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Tsung-Hsien Huang, I-Lan Hsien TW

Tsung-Hsien Huang, I-Lan Hsien TW

Patent application numberDescriptionPublished
20090025906COOLER DEVICE - A cooler device includes a metal base member and a plurality of metal radiation fins. The metal base member has parallel locating grooves; the metal radiation fins are fastened to one another in a stack by respective hooked portions thereof or by means of closed-end heat tubes, the metal radiation fins each having backwardly curved and crimped bottom mounting portions respectively fitted into the locating grooves of the metal base and fixedly secured thereto by means of compacting the locating grooves of the metal base member without electroplating or using solder paste or bonding means.01-29-2009
20090025909COOLER MODULE - A non-welding cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, heat pipes tightly inserted through the radiation fins and partially fitted into respective bottom open grooves of the base block with a respective flat wall portion thereof kept in flush with the bottom wall of the base block, and a thermal pad affixed to the bottom wall of the base block to hold down the heat pipes in the bottom open grooves of the base block for transferring heat energy from an external electronic chip to the heat pipes and the heat sink for quick dissipation.01-29-2009
20090032221COOLER DEVICE - A cooler device includes a metal base member and a plurality of metal radiation fins. The metal base member has parallel locating grooves; the metal radiation fins are fastened to one another in a stack by respective hooked portions thereof, the metal radiation fins each having backwardly curved and crimped bottom mounting portions respectively fitted into the locating grooves of the metal base and fixedly secured thereto by means of compacting the locating grooves of the metal base member without electroplating or using solder paste or bonding means.02-05-2009
20090038776COOLER MODULE - A cooler module includes a heat sink formed of a stack of radiation fins each having a plurality of double-step mounting holes for allowing quick mounting of the radiation fins by fitting the annular outer step portions of the double-step mounting holes of one radiation fin tightly into the annular inner step portions of the double-step mounting holes of another radiation fin, a base block tightly fastened to the bottom side of the heat sink, a plurality of heat pipes tightly fitted into the double-step mounting holes of the radiation fins to reinforce engagement between the respective annular outer step portions with the corresponding annular inner step portions and tightly fitted into the bottom wall of the base block to secure the heat sink and the base block firmly together.02-12-2009
20090084529COOLER MODULE - A horizontal cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, and heat pipes each having a first extension arm respectively tightly inserted through the radiation fins and a second extension arm respectively fitted into the bottom open grooves of the base block with a respective flat wall portion of the second extension arm exposed to the outside of the base block and kept in flush with the bottom wall of the base block for direct contact with an external electronic chip to transfer heat energy from the electronic chip to the heat sink for quick dissipation.04-02-2009
20090151900HEAT SINK - A heat sink includes a thermal conductive base panel that has a plurality of heat dissipation columns of any of a variety of configurations perpendicularly upwardly extending from the top wall, and radiation fins mounted on the heat dissipation columns at different elevations, each radiation fin having a plurality of mounting through holes respectively press-fitted onto the heat dissipation columns. The base panel may be provided with a fan and/or heat pipes to enhance heat dissipation efficiency.06-18-2009
20090194255COOLER DEVICE - A cooler device includes a base panel, which has multiple mounting grooves on the top wall and multiple locating grooves on the bottom wall, a radiation fin module formed by stacking up multiple radiation fins, each radiation fin having multiple mounting through holes and a root portion that is respectively riveted to the mounting grooves of the base panel, and multiple U-shaped heat pipes, each heat pipe having a first extension arm respectively and tightly fitted into the mounting through holes of the radiation fins and a second extension arm respectively and tightly fitted into the locating groove of the base panel and kept in flush with the bottom wall of the base panel for direct contact with a CPU or the like to transfer heat energy from the CPU or the like to the radiation fins for quick dissipation.08-06-2009
20090266518HEAT PLATE TYPE COOLER MODULE - A heat plate type cooler module includes a heat plate, which is formed of a bottom cover plate and a top cover plate and having a working fluid filled in a vacuum chamber between the top cover plate and the bottom cover plate; heat pipes each having a cold end and a top end; a locating plate covered on the heat plate to hold the hot end of each heat pipe in contact with the heat plate; and radiation fins fastened to the cold ends of the heat pipe by press-fitting.10-29-2009
20100126697HEAT SINK MODULE - A heat sink module includes a heat transfer tube, a plurality of radiation fins respectively riveted to locating grooves around the periphery of the heat transfer tube, and a heat transfer panel fastened to the bottom side of the heat transfer tube and the radiation fin set and kept in contact with a heat source, such as a CPU or a light emitting unit of a LED lamp for transferring heat from the heat source to the radiation fins for quick dissipation.05-27-2010
20100263850HEAT SINK - A heat sink includes a base panel having parallel channels located on the top wall, first ribs protruding from the top wall and respectively extending along one side of each channel and second ribs protruding from the top wall and respectively extending along the other side of each channel, and radiation fins respectively mounted in the channels of the base panel and supported on the second ribs in vertical positions, each radiation fin having an angled foot portion, which is inserted into one channel and secured thereto by the associated first rib upon deformation of the associated first rib by an external force.10-21-2010
20100270014HEAT SINK WITH RADIALLY ARRANGED RADIATION FINS - A heat sink includes a tubular base having longitudinal channels arranged in parallel around the periphery and a first and a second ribs protruding from the periphery and respectively extending along two opposite sides of each of the channels, and radiation fins radially arranged around the tubular base and supported on the second ribs, each radiation fin having an angled foot portion respectively inserted into the channels and secured thereto by the first ribs that are stamped down after the angled foot portions of the radiation fins are inserted into the channels of the tubular base.10-28-2010
20110036545HIGH-PERFORMANCE HEAT SINK - A high-performance heat sink includes a set of first radiation fins each having an abutment portion, two radiation fins extending from two lateral sides of the abutment portion, and upright pins extending from each radiation fin portion; a fastener that fastens the abutment portions of the first radiation fins together such that the radiation fins are radially extended out; second radiation fins fastened to the upright pins of the first radiation fins and arranged at different elevations; and thermal pipes fastened to the bottom side of the abutment portions of the first radiation fins, each thermal pipe having two distal ends respectively fastened to the two distal ends of each second radiation fin.02-17-2011

Patent applications by Tsung-Hsien Huang, I-Lan Hsien TW