Patent application number | Description | Published |
20130020699 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - The invention provides a package structure, including: a substrate, wherein the substrate has a first surface and a second surface, and a first pattern metal layer is formed on the first surface, and a second patterned metal layer is formed on the second surface, and the substrate has a plurality of vias formed therein, wherein the first patterned metal layer is electrically connected to the second patterned metal layer through the plurality of vias, and the widths of the plurality of vias are gradually increased from the first surface to the second surface; a chip formed on the first surface of the substrate; and a molding material is formed on the substrate and the chip, wherein the chip is covered by the molding material. | 01-24-2013 |
20130277801 | CHIP PACKAGE - According to an embodiment of the invention, a chip package is provided. The chip package includes: a lower chip package; an upper chip package disposed on an upper surface of the lower chip package; at least one conducting element disposed between the lower chip package and the upper chip package; and at least one decoupling capacitor disposed on the upper surface of the lower chip package, wherein the decoupling capacitor is not covered by the upper chip package, and the decoupling capacitor is electrically connected to a power line or a ground line in the lower chip package. | 10-24-2013 |
20140042615 | FLIP-CHIP PACKAGE - An exemplary flip-chip package is provided, including: a package structure having a first bonding pad and a second bonding pad formed thereon, wherein the first bond pad has a feature size different from a feature size of the second bond pad; a semiconductor chip facing the package structure, having a first under bump metal (UBM) layer and a second under bump metal (UBM) layer formed thereon, wherein the first UBM layer has a feature size different from a feature size of the second UBM layer; a first conductive element disposed between the first bond pad and the first UBM layer; and a second conductive element disposed between the second bond pad and the second UBM layer. | 02-13-2014 |
20140264812 | SEMICONDUCTOR PACKAGE ASSEMBLY - The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface. A second semiconductor package is bonded to the first device-attach surface of the first semiconductor package. The second package includes a second body having a second device-attach surface and a second bump-attach surface opposite to the second device-attach surface. A dynamic random access memory (DRAM) device is mounted on the second device-attach surface. A decoupling capacitor is mounted on the second device-attach surface. Conductive structures are disposed on the second bump-attach surface of the second package, connecting to the first bump-attach surface of the first body of the first semiconductor package. | 09-18-2014 |
Patent application number | Description | Published |
20110268831 | Ice cream scoop - An ice cream scoop includes a handle, a scooper coupled to an end of the handle, a scraper installed in the scooper, a link rod extended from an end of the scraper into the end of the handle, and a transmission device installed on the link rod. The ice cream scoop further includes an operating device with an end pivotally coupled to the handle, such that the operating device can be swayed between a first position and a second position with respect to the handle. The operating device further includes a driving portion coupled to the transmission device. If the operating device is swayed between the first and second positions, the link rod will be rotated, and the scraper will be moved along an internal wall of the scooper. | 11-03-2011 |
20120093958 | Ice Cream Scoop - An ice cream scoop includes a handle, a scooper coupled to an end of the handle, a scraper installed in the scooper, a link rod extended from an end of the scraper into the end of the handle, and a transmission device installed on the link rod. The ice cream scoop further includes an operating device with an end pivotally coupled to the handle, such that the operating device can be swayed between a first position and a second position with respect to the handle. The operating device further includes a driving portion coupled to the transmission device. If the operating device is swayed between the first and second positions, the link rod will be rotated, and the scraper will be moved along an internal wall of the scooper. | 04-19-2012 |
Patent application number | Description | Published |
20120243164 | ELECTRONIC DEVICE WITH AN ADJUSTABLE BOARD STRUCTURE - An electronic device includes a first board structure, a second board structure and a pivoting mechanism. A fixing hole is formed on the first board structure. Two ends of the pivoting mechanism respectively pivot to the first board structure and the second board structure. The electronic device further includes a fixing mechanism installed on the pivoting mechanism. The fixing mechanism includes a base fixed inside the pivoting mechanism, a pin disposed on the base in a slidable manner for inserting into the fixing hole on the first board structure so as to constrain rotation of the first board structure relative to the pivoting mechanism, and a latch disposed on the base in a slidable manner and contacting against the pin for sliding the pin relative to the base. | 09-27-2012 |
20130194730 | Fixing Structure for Interface Card Connector - A fixing structure for an interface card connector is provided and includes a bottom housing, a board body, an interface card connector, a fixing plate, a torsion spring, and a spring. The bottom housing has an opening and a stop wall. The interface card connector is rotatably located on the board body by a fixing axis and includes a slot. The fixing plate includes a main body, a second spring fixing portion, an interface card connector fixing portion, and a protruding portion. When the board body is moved out the opening and the protruding portion contacts the stop wall, the fixing plate is stopped, and the interface card connector is separated from the interface card connector fixing portion. As a result, the interface card connector is rotated on the board body by the torsion spring, such that the slot is directed upwardly on the board body. | 08-01-2013 |
20130329351 | PORTABLE ELECTRONIC DEVICE AND SLIDE RAIL DEVICE - A portable electronic device including a computer body, a display, and a slide-rail structure is provided. The computer body has a first side edge. The display has a second side edge, a display surface and a back side surface. The slide-rail structure includes a sliding element and a connecting arm. The sliding element having a first combination portion is slidable between a first and a second position. The connecting arm having a second combining portion connected to the first combining portion is rotatably connected to the second side edge. When an included angle between the display surface and the computer body is first angle, the sliding element is in the first position; when the included angle is varied from the first angle to an angle greater than the first angle, the connecting arm pulls the sliding element to the second position. In addition, a slide-rail device is also provided. | 12-12-2013 |