Tsunenaga
Tsunenaga Nakashima, Koshi-Shi JP
Patent application number | Description | Published |
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20080289715 | Complex pipe and coating/development processing apparatus equipped with complex pipe - In a complex pipe, a plurality of pipe members containing at least a pipe member for liquid and a pipe member for electricity are fixed in parallel arrangement. One end of the complex pipe is connected to a stationary equipment and the other end is connected to a movable member. The plurality of pipe members are integrally combined by a cover member having flexibility. A liquid supply pipe is inserted with a space in the pipe member for liquid. A fluid for temperature adjustment is supplied to the space between the pipe member for liquid and the liquid supply pipe. | 11-27-2008 |
20100216259 | WET PROCESSING SYSTEM, WET PROCESSING METHOD AND STORAGE MEDIUM - A wet processing system detects a globule of a process solution in a drippy or dripping state from the tip of any one of process solution pouring nozzles being moved to a pouring position for pouring the process solution onto a substrate by obtaining image data on the process solution pouring nozzle, and takes proper measures to prevent the process solution from dripping. A wet processing system | 08-26-2010 |
20110220216 | LIQUID TREATMENT APPARATUS, MOUNTING AND DISMOUNTING METHOD OF A CUP BODY, AND STORAGE MEDIUM - A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position. | 09-15-2011 |
Tsunenaga Nakashima, Kumamoto JP
Patent application number | Description | Published |
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20090214759 | SOLUTION TREATMENT APPARATUS AND SOLUTION TREATMENT METHOD - In the present invention, a plurality of exhaust paths connected to a plurality of cup bodies surrounding substrate holding portions respectively are joined together for common use, and the openings of exhaust rate adjustment sections provided on the exhaust paths are adjusted with reference to data in which combinations of the numbers of rotations of the substrate holding portions are associated with combinations of set exhaust rates of the exhaust paths when solution treatment is performed by rotating the substrate by the substrate holding portion. According to the present invention, the cup body can be exhausted at an intended exhaust rate at all times independently of the state where the substrate in which cup body is subjected to which process. | 08-27-2009 |
20110159701 | CHEMICAL LIQUID SUPPLY NOZZLE AND CHEMICAL LIQUID SUPPLY METHOD - The present disclosure provides a chemical liquid supply nozzle capable of suppressing the drying process of chemical liquid with a low cost. The chemical liquid supply nozzle is provided with a cutoff valve and a suction unit that sucks chemical liquid to a suction flow path at a nozzle main body connected to a front end of flow path member. Accordingly, the chemical liquid remaining at the downstream side of the cutoff valve after the chemical liquid is discharged, is sucked toward the upstream side of the cutoff valve and removed, to thereby suppress the drying and solidifying process of the chemical liquid at the chemical liquid flow path. Also, there is no need to block the chemical liquid flow path by sucking thinner at the downstream side of chemical liquid flow path, and the number of dummy dispense may be reduced, thereby reducing an overall operation cost of the process. | 06-30-2011 |
Tsunenaga Nakashima, Koshi City JP
Patent application number | Description | Published |
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20110265896 | PROCESS LIQUID FEED MECHANISM - A process liquid feed mechanism includes a fixed cylinder with a thread around a peripheral surface, a movable cylinder provided coaxially with the fixed cylinder, a process liquid feed tube and an operating rotator. The movable cylinder is screw-engaged to the fixed cylinder. The process liquid feed tube is fixed in an axial position relative to the movable cylinder and passes through the lid and a cylinder including the fixed cylinder and the movable cylinder to be axially movable relative to the cylinder. The operating rotator includes an annular portion provided coaxially with the movable cylinder. An engaging portion and an engaged portion, which are provided in the movable cylinder and the annular portion respectively, rotate the movable cylinder through engagement therebetween with rotation of the operating rotator and release the engagement as a torque on the movable cylinder increases. | 11-03-2011 |
20130112223 | SUBSTRATE TREATMENT SYSTEM, SUBSTRATE TRANSFER METHOD, AND A NON-TRANSITORY COMPUTER STORAGE MEDIUM - In a coating and developing treatment system including a treatment station and an interface station, the interface station has: a cleaning unit cleaning a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting whether the cleaned wafer is in an exposable state; and a wafer transfer mechanism including an arm transferring the wafer between the cleaning unit and the inspection unit. Each of the cleaning unit and the inspection unit is provided at multiple tiers in an up and down direction on the front side in the interface station, and the wafer transfer mechanism is provided in a region adjacent to the cleaning units and the inspection units. | 05-09-2013 |
20130112224 | SUBSTRATE TREATMENT SYSTEM, SUBSTRATE TRANSFER METHOD AND COMPUTER STORAGE MEDIUM - An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit. | 05-09-2013 |