Patent application number | Description | Published |
20100219578 | Medium delivery apparatus and medium processing apparatus with dual pressing members - A media delivery apparatus includes a media insertion portion and a media delivery port. A media guide surface is configured to guide media toward the delivery port. The feed roller is configured to feed the media toward the delivery port. The first pressing member is configured to press the media against the feed roller and the second pressing member is configured to press the media against the media guide surface. A driving mechanism is configured to drive the first pressing member. The first pressing member is moved from a waiting position and toward the feed roller and the second pressing member is moved from a retreating position to a side of the media guide surface interlockingly with the first pressing member. The second pressing member reaches a position at which the second pressing member presses the media against the media guide surface after the first pressing member reaches a position at which the first pressing member presses the media against the feed roller. | 09-02-2010 |
20110024974 | MEDIUM DELIVERY DEVICE, MEDIUM PROCESSING APPARATUS AND CHECK DELIVERY DEVICE WITH A PRESSING UNIT - A medium delivery device comprising a medium insertion section into which a sheet-shaped medium to be delivered is inserted in a stacked state, first and second medium guide surfaces that are opposed to each other to guide the sheet-shaped medium to the medium delivery port, a feed roller that is disposed at a side of the first medium guide surface and delivers the sheet-shaped medium inserted into the medium insertion section, to the medium delivery port, a first pressing member that presses the sheet-shaped medium inserted into the medium insertion section against the feed roller, a second pressing member that presses the sheet-shaped medium inserted into the medium insertion section against the first medium guide surface at a position deviating from the feed roller, and a driving mechanism that drives the first pressing member in directions in which the first pressing member moves close to and away from the feed roller. | 02-03-2011 |
20120104684 | Sheet Media Feeding Device, Sheet Media Separation Method, and Sheet Media Processing Device - A sheet media feeding device comprising a media feed path for feeding sheet media; and a media separator for separating sheet media that are overlapping when advanced into the media feed path. The media separator includes a separation roller, a retard roller that is pressed against the separation roller and applies a torque load, and a media offsetting member for feeding the sheet media to a nipping part of the separation roller and the retard roller with the sheet media offset to the separation roller side. | 05-03-2012 |
20130001858 | MEDIA SEPARATING AND FEEDING DEVICE AND MEDIA PROCESSING DEVICE - A mechanism enables efficiently reducing the size of a check feeding device for separating and feeding checks one at a time. In one embodiment, a check separating and feeding mechanism uses a single drive motor to drive a feed roller, pressure member, and separation roller. When the drive motor turns in a second direction, torque is transferred through a second one-way clutch mechanism to both rollers. When the drive motor turns in this direction, the first one-way clutch mechanism disengages the drive motor from the drive power transfer path to the pressure member, and a tension spring pulls the pressure member in the direction pressing the checks to the feed roller. When the drive motor turns in an opposite first direction, the torque of the drive motor returns the pressure member to the standby position, drive power is not transferred to the rollers, and the rollers do not turn. | 01-03-2013 |
20130063752 | MEDIA PROCESSING DEVICE - A media processing device enables conveying media fed from different paths into a common path in a stable conveyance state to the scanning position of a scanner. A check processing device has a path switching member that selectively bridges a back path for conveying checks and a card path to a downstream path, which is a common path. The path switching member changes position and switches the connected paths in conjunction with movement of a shutter that covers the open part of a nozzle cap used to cap the nozzle face of the inkjet head at the back path. | 03-14-2013 |
20140268204 | MEDIA PROCESSING DEVICE - A media processing device enables conveying media fed from different paths into a common path in a stable conveyance state to the scanning position of a scanner. A check processing device has a path switching member that selectively bridges a back path for conveying checks and a card path to a downstream path, which is a common path. The path switching member changes position and switches the connected paths in conjunction with movement of a shutter that covers the open part of a nozzle cap used to cap the nozzle face of the inkjet head at the back path. | 09-18-2014 |
Patent application number | Description | Published |
20080197559 | Media processing device - A media processing device can convey checks at a constant speed passed an information reading position without slipping and without increasing the relay capacity of the transportation roller. The check processing device 1 has two transportation rollers | 08-21-2008 |
