| Patent application number | Description | Published |
|---|
| 20090052835 | MULTILAYER WIRING BOARD - The present invention provides a multilayer wiring board in which warpage during reflow soldering can be reduced even if there is no sufficient space for disposing a dummy pattern or if a dummy pattern cannot be disposed. A difference between the ratios of copper remaining in wiring layers causes a difference between the amounts of thermal expansion of the wiring layers. The fiber bundle content of at least one resin base material layer is made different from that of the other resin base material layers, to cause a difference between the amounts of thermal expansion of the resin base material layers. This difference between the amounts of thermal expansion of the resin base material layers is used to cancel the difference between the amounts of thermal expansion of the wiring layers. Thus, warpage of the board during reflow soldering is reduced. | 02-26-2009 |
| 20100116530 | MULTILAYERED WIRING BOARD - A multilayered wiring board is composed of n wiring layers and (n−1) resin base material layers, which are alternately laminated. The (n−1) resin base material layers include fiber bundles impregnated with resin. The n wiring layers include wiring patterns and resin. When half of the wiring layers in the thickness direction of the multilayered wiring board differ in the copper remaining ratio from the other half, the multilayered wiring board might be warped during heating. The crossing point density of fiber bundles in each resin base material layer is adjusted so as to cancel the warpage caused by the difference in the copper remaining ratio between the wiring layers. | 05-13-2010 |
| 20100127594 | INDUCTOR-TYPE SYNCHRONOUS MACHINE - An inductor-type synchronous machine having an axial gap structure, which has a shaft portion at the center thereof, the machine includes: a field-side stator which has a yoke made of a magnetic material and a field body protruding from the yoke in an axial direction of the shaft portion to form an N pole and an S pole in a radial direction; a rotor which has N pole inductors disposed so as to be opposed to the N pole formed by the field body and S pole inductors disposed so as to be opposed to the S pole formed by the field body; and an armature-side stator in which an armature coil is disposed so as to be opposed to the N pole inductors and the S pole inductors. | 05-27-2010 |
| 20100141060 | AXIAL MOTOR - An axial motor includes an armature side stator ( | 06-10-2010 |
| 20100148625 | SUPERCONDUCTING DEVICE AND AXIAL-TYPE SUPERCONDUCTING MOTOR - A superconducting device includes a coil formed of a superconducting wire, an iron core to which the coil is attached, and a magnetic material arranged in a magnetic circuit and magnetized by magnetic flux. The magnetic circuit is generated by energization of the coil and passes through the iron core. A gap is formed between the coil and the iron core, or/and a nonmagnetic material is interposed between the coil and the iron core. | 06-17-2010 |
| 20100283564 | SUPERCONDUCTING COIL APPARATUS AND INDUCTOR-TYPE SYNCHRONOUS MACHINE - This superconducting coil apparatus includes: a cylindrical coil container which has an inner circumferential surface and an outer circumferential surface; a superconducting coil which is stored in the coil container to be cooled so that a superconducting member is wound on the inner circumferential surface; and a columnar magnetic body which is fitted to the inner circumferential surface of the coil container. | 11-11-2010 |
| 20100294554 | MULTILAYER WIRING BOARD - Saddle warpage of a wiring board at the time of reflow soldering is reduced by canceling out a difference in thermal expansion amount between wiring layers with anisotropy due to variations between the wiring layers in the proportion of copper remaining in the wiring layers C and non-uniformity of wiring elements by a difference in thermal expansion amount with anisotropy between resin base material layers produced according to the material of fiber bundles forming a warp or a weft in at least one resin base layer B, different from the material of other fiber bundles. | 11-25-2010 |
