| Patent application number | Description | Published |
|---|
| 20080295957 | Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component - A bonding material is placed on an electronic component. a heat conductive member is superposed on the surface of the bonding material so that a thermosetting adhesive is interposed between the heat conductive member and a substrate. The thermosetting adhesive is then cured at a temperature lower than the melting point of the bonding material. The bonding material melts after the thermosetting adhesive has cured. While a distance is maintained between the heat conductive member and the substrate, the thermosetting adhesive is cured. The heat conductive member is thus reliably prevented from a downward movement regardless of the melting of the bonding material. A space is maintained between the heat conductive member and the electronic component. The cured bonding material is reliably prevented from suffering from a reduction in the thickness. | 12-04-2008 |
| 20080296755 | Semiconductor device - A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate heat of the semiconductor element, and a thermal connecting member being configured to thermally connect the heat radiation member and the semiconductor element. A metal material is used as the thermal connecting member, and an adhesion preventing member is provided so as to be separated from the electronic component, the adhesion preventing member being configured to prevent the metal material molten and flowing at a heating time being adhered to the electronic component. | 12-04-2008 |
| 20090242258 | ELECTRONIC DEVICE PACKAGE WITH CONNECTION TERMINALS INCLUDING UNEVEN CONTACT SURFACES - An electronic device package includes an electronic device including a plurality of input/output terminals, a wiring board which places the electronic device on a first surface and includes wiring connected to the input/output terminals of the electronic device, and a first connection terminal formed on a second surface of the wiring board and connected to the wiring, wherein the first connection terminal has an uneven contact surface formed to receive solder material placed thereon. | 10-01-2009 |
| 20100013089 | Semiconductor component and manufacturing method of semiconductor component - A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member. | 01-21-2010 |
| 20100226102 | PRINTED CIRCUIT BOARD UNIT - A printed circuit board unit includes a printed wiring board, an electronic component package mounted on a front surface of the printed wiring board, a radiating plate that is placed on an upper surface of the electronic component package, a bolt that has a head and a tip protruding from a back surface of the printed wiring board, and penetrates through the radiating plate and the printed wiring board, a reinforcing plate separated from the back surface of the printed wiring board by a predetermined gap, a stud arranged on a front surface of the reinforcing plate and coupled with the tip of the bolt, and a shock absorbing plate that is arranged between the reinforcing plate and the back surface of the printed wiring board. | 09-09-2010 |
| 20100243634 | ELECTRONIC APPARATUS, POWER CONTROL DEVICE FOR CONTROLLING A HEATER, AND METHOD OF CONTROLLING POWER CONTROL DEVICE - An electronic apparatus has a printed circuit board, a semiconductor device mounted on the printed circuit board by a plurality of solder bumps, a heater that heats the printed circuit, a power supply unit that supplies electric power to the semiconductor device and the heater, and a controller that controls the power supply unit to supply electric power to the heater when the electric power is not supplied to the semiconductor device. | 09-30-2010 |
| 20110254149 | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT - A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member. | 10-20-2011 |
| 20120210776 | CONDENSATION SENSING DEVICE, ELECTRONIC APPARATUS, AND CONDENSATION SENSING METHOD - A condensation sensing device that detects a water droplet to sense the condensation, the condensation sensing device comprising: a surface having a recesses and productions; and a water droplet detector that detects a water droplet guided by any of the recesses on the surface. | 08-23-2012 |