20080211163 | Medium delivery device, medium processing apparatus and check delivery device - A medium delivery device comprising a medium insertion section into which a sheet-shaped medium to be delivered is inserted in a stacked state, first and second medium guide surfaces that are opposed to each other to guide the sheet-shaped medium to the medium delivery port, a feed roller that is disposed at a side of the first medium guide surface and delivers the sheet-shaped medium inserted into the medium insertion section, to the medium delivery port, a first pressing member that presses the sheet-shaped medium inserted into the medium insertion section against the feed roller, a second pressing member that presses the sheet-shaped medium inserted into the medium insertion section against the first medium guide surface at a position deviating from the feed roller, and a driving mechanism that drives the first pressing member in directions in which the first pressing member moves close to and away from the feed roller. | 09-04-2008 |
20080317359 | PRINTING APPARATUS AND PRINTING METHOD | 12-25-2008 |
20090014943 | Media separating and feeding device and media processing device - A mechanism enables efficiently reducing the size of a check feeding device for separating and feeding checks one at a time. The check separating and feeding mechanism | 01-15-2009 |
20100272491 | Printing Apparatus And Printing Method - A printer has transportation paths for conveying media in two directions, including a first transportation path P | 10-28-2010 |
20110227997 | Printer Used with Rolled Sheet - In a printer, a first section is sized to accommodate a rolled sheet therein. A printing head is horizontally movable along a moving path extending in a first direction and operable to perform printing on a part of the rolled sheet which is drawn out from the first section. A second section is provided on a first side of the first section relative to the first direction. A third section is provided on a second side of the first section relative to the first direction opposite to the first side. A control board on which a circuit operable to control an operation of the printer is mounted is disposed in the first section so as to extend vertically. An ink supplying member is disposed in the third section that supplies ink to the printing head. The moving path is longer than a dimension of the first section in the first direction. | 09-22-2011 |
20120212541 | IMAGE PROCESSING DEVICE AND COVER ATTACHMENT STRUCTURE - An image processing device allows for easy removal of a process medium stuck in the conveyance path while protecting the image processing unit from the outside. In many embodiments, the device includes a conveyance path for conveying process media in a specific conveyance direction, an image processing unit having an ejection surface (process surface) disposed facing the conveyance path, and a first cover and a second cover disposed along the conveyance path and covering the conveyance path. Typically, the first and second covers open and close by pivoting on first and second pivot pins disposed in a direction intersecting the conveyance direction, and the first and second pivot pins are disposed adjacent the conveyance path upstream and downstream of the portion of the conveyance path facing the ejection surface. | 08-23-2012 |
20140139085 | IMAGE PROCESSING DEVICE AND COVER ATTACHMENT STRUCTURE - An image processing device allows for easy removal of a process medium stuck in the conveyance path while protecting the image processing unit from the outside. In many embodiments, the device includes a conveyance path for conveying process media in a specific conveyance direction, an image processing unit having an ejection surface (process surface) disposed facing the conveyance path, and a first cover and a second cover disposed along the conveyance path and covering the conveyance path. Typically, the first and second covers open and close by pivoting on first and second pivot pins disposed in a direction intersecting the conveyance direction, and the first and second pivot pins are disposed adjacent the conveyance path upstream and downstream of the portion of the conveyance path facing the ejection surface. | 05-22-2014 |
Patent application number | Description | Published |
20090032882 | SEMICONDUCTOR DEVICE HAVING INSULATED GATE FIELD EFFECT TRANSISTORS AND METHOD OF MANUFACTURING THE SAME - N-type semiconductor region and P-type semiconductor region are provided in a surface region of a semiconductor substrate. Insulating film and silicon containing film are laminated on the semiconductor substrate. P-type impurities are introduced into a first portion of the silicon containing film above the N-type semiconductor region. The first portion of the silicon containing film is thinned in the thickness direction. N-type impurities are introduced into a second portion of the silicon containing film above the P-type semiconductor region. A mask is provided on the silicon containing film. The first and second portions of the silicon containing film are etched together using the mask as an etching mask to form gate electrode films above the N-type and P-type semiconductor regions respectively. P-type and N-type impurities are introduced into the N-type and P-type semiconductor regions to form P-type and N-type source and drain layers. | 02-05-2009 |
