Patent application number | Description | Published |
20080224149 | Silicon Carbide Semiconductor Device and Manufacturing Method Thereof - The present invention provides a silicon carbide semiconductor device comprising a semiconductor substrate comprising silicon carbide, which contains a first conductivity type impurity diffused therein in a high concentration, a semiconductor layer formed over the semiconductor substrate and containing the first conductivity type impurity diffused therein in a low concentration, a plurality of well regions formed on a front surface side of a cell forming area set to the semiconductor layer and in which a second conductivity type impurity corresponding to a type opposite to the first conductivity type impurity is diffused, source layers formed on the front surface side lying within the well regions and each containing the first conductivity type impurity diffused therein in a high concentration, an outer peripheral insulating film thick in thickness, which is formed over the semiconductor layer in an outer peripheral area that surrounds the cell forming area, a gate oxide film formed over the front surface of the semiconductor layer in the cell forming area, and a gate electrode layer formed so as to extend from above the gate oxide film to above the outer peripheral insulating film, wherein each of steplike portions adjacent to the outer peripheral insulating film and thicker than the gate oxide film in thickness is provided at an edge portion of the gate oxide film. | 09-18-2008 |
20080253820 | Sheet Postprocessing Apparatus - A sheet hold flap | 10-16-2008 |
20080290348 | Semiconductor device - In the present invention, a vertical MOSFET is formed by growing epitaxial Si on a SiC substrate and forming a Si oxide layer on the Si. In particular, a semiconductor device according to the present invention includes a SiC substrate, and an epitaxial Si layer formed on a surface of the SiC substrate, and a Si oxide layer formed on the epitaxial Si layer, and a gate electrode formed on the Si oxide layer, and a source region formed in the epitaxial Si layer, and a drain electrode connected to the SiC substrate. | 11-27-2008 |
20090047058 | Binder | 02-19-2009 |
20090075451 | Method for manufacturing semiconductor substrate - The present invention provides a method for manufacturing a semiconductor substrate in which a semiconductor wafer, formed of a material less likely to increase the hole diameter, is processed to a semiconductor substrate actually applicable to an existing manufacture line. An SiC wafer | 03-19-2009 |
20090081880 | Method for manufacturing semiconductor device - The present invention provides a method for manufacturing a semiconductor device includes: a immersion process of immersing, in a fluoronitric acid solution, a lamination substrate, in which an SiC substrate formed of a silicon carbide (SiC) single crystal is applied to a silicon substrate or a quarts substrate with a larger hole diameter than the SiC substrate; and a peeling process of taking out the SiC substrate which is not dissolved and remains in the fluoronitric acid solution after the silicon substrate or the quartz substrate is dissolved and removed from the fluoronitric acid solution. | 03-26-2009 |
20090212087 | Staple cartridge - An opening portion ( | 08-27-2009 |
20090221139 | Method of producing semiconductor device - A method of producing a semiconductor device includes the steps of: forming an oxide film on a silicon carbide substrate; forming a gate electrode layer on the oxide film; patterning the gate electrode layer to form a gate electrode; and processing thermally the gate electrode layer or the gate electrode under an oxidation environment. Further, the gate electrode layer or the gate electrode is thermally processed under the oxidation environment at a temperature between 750° C. and 900° C. | 09-03-2009 |
20100150683 | BIND PROCESSING METHOD, BIND PROCESSING DEVICE AND BINDER CARTRIDGE - A binder cartridge ( | 06-17-2010 |