Patent application number | Description | Published |
20090303581 | Laminated Glass with Shade Band - An object of the present invention is to provide a laminated glass which reduces light transmittance loss of a certain region thereof at a predetermined wavelength, particularly within a near-IR (750 to 1,000 nm) range and which facilitates provision of an optical instrument employing the near-IR light without partial substitution of an intermediate film. The invention provides a laminated glass for vehicle formed of two glass sheets stuck with a thermoplastic resin film, wherein the laminated glass has a first region and a second region; the second region is provided in a belt-like form along upper side of the laminated glass when the laminated glass is secured onto the vehicle; the first region has a visible light transmittance of 70% or higher; the second region has a visible light transmittance of 5% to 50%; the difference, in a light transmittance within a wavelength range of 750 to 1,000 nm, between the first region and the second region is 5% or less; and the second region has a light transmittance of 25% or higher, within a wavelength range of 750 to 1,000 nm. | 12-10-2009 |
20100269538 | OIL SEPARATOR AND COMPRESSOR FOR REGENERATIVE REFRIGERATOR - An oil separator, includes a first cylindrical-shaped punching plate having a plurality of first piercing holes; a second cylindrical-shaped punching plate having a plurality of second piercing holes, the second cylindrical-shaped punching plate being situated inside the first cylindrical-shaped punching plate; a filter member received between the first cylindrical-shaped punching plate and the second cylindrical-shaped punching plate, the filter member being configured to eliminate oil contained in a coolant gas; a filter element where the coolant gas moves from the second cylindrical-shaped punching plate to the first cylindrical-shaped punching plate; and a part configured to control leaking oil leaking from the first piercing holes of the first cylindrical-shaped punching plate so that the leaking oil flows on a surface of the first cylindrical-shaped punching plate excluding positions of the first piercing holes. | 10-28-2010 |
20110159782 | SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, AND APPARATUS FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD USED IN POLISHING APPARATUS - An apparatus for polishing a substrate is provided. The apparatus includes: a rotatable polishing table supporting a polishing pad; a substrate holder configured to hold a substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate; a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad; a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface; and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector. | 06-30-2011 |
20120220196 | POLISHING APPARATUS HAVING TEMPERATURE REGULATOR FOR POLISHING PAD - A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage. | 08-30-2012 |
20120240537 | OIL SEPARATOR - A disclosed oil separator provided in a flow path of a refrigerant gas flowing from a compressor to a refrigerator including a filter configured to form an internal space by including a filter material filtering out oil from the refrigerant gas, an upper lid bonded to an upper portion of the filter material, and a lower lid bonded to a lower portion of the filter material; a body accommodating the filter; a gas inlet pipe introducing the refrigerant gas into the internal space; and a gas outlet pipe ejecting the refrigerant gas from which the oil is filtered out by the filter from an upper portion of the body, wherein a lower end of the gas inlet pipe is opened to the internal space at a position higher than the lower lid and lower than a substantial center between the upper lid and the lower lid. | 09-27-2012 |
20130023186 | METHOD AND APPARATUS FOR POLISHING A SUBSTRATE - A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit. | 01-24-2013 |
20140087629 | PRESSURE REGULATOR, POLISHING APPARATUS HAVING THE PRESSURE REGULATOR, AND POLISHING METHOD - A pressure regulator includes: a pressure-regulating valve configured to regulate pressure of a fluid supplied from a fluid supply source; a first pressure sensor configured to measure the pressure regulated by the pressure-regulating valve; a second pressure sensor located downstream of the first pressure sensor; a PID controller configured to produce a correction pressure command value for eliminating a difference between a pressure command value and a pressure value of the fluid measured by the second pressure sensor; and a regulator controller configured to control operation of the pressure-regulating valve so as to eliminate a difference between the correction pressure command value and a pressure value of the fluid measured by the first pressure sensor. | 03-27-2014 |
20140127973 | POLISHING METHOD AND POLISHING APPARATUS - A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad. | 05-08-2014 |
20140216505 | SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD - A substrate cleaning apparatus includes: a pure water supply line provided with a pure water flow regulator and a pure water supply valve; chemical supply lines each provided with a chemical flow regulator and a chemical supply valve; a merging line where pure water and a plurality of liquid chemicals meet to form a cleaning liquid; a cleaning liquid supply line configured to supply the cleaning liquid to a substrate; and a controller configured to control the pure water flow regulator, the pure water supply valve, the chemical flow regulators, and the chemical supply valves such that the pure water and the plurality of liquid chemicals are present at a predetermined ratio at a meeting point. | 08-07-2014 |
20140345658 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus | 11-27-2014 |
20140364040 | SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, AND APPARATUS FOR REGULATING TEMPERATURE OF POLISHING SURFACE OF POLISHING PAD USED IN POLISHING APPARATUS - An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector. | 12-11-2014 |
20150027155 | COMPRESSOR AND COOLING SYSTEM - A compressor includes: a heat exchanger configured to discharge heat generated during compression outside the compressor; a cooling liquid inlet port through which cooling liquid flowing from outside the compressor into the compressor passes; and a cooling liquid outlet port through which the cooling liquid flowing out of the compressor from inside the compressor passes. The compressor is configured such that an operation mode is switchable between a first mode in which the cooling liquid passing through the cooling liquid inlet port flows in the heat exchanger in a predetermined first direction and passes through the cooling liquid outlet port, and a second mode in which the cooling liquid passing through the cooling liquid inlet port flows in the heat exchanger in a second direction opposite to the first direction and passes through the cooling liquid outlet port. | 01-29-2015 |
20150047377 | MONITORING METHOD AND COOLING SYSTEM - A cooling system is provided with a GM refrigerator using helium gas, a compressor that compresses the helium gas returned from the GM refrigerator and supply the gas to the GM refrigerator, and a control unit. The control unit includes a measurement acquisition unit that acquires measurements of a plurality of different parameters representing a status of the GM refrigerator, or the compressor, or both, and an analysis unit that conducts multivariate analysis of the measurements acquired by the measurement acquisition unit. | 02-19-2015 |
20150079881 | POLISHING METHOD AND POLISHING APPARATUS - A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad. | 03-19-2015 |