20100203738 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device which includes a gate electrode formed in the shape substantially vertical to a semiconductor substrate is disclosed. A gate electrode is formed by anisotropically etching a gate electrode film having a metal-containing film formed on the semiconductor substrate via a gate insulating film to expose a portion of the gate insulating film. A modified film is formed on a side wall of the metal-containing film by modifying the side wall of the metal-containing film. The exposed portion of the gate insulating film is removed and a portion of the gate insulating film sandwiched between the semiconductor substrate and the metal-containing film is recessed so as to recede from the modified side wall of the metal-containing film by isotropically etching. A side portion of the metal-containing film protruding from the receded gate insulating film is removed by isotropically etching. | 08-12-2010 |
20110291178 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor device includes a substrate, a lower gate layer, a stacked body, a dummy electrode layer, an insulating film, and a channel body. The lower gate layer is provided above the substrate. The stacked body includes a plurality of insulating layers and a plurality of electrode layers alternately stacked above the lower gate layer. The dummy electrode layer is provided between the lower gate layer and the stacked body, made of the same material as the electrode layer, and thicker than each of the electrode layers. The insulating film includes a charge storage film provided on a side wall of a hole formed to penetrate through the stacked body and the dummy electrode layer. The channel body is provided on an inside of the insulating film in the hole. | 12-01-2011 |
20120142151 | SEMICONDUCTOR DEVICE HAVING INSULATED GATE FIELD EFFECT TRANSISTORS AND METHOD OF MANUFACTURING THE SAME - N-type semiconductor region and P-type semiconductor region are provided in a surface region of a semiconductor substrate. Insulating film and silicon containing film are laminated on the semiconductor substrate. P-type impurities are introduced into a first portion of the silicon containing film above the N-type semiconductor region. The first portion of the silicon containing film is thinned in the thickness direction. N-type impurities are introduced into a second portion of the silicon containing film above the P-type semiconductor region. A mask is provided on the silicon containing film. The first and second portions of the silicon containing film are etched together using the mask as an etching mask to form gate electrode films above the N-type and P-type semiconductor regions respectively. P-type and N-type impurities are introduced into the N-type and P-type semiconductor regions to form P-type and N-type source and drain layers. | 06-07-2012 |
20120241852 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor device includes a semiconductor substrate, plural stacked bodies, an insulating side wall, an interlayer insulating layer, and a contact. Plural stacked bodies are provided on the semiconductor substrate so as to extend in parallel to one another. Each of the plural stacked bodies includes a gate insulating layer, a gate electrode, and an insulating layer. The insulating side wall covers a side face of the gate electrode in an upper end part thereof and does not cover the side face of the gate electrode in a part thereof contacting the gate insulating layer. The interlayer insulating layer is provided on the semiconductor substrate and covers the stacked bodies. The contact is provided in the interlayer insulating layer between the stacked bodies and is connected to the semiconductor substrate. | 09-27-2012 |
20120244672 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can form a plurality of grooves extending in a first direction on a semiconductor substrate. The method can form an insulating layer on the inner face of the groove and on the top face of the semiconductor substrate. The method can deposit a first conductive layer on the insulating layer so as to fill in the groove. The method can deposit a second conductive layer on the first conductive layer. The method can form a hard mask in a region including part of a region immediately above the groove on the second conductive layer. The method can form a columnar body including the hard mask and the second conductive layer by etching the second conductive layer using the hard mask as a mask. | 09-27-2012 |
20120309202 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method for manufacturing a semiconductor device, includes forming a mask film on a base material. The base material includes a first portion made of a first material and a second portion made of a second material. The mask film includes a third portion located immediately above the first portion and made of a third material and a fourth portion located immediately above the second portion and made of a fourth material. The mask film has an opening formed in both the third portion and the fourth portion. | 12-06-2012 |
20130095626 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method for manufacturing a semiconductor device, includes: and forming, on an upper face of a silicon substrate, a plurality of concave portions extending in a first direction, performing, in a gas that contains fluorine or a fluoride, plasma processing on the silicon substrate in which the concave portions are formed. The method further includes performing, in a gas that contains hydrogen, thermal processing on the silicon substrate after completion of performing the plasma processing; forming an insulating film on an inner face of the concave portions after completion of performing the thermal processing; and forming a conductive film on the insulating film. | 04-18-2013 |