Tzu-Cheng
Tzu Cheng Lin, Taipei County TW
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20110266356 | Temperature gain control device and method thereof - This specification discloses a device of controlling temperature gain and the method thereof. The invention detects the temperature of work environment and uses it to generate a control signal and a PWM signal for dynamically controlling the heaters around electronic elements to heat up. When the temperature of work environment is too low, the invention can increase the stability of the electronic elements. | 11-03-2011 |
Tzu Cheng Lin, New Taipei City TW
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20140016261 | HEATING AND HEAT DISSIPATING MULTI-LAYER CIRCUIT BOARD STRUCTURE FOR KEEPING OPERATING TEMPERATURE OF ELECTRONIC COMPONENTS - A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically. Therefore, the structure achieves the goal of keeping the operating temperature of each electronic component in the corresponding environment. | 01-16-2014 |
Tzu Cheng Lin, Shing Tien City TW
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20100097769 | Heat-dissipating structure for expansion board architecture - A heat-dissipating structure for the expansion board architecture is provided. A fixing element disposed on the heat-absorbing substrate fixes the motherboard and the first expansion board. The heat-generating elements on the motherboard or the first expansion board are directly in touch with the heat-absorbing surface of the heat-absorbing substrate to absorb their heat. The heat-dissipating board extended from the side of the heat-absorbing substrate then dissipates the heat absorbed by the heat-absorbing substrate. The structure thus solves the problems that existing heat-dissipating structures occupy larger space and therefore cannot be effectively used in an expansion board architecture to dissipate heat produced by the heat-generating elements between the motherboard and the expansion board and that it is likely to have assembly tolerance. Using the structure can reduce the space and the assembly tolerance, but effectively enhance heat dissipation in the expansion board architecture. | 04-22-2010 |
Tzu-Cheng Chang, Hualien County TW
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20120006367 | Splash-Proof Umbrella Structure - A splash-proof umbrella structure comprises a rod passing through a slide sleeve sliding up and down along the rod. The slide sleeve is coupled to support sticks. A piece of umbrella cloth is arranged on the support sticks. The upper side of the rod has a first rod sleeve and a second rod sleeve. The first rod sleeve has first link rods coupled to the support sticks. The second rod sleeve has second link rods coupled to the first link rods. The bottom of the rod has a handle. When getting off a vehicle in rain, the user can open the umbrella in a confined space to prevent from being wetted by rainwater via sliding the slide sleeve upward to stretch the umbrella cloth bottom-up. When not in use, the umbrella cloth can be collapsed via sliding the slide sleeve toward the handle. Further, the handle can collect rainwater. | 01-12-2012 |
Tzu-Cheng Chang, Taipei TW
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20110273866 | UMBRELLA WITH ILLUMINATION FUNCTION - An umbrella with illumination function comprises an umbrella cloth; a transparent post installed at a top of the umbrella cloth; at least one light emitting element being installed in the transparent post; a hollow body extended from a central portion of the umbrella cloth; a handle installed with a power supply at a top end thereof and a switch for switching the power supply; a conductive wire connected between the switch and the light emitting element; the conductive wire being installed within the hollow body; and a light reflecting unit installed at an inner side of the umbrella cloth. The light emitting element is installed to an upper side of the umbrella cloth so as to provide illumination to the user and thus keep the safety of the user in walking. An inner side of the umbrella cloth is installed with a light reflecting unit for providing a rearview to the user. | 11-10-2011 |
Tzu-Cheng Chen, Taipei City TW
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20140264559 | SUPER JUNCTION TRENCH METAL OXIDE SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME - A method for forming a semiconductor device includes forming a hard mask layer over a substrate comprising a semiconductor material of a first conductivity type, and forming a plurality of trenches in the hard mask layer and extending into the substrate. Each trench has at least one side wall and a bottom wall. The method further includes forming at least one barrier insulator layer along the at least one side wall and over the bottom wall of each trench, removing the at least one barrier insulator layer over the bottom wall of each trench, and filling the plurality of trenches with a semiconductor material of a second conductivity type. | 09-18-2014 |
Tzu-Cheng Kao, Hukou Township TW
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20140175545 | DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention discloses a double diffused metal oxide semiconductor (DMOS) device and a manufacturing method thereof. The DMOS device includes: a first conductive type substrate, a second conductive type high voltage well, a gate, a first conductive type body region, a second conductive type source, a second conductive type drain, a first conductive type body electrode, and a first conductive type floating region. The floating region is formed in the body region, which is electrically floating and is electrically isolated from the source and the gate, such that the electrostatic discharge (ESD) effect is mitigated. | 06-26-2014 |
