Patent application number | Description | Published |
20090310260 | MAGNETIC HEAD SUSPENSION - A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other. Thereby, the desired portions of the suspension can be grounded through this simple structure without adopting a complicated structure wherein additional special lines for grounding are not separately laid besides the lines, which are lines for connecting a magnetic head and a control circuit board to each other. | 12-17-2009 |
20110108519 | WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT - The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer. | 05-12-2011 |
20110318609 | SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF - It is an object of the present invention to provide a substrate for suspension reduced in the generation of cracks in an insulating layer at the boundary region between a region where a metal supporting substrate exists and a region where no metal supporting substrate exist. The present invention solves the above object by providing a substrate for suspension comprising a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate, wherein a position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part. | 12-29-2011 |
20130229729 | SUSPENSION SUBSTRATE, SUSPENSION, ELEMENT-MOUNTED SUSPENSION, HARD DISK DRIVE, AND MANUFACTURING METHOD OF SUSPENSION SUBSTRATE - A main object of the present invention is to provide a suspension substrate such that design freedom of a wiring layer is improved while restraining the upsizing in accordance with an increase in a wiring layer. The present invention solves the problem by providing a suspension substrate comprising a metal supporting substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer laminated in this order, characterized in that the first wiring layer has a functional element wiring layer connected to a functional element, and the second wiring layer has a signal transmission wiring layer comprising a pair of wiring layers and connected to a recording and reproducing element. | 09-05-2013 |
20140246224 | SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF - The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part. | 09-04-2014 |