Patent application number | Description | Published |
20090133237 | PIEZOELECTRIC DEVICE AND METHOD OF MANUFACTURING PIEZOELECTRIC RESONATORS - A piezoelectric resonator comprises a piezoelectric material layer | 05-28-2009 |
20120091547 | RESONATOR AND PRODUCTION METHOD THEREOF - A resonator using the MEMS technology is provided which improves the accuracy of a shape of electrodes so as avoid a short circuit that would otherwise be caused between input and output electrodes to thereby increase the reliability thereof. A resonator includes a substrate | 04-19-2012 |
20120169423 | RADIO FREQUENCY AMPLIFIER CIRCUIT - A radio frequency amplifier circuit according to the present invention is for providing a radio frequency amplifier circuit with high output and high efficiency, and includes (i) a first harmonic processing circuit ( | 07-05-2012 |
20130106519 | RADIO FREQUENCY AMPLIFIER CIRCUIT | 05-02-2013 |
20130176079 | RADIO FREQUENCY POWER AMPLIFIER - A radio frequency power amplifier includes: an amplifying element which amplifies an input signal and outputs the signal from an output terminal; and an output load circuit which includes a first resonant circuit and a second resonant circuit that are connected to the output terminal. The first resonant circuit has a resonance frequency higher than the frequency of the second harmonic of the input signal, and the second resonant circuit has a resonance frequency lower than the frequency of the third harmonic of the input signal. The output load circuit has such an impedance looking from the output terminal that a phase of a reflection coefficient at the second harmonic of the input signal is greater than 180 degrees and less than 360 degrees, and a phase of a reflection coefficient at the third harmonic of the input signal is greater than 0 degrees and less than 180 degrees. | 07-11-2013 |
20140077345 | SEMICONDUCTOR PACKAGE, METHOD AND MOLD FOR PRODUCING SAME, INPUT AND OUTPUT TERMINALS OF SEMICONDUCTOR PACKAGE - A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface. | 03-20-2014 |
20140191809 | RADIO FREQUENCY AMPLIFIER CIRCUIT - A radio frequency amplifier circuit includes a transistor and an output-side matching circuit. The output-side matching circuit includes a first distributed constant line to which a radio frequency signal from the transistor is transmitted, a flat plate lead terminal transmitting the radio frequency signal from the first distributed constant line to an outside of the package, and a capacitive element having one electrode that is connected to the lead terminal and the other electrode that is grounded. A back surface of the lead terminal is joined to a resin substrate, and the capacitive element and the first distributed constant line are disposed adjacent to each other, with an alignment direction of the capacitive element and the first distributed constant line intersecting an alignment direction of the first distributed constant line and the lead terminal. | 07-10-2014 |
20140231418 | MICROWAVE HEATING DEVICE - An aspect of the present invention provides a microwave heating device for an object having a plurality of parts, the microwave heating device including: a plurality of antennas which emits microwaves to a heating chamber inside; a sensor which detects information from a block model assigned the information indicating a characteristic of each of the parts; a display and input operation unit configured to receive an input of heating conditions for the object; an electromagnetic field analysis unit configured to derive a heating profile by electromagnetic field analysis based on the information detected by the sensor and the heating conditions inputted to the display and input operation unit, the heating profile including microwave emitting conditions for the object; and a control unit configured to control performance of the microwaves emitted from the antennas based on the derived heating profile. | 08-21-2014 |