Patent application number | Description | Published |
20090017387 | REFLECTIVE MASK BLANK FOR EXPOSURE, REFLECTIVE MASK FOR EXPOSURE, METHOD OF PRODUCING A SEMICONDUCTOR DEVICE, AND SUBSTRATE PROVIDED WITH MULTILAYER REFLECTIVE FILM - To provide a reflective mask blank for exposure that can solve a problem of adsorption failure in fixing a reflective mask using an electrostatic chuck and thus can flatten the surface of the mask using the electrostatic chuck, thereby realizing high-accuracy pattern transfer. In a reflective mask blank for exposure having a multilayer reflective film formed on a board and adapted to reflect exposure light and an absorbent layer formed on the multilayer reflective film and adapted to absorb the exposure light, the shape of a surface of the mask blank on its side opposite to its transfer pattern forming surface is a shape having a convex surface. | 01-15-2009 |
20120019916 | MULTILAYER REFLECTIVE FILM COATED SUBSTRATE FOR A REFLECTIVE MASK, REFLECTIVE MASK BLANK, AND METHODS OF MANUFACTURING THE SAME - By forming on a substrate a reference point mark having a concave or convex shape with its side walls being generally upright, even if a multilayer reflective film, an absorber film, and so on are formed over the reference point mark, sufficient contrast for inspection light is obtained so that the position of the reference point mark can be identified with high accuracy. | 01-26-2012 |
20120276474 | METHOD OF CLEANING SUBSTRATE - The present invention is a method of cleaning a substrate, comprising cleaning at least one surface of a substrate located in a liquid by injecting pressurized cleaning liquid containing bubbles or cleaning particles from a injection nozzle to at least one surface of the substrate. | 11-01-2012 |
20130078555 | MASK BLANK GLASS SUBSTRATE, MULTILAYER REFLECTIVE FILM COATED SUBSTRATE, MASK BLANK, MASK, AND METHODS OF MANUFACTURING THE SAME - Provided is a mask blank glass substrate that has high surface smoothness, that is formed with a fiducial mark capable of improving the detection accuracy of a defect position or the like, and that enables reuse or recycling of a glass substrate included therein. An underlayer is formed on a main surface, on the side where a transfer pattern is to be formed, of a glass substrate for a mask blank. The underlayer serves to reduce surface roughness of the main surface of the glass substrate or to reduce defects of the main surface of the glass substrate. A surface of the underlayer is a precision-polished surface. A fiducial mark which provides a reference for a defect position in defect information is formed on the underlayer. | 03-28-2013 |
20140230848 | METHOD OF CLEANING SUBSTRATE - The present invention is a method of cleaning a substrate, comprising cleaning at least one surface of a substrate located in a liquid by injecting pressurized cleaning liquid containing bubbles or cleaning particles from a injection nozzle to at least one surface of the substrate. | 08-21-2014 |
20140329174 | MASK BLANK SUBSTRATE, SUBSTRATE WITH MULTILAYER REFLECTION FILM, TRANSMISSIVE MASK BLANK, REFLECTIVE MASK BLANK, TRANSMISSIVE MASK, REFLECTIVE MASK, AND SEMICONDUCTOR DEVICE FABRICATION METHOD - Disclosed is a mask blank substrate for use in lithography, wherein a main surface of the substrate satisfies a relational equation of (BA | 11-06-2014 |
20150017574 | MASK BLANK SUBSTRATE, SUBSTRATE WITH MULTILAYER REFLECTION FILM, TRANSMISSIVE MASK BLANK, REFLECTIVE MASK, AND SEMICONDUCTOR DEVICE FABRICATION METHOD - Disclosed is a mask blank substrate for use in lithography, wherein the main surface on which the transfer pattern of the substrate is formed has a root mean square roughness (Rms) of not more than 0.15 nm obtained by measuring an area of 1 μm×1 μm with an atomic force microscope, and has a power spectrum density of not more than 10 nm | 01-15-2015 |
20150079501 | METHOD FOR PRODUCING SUBSTRATE WITH MULTILAYER REFLECTIVE FILM, METHOD FOR PRODUCING REFLECTIVE MASK BLANK AND METHOD FOR PRODUCING REFLECTIVE MASK - Disclosed is a method for producing a substrate with a multilayer reflective film for EUV lithography including a multilayer reflective film disposed on a principal surface of a substrate, the method including a multilayer reflective film formation step of forming the multilayer reflective film on the principal surface of the substrate in such a manner that the multilayer reflective film has a slope region in which the film thickness is decreased in a direction from the inside to the outside of the substrate on a peripheral portion of the principal surface, and a fiducial mark formation step of forming fiducial marks in the slope region by removing at least a portion of the multilayer reflective film, the fiducial marks serving as references for a defective location indicated by defect information with respect to the surface of the substrate with the multilayer reflective film. | 03-19-2015 |