Patent application number | Description | Published |
20080197173 | Method for Forming Solder Bump and Method for Mounting Semiconductor Device - [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device. | 08-21-2008 |
20080251894 | Mounted Body and Method for Manufacturing the Same - A mounted body ( | 10-16-2008 |
20090115067 | MODULE HAVING BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUCH MODULE - An electronic component embedded module that can improve reliability of electric connection of inner vias, and a manufacturing method therefor are provided. A first electronic component ( | 05-07-2009 |
20090202142 | CIRCUIT BOARD, METHOD FOR TESTING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD - A circuit board according to the present invention comprises an insulating layer, a first electronic component mounted on the insulating layer, and a solder marker provided on the insulating layer. A first solder having a first melting point constitutes the solder marker. The first electronic component is mounted on the insulating layer via a second solder having a second melting point lower than the first melting point. | 08-13-2009 |
20090230546 | MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME - A mounted body of the present invention includes: a multilayer semiconductor chip | 09-17-2009 |
20100224986 | MOUNTED BODY AND METHOD FOR MANUFACTURING THE SAME - A mounted body ( | 09-09-2010 |
20140054757 | SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. | 02-27-2014 |
20140110827 | PRESSED-CONTACT TYPE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A pressed-contact type semiconductor device includes a power semiconductor element, on an upper surface of which at least a first electrode is formed and on a lower surface of which at least a second electrode is formed, lead frames which face the first electrode and the second electrode of the power semiconductor element respectively, and a clip which applies a pressure to the lead frames while the power semiconductor element is sandwiched by the lead frames, wherein a metallic porous plating part is formed on a surface which faces the first electrode or the second electrode, the surface being a surface of at least one of the lead frames. | 04-24-2014 |
20140231981 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device ( | 08-21-2014 |
Patent application number | Description | Published |
20080316900 | Optical pickup apparatus, recording/reproducing apparatus provided with the optical pickup apparatus, optical element, and information recording/reproducing method - An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted ray of the second light flux, where n stands for an integer other than zero. | 12-25-2008 |
20090016195 | Optical pickup apparatus, recording/reproducing apparatus provided with the optical pickup apparatus, optical element, and information recording/reproducing method - An optical pickup apparatus for reproducing information from an optical information recording medium or for recording information onto an optical information recording medium, is provided with a first light source for emitting first light flux having a first wavelength; a second light source for emitting second light flux having a second wavelength, the first wavelength being different from the second wavelength; a converging optical system having an optical axis and a diffractive portion, and a photo detector; wherein in case that the first light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the first light flux is greater than that of any other ordered diffracted ray of the first light flux, and in case that the second light flux passes through the diffractive portion to generate at least one diffracted ray, an amount of n-th ordered diffracted ray of the second light flux is greater than that of any other ordered diffracted ray of the second light flux, where n stands for an integer other than zero. | 01-15-2009 |
20090262635 | OBJECTIVE OPTICAL SYSTEM FOR OPTICAL PICKUP APPARATUS, OPTICAL PICKUP APPARATUS, DRIVING APPARATUS FOR OPTICAL INFORMATION RECORDING MEDIUM, CONDENSER LENS AND OPTICAL PATH COMPOUNDING ELEMENT - An objective lens system for an optical pickup apparatus, includes in order from an object side: a first lens group having negative paraxial power P | 10-22-2009 |