Patent application number | Description | Published |
20110209335 | METHOD FOR MANUFACTURING INK JET CARTRIDGE - A predetermined amount of an ink absorber, which is a fiber assembly in which intersections between fibers are not fused together, is charged into a compression and insertion apparatus. A rectangular parallelepiped-shaped insertion block is moved to an upper surface portion of the absorber, and one face of the ink absorber is pushed by a side plate. As such, a part excluding the part of the ink absorber which faces the side plate is compressed and surrounded. In this state, the ink absorber is compressed by the side plate. The ink absorber is inserted into a tank case by making a bottom plate slide, thereby opening the bottom face of the ink absorber and by moving down the insertion block. | 09-01-2011 |
20110211028 | INK JET CARTRIDGE AND MANUFACTURING METHOD OF INK JET CARTRIDGE - The ink jet cartridge includes a tank case that has a space having a opening, a lid that closes the opening, an ink accommodating section that is formed with the space of the tank case and the lid, and an ink absorber that is accommodated in the ink accommodating section. Also, an atmosphere communication port that passes through the lid and a projection section that projects to the space of the tank case are provided in the lid. The ink absorber consists of a fiber aggregate, and a welding section in which the fibers are combined to each other and an unwelded section in which the fibers are not combined to each other are provided on a surface that faces the lid. | 09-01-2011 |
20120000376 | METHOD FOR MANUFACTURING FIBER ABSORBER - A method for manufacturing a fiber absorber includes:
| 01-05-2012 |
20130063523 | LIQUID RECORDING HEAD AND METHOD OF MANUFACTURING THE SAME - Provided is a liquid recording head in which a protective layer having resistance to liquid and an adhesiveness improving film are disposed on a second surface opposite to a first surface of a silicon substrate. The first surface and the second surface have a plane direction. The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates to a liquid introduction port on a side of the second surface of the silicon substrate. | 03-14-2013 |
20140216630 | METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD - A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes:
| 08-07-2014 |
20140218445 | METHOD OF MANUFACTURING LIQUID EJECTION HEAD, AND LIQUID EJECTION HEAD - There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths. | 08-07-2014 |
20140300667 | LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME - A liquid discharge head includes a recording element substrate comprising a semiconductor substrate having an energy generating element configured to generate energy for discharging liquid, on a first surface, a flow path forming member disposed on the first surface, and in which a discharge port configured to discharge the liquid and a liquid flow path in communication with the discharge port are formed, and a connection terminal disposed in a vicinity of an end portion of the first surface, and an electric wiring substrate electrically connected to the connection terminal. The recording element substrate includes an insulating resin layer disposed in a vicinity of the end portion of the first surface and outward from the connection terminal, and an adhesiveness improving layer disposed between the insulating resin layer and the semiconductor substrate, and configured to improve adhesiveness between the insulating resin layer and the semiconductor substrate. | 10-09-2014 |
20150217569 | LIQUID EJECTING HEAD MANUFACTURING METHOD AND LIQUID EJECTING HEAD - Precise positioning of a film used to seal an electrical connection on a liquid ejecting head is made possible. Specifically, positioning is conducted in a state in which part of the film is held to a finger by suction. Next, the finger is moved downward while in the positioned state, and part of the film is pressed against a wiring board. With part of the film fixed to the wiring board in this way, a sealing resin flows while being covered by the film. Consequently, shifting of the position of the film as the sealing resin flows may be prevented. As a result, it becomes possible to conduct covering with the film in a precisely positioned state. | 08-06-2015 |