. The prism bodies counted from the central line is j and two adjacent prism bodies are spaced by p. The distance T | 10-13-2011 |
Tzu-Heng Ko, Taoyuan TW
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20130056075 | COMPOUNDS FOR USE IN ELECTROLYTE FOR SOLAR CELL, METHOD FOR PREPARING THE SAME, AND ELECTROLYTE AND SOLAR CELL HAVING THE SAME - Provided is a compound of formula (I): | 03-07-2013 |
20130067664 | POLYURETHANE DERIVATIVES, COMPOSITION THEREOF AND DYE ADDITIVES COMPRISING THE POLYURETHANE DERIVATIVES - A polyurethane derivative and a composition thereof are disclosed. The polyurethane derivative of the present invention has a structure of formula (I). The polyurethane derivative and the composition thereof can be used for increasing light fastness. | 03-21-2013 |
Tzu-Heng Ko, Taoyuan County TW
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20160060580 | SOFTENER COMPOSITION - The present invention provides a softener composition, which attaches onto the fabric during the rinsing process, and thus enables the fabric to have the anti-ultraviolet function. The softener composition comprises (A) 0.05 to 50 wt % of polyurethane-based polymeric UV light absorber, (B) 2 to 15 wt % of cationic softener, and (C) 35 to 97 wt % of water. | 03-03-2016 |
Tzu-Heng Wu, New Taipei City TW
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20150364363 | VHF ETCH BARRIER FOR SEMICONDUCTOR INTEGRATED MICROSYSTEM - The present disclosure relates to an integrated microsystem with a protection barrier structure, and an associated method. In some embodiments, the integrated microsystem comprises a first die having a plurality of CMOS devices disposed thereon, a second die having a plurality of MEMS devices disposed thereon and a vapor hydrofluoric acid (vHF) etch barrier structure disposed between the first die and the second die. The second die is bonded to the first die at a bond interface region. The vHF etch barrier structure comprises a vHF barrier layer over an upper surface of the first die, and a stress reduction layer arranged between the vHF etch barrier layer and the upper surface of the first die. | 12-17-2015 |
20160031704 | CAPACITOR WITH PLANARIZED BONDING FOR CMOS-MEMS INTEGRATION - An integrated circuit (IC) structure is provided. The IC structure includes an IC substrate including active devices which are coupled together through a conductive interconnect structure arranged thereover. The conductive interconnect structure includes a series of horizontal conductive layers and dielectric regions arranged between neighboring horizontal conductive layers. The conductive interconnect structure includes an uppermost conductive horizontal region with a planar top surface region. A MEMS substrate is arranged over the IC substrate and includes a flexible or moveable structure that flexes or moves commensurate with a force applied to the flexible or moveable structure. The active devices of the IC substrate are arranged to establish analysis circuitry to facilitate electrical measurement of a capacitance between the uppermost conductive horizontal region and the flexible or moveable structure. | 02-04-2016 |
Tzu-Heng Yeh, New Taipei City TW
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20150192620 | METHOD FOR DETERMINING LOADING CURRENT OF CIRCUIT BOARD, AND METHOD AND SYSTEM FOR FILTERING CIRCUIT BOARD MANUFACTURERS - A method for determining a loading current of a circuit board is provided. In the method, outline positions of metal regions and hollowed regions in each of the metal regions are recorded. Metal widths corresponding to scan lines in circuit board are calculated in a sequence, so that a minimum metal width on each of the scan lines is acquired. According to the minimum metal width, a maximum loading current of each of the metal regions is calculated. In addition, a method and a system for filtering manufacturers are provided. A processing apparatus of the system analyzes the maximum loading current and manufacturing process parameters of the circuit board, calculates a weight score of a manufacturing process capability parameter table of each manufacturer according to the maximum loading current and manufacturing process parameters, and filtering the manufacturers to produce the best fit manufacturer list. | 07-09-2015 |