20150079755 | DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention discloses a double diffused metal oxide semiconductor (DMOS) device and a manufacturing method thereof. The DMOS device includes: a first conductive type substrate, a second conductive type high voltage well, a gate, a first conductive type body region, a second conductive type source, a second conductive type drain, a first conductive type body electrode, and a first conductive type floating region. The floating region is formed in the body region, which is electrically floating and is electrically isolated from the source and the gate, such that the electrostatic discharge (ESD) effect is mitigated. | 03-19-2015 |
Tzu-Cheng Lin, Taipei City TW
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20090197354 | SYSTEM AND METHOD FOR MONITORING MANUFACTURING PROCESS - A system and method for monitoring a manufacturing process are provided. A wafer is provided. Process parameters of a manufacturing machine are in-situ measured and recorded if the wafer is processed in the manufacturing machine. A wafer measured value of the wafer is measured after the wafer has been processed. The process parameters are transformed into a process summary value. A two dimensional orthogonal chart with a first axis representing the wafer measured value and a second axis representing the process summary value is provided. The two dimensional orthogonal chart includes a close-loop control limit. A visualized point representing the wafer measured value and the process summary value is displayed on the two dimensional orthogonal chart. | 08-06-2009 |
20090259332 | FUZZY CONTROL METHOD FOR ADJUSTING A SEMICONDUCTOR MACHINE - A method of fuzzy control for adjusting a semiconductor machine comprising: providing measurement values from first the “parameter of a pre-semiconductor manufacturing process”, second the “parameter of the semiconductor manufacturing process”, and third the “operation parameter of the semiconductor manufacturing process”; performing a fuzzy control to define two inputs and one output corresponding to the measurement values, wherein the difference between the first and third values, and the difference between the second and third values, forms the two inputs, then from the two inputs one target output is calculated by fuzzy inference; finally, determining if the target output is in or out of an acceptable range. Whereby the target output is the “machine control parameter of the semiconductor manufacturing process” and when within an acceptable range is used for adjusting the semiconductor machine. | 10-15-2009 |
Tzu-Cheng Lin, Hsin-Chu TW
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20130023065 | Apparatus and Methods for End Point Determination in Reactive Ion Etching - Methods and apparatus for performing end point determination. A method includes receiving a wafer into an etch tool chamber for performing an RIE etch; beginning the RIE etch to form vias in the wafer; receiving in-situ measurements of one or more physical parameters of the etch tool chamber that are correlated to the RIE etch process; providing a virtual metrology model for the RIE etch in the chamber; inputting the received in-situ measurements to the virtual metrology model for the RIE etch in the chamber; executing the virtual metrology model to estimate the current via depth; comparing the estimated current via depth to a target depth; and when the comparing indicates the current via depth is within a predetermined threshold of the target depth; outputting a stop signal. An apparatus for use with the method embodiment is disclosed. | 01-24-2013 |
20130024019 | APPARATUS AND METHODS FOR END POINT DETERMINATION IN SEMICONDUCTOR PROCESSING - Methods and apparatus for performing end point determination are disclosed. An embodiment includes an apparatus comprising a process tool and a programmable processor. The process tool has an output for signaling in-situ measurements of physical parameters during processing of a wafer in the process tool, and the process tool has an input for receiving a signal indicating a modification of a recipe for the processing. The programmable processor is for executing a virtual metrology model of the process tool to estimate an estimated characteristic of the wafer achieved during the processing. The estimated characteristic is based on the in-situ measurements and the virtual metrology model. The programmable processor has an output for transmitting the signal when the estimated characteristic exceeds a predetermined threshold based on a target characteristic. | 01-24-2013 |
Tzu-Cheng Lin, Taipei TW
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20090326449 | Control apparatus of catheter feeder - The invention is disclosed to a control apparatus of catheter feeder. It comprises two rotatable mechanisms and a transmittal device that can propel the guidewire into continuous motion comprising moving forward, moving backward, moving clockwise, and moving counter-clockwise. The invention comprises of a square frame and three gears that are meshed together and are referred to the first, second, and third gear, respectively. At the front of the third gear are the first and second sets of the idle wheels that can hold the guidewire tightly. The invention employs the mechanical gears to control movement of the guidewire. | 12-31-2009 |
Tzu-Cheng Lin, Hsinchu City TW
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20140210982 | SYSTEM AND METHOD FOR AUTOMATIC QUALITY CONTROL FOR ASSEMBLY LINE PROCESSES - A system and method is disclosed for a quality control and/or inspection procedure for assembly line processes. The disclosed system and method enable automatic optical inspection of a device during different stages of manufacture as well as in its finished form. The disclosed system and method enable the automatic quality control process to be self-learning, dynamic, and to identify and classify defects in real time. | 07-31-2014 |