Patent application number | Description | Published |
20110155968 | FINE METAL PARTICLE-CONTAINING COMPOSITION AND METHOD FOR MANUFACTURING THE SAME - A metal-containing composition that can provide, by low-temperature heat treatment, a sintered state comparable to that obtained by high-temperature heat treatment, a conductive paste, a metal film are provided. A method for manufacturing a metal-containing composition that can manufacture the metal-containing composition by simple operation steps is also provided. The metal-containing composition contains fine metal particles, and the ratio ρ | 06-30-2011 |
20110272642 | COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THEREOF, METHOD FOR PRODUCING FINE SILVER PARTICLES, AND PASTE HAVING FINE SILVER PARTICLES - A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided. | 11-10-2011 |
20110278508 | COMPOSITION CONTAINING FINE SILVER PARTICLES, PRODUCTION METHOD THEREOF, METHOD FOR PRODUCING FINE SILVER PARTICLES, AND PASTE HAVING FINE SILVER PARTICLES - A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided. | 11-17-2011 |
20120103515 | BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD - In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point. | 05-03-2012 |
20120298009 | BONDING MATERIAL AND BONDING METHOD USING THE SAME - A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower. | 11-29-2012 |
20120298908 | HEXAGONAL FERRITE MAGNETIC POWDER AND MAGNETIC RECORDING MEDIUM USING THE SAME - A hexagonal ferrite magnetic powder with a reduced amount of contaminants such as organic materials and a magnetic recording medium using the same are provided. The magnetic recording medium is formed using such a hexagonal ferrite magnetic powder that, when 0.10 mol/L nitric acid is added in an amount that changes the pH of 100 mL of a pH 11 potassium hydroxide solution (a blank solution) to 5 to a solution prepared by adding 0.05 g of the powder to 100 mL of the pH 11 potassium hydroxide solution, the pH of the resultant solution is 5 or higher. | 11-29-2012 |
20130081759 | LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USING THE BONDING MATERIAL - Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination. | 04-04-2013 |
20130153835 | LOW-TEMPERATURE SINTERING CONDUCTIVE PASTE, CONDUCTIVE FILM USING THE SAME, AND METHOD FOR FORMING CONDUCTIVE FILM - When a substrate having a low heat resistance is used, heat treatment at approximately 120° C. at which deformation does not occur is desirable. When a low resistance is achieved regardless of the type of resin used for a conductive paste, a flexible design of a paste is possible according to purposes, and fields to which the paste could be applied are expanded. Thus, a conductive paste capable of forming a conductive film exhibiting a high conductivity even at low temperatures of approximately 120° C. regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin is provided. In a method for forming a conductive film, a conductive paste in which a dicarboxylic acid having 2 to 8 carbon atoms is added to a paste including silver nanoparticles coated with an organic substance having 2 to 6 carbon atoms, a dispersion medium, and a resin is used. | 06-20-2013 |
20130270488 | METAL PARTICLE POWDER AND PASTE COMPOSITION USING SAME - It is important that the metal particles used in a conductive paste used for wiring have the characteristic of being easily dispersed in a polar solvent in combination with another material such as a resin used in a paste. Provided is a metal particle powder which exhibits a pH value of 6 or less when 0.5 g of the metal particles to be evaluated are added to 100 mL of a potassium hydroxide solution with a pH of 11, and then an aqueous nitric acid solution in an amount in which pH becomes 5 by adding 0.10 mol/L nitric acid to 100 mL of a potassium hydroxide solution and 10 mL of ethyl alcohol (blank solution) with a pH of 11 is added. | 10-17-2013 |
20140346413 | SILVER-COATED COPPER ALLOY POWDER AND METHOD FOR PRODUCING SAME - A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D | 11-27-2014 |