Patent application number | Description | Published |
20110046310 | ORGANOPOLYSILMETHYLENE AND A COMPOSITION COMPRISING THE SAME - The present invention provides an organopolysilmethylene represented by the following general formula (1): | 02-24-2011 |
20130181167 | SILICONE RESIN COMPOSITION, LUMINOUS SUBSTANCE-CONTAINING WAVELENGTH-CONVERTING FILM, AND CURED PRODUCT THEREOF - There is disclosed a silicone resin composition includes (A-1) a ladder structure-containing polyorganosiloxane having a ladder structure and having two or more alkenyl groups in one molecule, (B-1) a ladder structure-containing hydrogen polyorganosiloxane having a ladder structure and having hydrogen atoms that are bonded to two or more silicon atoms in one molecule, and/or (B-2) a hydrogen polyorganosiloxane having two or more hydrogen atoms that are bonded to silicon atoms in one molecule. As a result, there is provided the silicone resin composition as a light-emitting device protective material having a high transparency, heat resistance, light resistance and gas barrier. | 07-18-2013 |
20130183776 | UV-CURABLE ADHESIVE SILICONE COMPOSITION, UV-CURABLE ADHESIVE SILICONE COMPOSITION SHEET, OPTICAL SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A UV-curable adhesive silicone composition includes: (A) an organopolysiloxane having a resin structure consisting of R | 07-18-2013 |
20130200534 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - Described herein is a sealant laminated composite for collectively sealing a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed. The composite can include a support wafer and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer. In certain aspects, the sealant laminated composite is very versatile, even when a large diameter or thin substrate or wafer is sealed. In certain aspects, this can prevent the substrate or wafer from warping and the semiconductor devices from peeling; can collectively seal a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed on a wafer level; and can provide a sealant laminated composite that is excellent in the heat resistance and humidity resistance after sealing. | 08-08-2013 |
20130241087 | SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME - A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C., and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted; an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus. | 09-19-2013 |
20130271999 | THERMOSETTING SILICONE RESIN COMPOSITION FOR REFLECTOR OF LED, REFLECTOR FOR LED USING THE SAME AND OPTICAL SEMICONDUCTOR APPARATUS - A thermosetting silicone resin composition for an LED reflector has: a thermosetting resin; at least one kind of white pigment selected from titanium oxide, zinc oxide, zirconium oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate, and barium sulfate; and an inorganic filler other than the pigment, which contains at least one kind of inorganic filler that has an average particle diameter of 30 μm to 100 μm and a refraction index that is different from a refraction index of a cured material of the thermosetting resin by 0.05 or more, and at least one kind of inorganic filler that has an average particle diameter of less than 30 μm. The thermosetting resin composition provides a cured material that has excellent heat and light resisting properties and hardly leaks light, a reflector for an LED obtained by molding using the composition, and an optical semiconductor apparatus using the reflector. | 10-17-2013 |
20130274398 | THERMOSETTING SILICONE RESIN COMPOSITION FOR REFLECTOR OF LED, REFLECTOR FOR LED USING THE SAME AND OPTICAL SEMICONDUCTOR APPARATUS - A thermosetting silicone resin composition for reflector of LED has an organopolysiloxane represented by the following average compositional formula, and has at least two alkenyl groups in one molecule, a linear organohydrogen polysiloxane represented by the following formula and/or a branched organohydrogenpolysiloxane represented by the following formula, an addition reaction catalyst, a white pigment selected from titanium oxide, zinc oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate and barium sulfate, and an inorganic filler other than Component, | 10-17-2013 |
20140091483 | METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A method of manufacturing a semiconductor apparatus includes: a charging step of charging the thermosetting resin in excess of an amount necessary for forming the sealing layer to fill the inside of the first cavity with the thermosetting resin and discharging an excess of the thermosetting resin from the first cavity; an integrating step of integrating the substrate on which the semiconductor device is mounted, the substrate on which no semiconductor device is mounted and the sealing layer by molding the thermosetting resin while pressurizing the upper mold and the lower mold; and a dicing step of extracting the integrated substrates from the molding mold and dicing the integrated substrates to obtain an individual semiconductor apparatus. | 04-03-2014 |
20140124809 | THERMOSETTING SILICONE RESIN SHEET AND METHOD FOR PRODUCING THE SAME, AND LIGHT-EMITTING APPARATUS USING THE THERMOSETTING SILICONE RESIN SHEET AND METHOD FOR PRODUCING THE SAME - The present invention provides a thermosetting silicone resin sheet having a phosphor-containing thermosetting silicone resin layer formed in the form of an LED device and a method for producing the same, and a light-emitting apparatus using the thermosetting silicone resin sheet and a method for producing the same. The present invention was accomplished by the phosphor-containing thermosetting silicone resin sheet comprising a substrate film and a phosphor-containing thermosetting silicone resin layer that is a plastic solid or a semi-solid at room temperature composed of a single layer having no adhesive layer, formed by printing and molding a phosphor-containing thermosetting silicone resin composition on the substrate film in the form of an LED device. | 05-08-2014 |
20140138856 | FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material. | 05-22-2014 |
20140138857 | ENCAPSULANT EQUIPPED WITH SUPPORTING SUBSTRATE, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTING THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMING THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The invention provides an encapsulant equipped with the supporting substrate which is an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant equipped with the supporting substrate comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction. | 05-22-2014 |
20140182657 | CONCENTRATING SOLAR CELL MODULE AND METHOD FOR PRODUCING CONCENTRATING SOLAR CELL MODULE - The present invention provides a concentrating solar cell module comprising: a base portion having a plurality of mounting regions for mounting solar cells and a plurality of lead electrodes for electrically connecting the solar cells with external electrodes; a support molded with a thermosetting resin such that each of the mounting regions of the base portion is surrounded; the solar cells mounted on the mounting regions; and a condensing lens molded above the mounting regions so as to encapsulate the solar cells, wherein a surface of the mounting regions of the base portion is plated and the condensing lens is molded with a transparent thermosetting silicone resin. The concentrating solar cell module has high heat dissipation properties and a high photoelectric conversion efficiency. | 07-03-2014 |
20140199909 | SILICONE-ORGANIC RESIN COMPOSITE LAMINATE AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING SEMICONDUCTOR APPARATUS USING THE SAME - The invention provides a silicone-organic resin composite laminate comprises a laminate in which an organic resin layer containing an inorganic fiber cloth into which a thermosetting organic resin has been impregnated, and a silicone resin layer containing an inorganic fiber cloth into which a curable silicone resin has been impregnated, being laminated with each one or more layers, and metal foils laminated at an uppermost surface and a lowermost surface of the laminate. There can be provided a silicone-organic resin composite laminate which has low linear expansion, good thermal dimensional stability, excellent mechanical characteristics, and excellent heat resistance and light resistance, and is suitable as a mounting substrate for an LED which corresponds to increase in luminance of the LED mounted substrate. | 07-17-2014 |
20140264956 | SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - Disclosed is a sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices may be mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices may be formed, including a support wafer that may be composed of silicon and an uncured resin layer that may be constituted of an uncured thermosetting resin formed on one side of the support wafer. | 09-18-2014 |
20150028497 | ENCAPSULANT WITH BASE FOR USE IN SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured. | 01-29-2015 |