Patent application number | Description | Published |
20100071178 | Method for Manufacturing Semiconductor Device - To reduce current consumption in a frequency-division circuit, particularly in a multistage frequency-division circuit, in a multistage frequency-division circuit, an inputted signal has a higher frequency in a preceding stage, and an inputted signal has a lower frequency in a following stage. Thus, placement is performed preferentially from the basic cell corresponding to the frequency-division circuit into which a signal having a higher frequency is inputted, and then wiring connection is performed. In other words, the layout of a plurality of basic cells corresponding to a multistage frequency-division circuit is performed so that, as compared to a wiring into which a signal having a lower frequency is inputted, a wiring into which a signal having a higher frequency is inputted has a shorter wiring length and has less intersection with other wirings, so that parasitic capacitance and parasitic resistance of the wiring are reduced. | 03-25-2010 |
20100079179 | Semiconductor Device - It is an object of the present invention to provide a semiconductor device that has a simple circuit structure, a small scale, and low power consumption, and can generate a desired clock signal. The semiconductor device has a clock generation circuit which generates a clock signal by dividing a modulated carrier wave, a divider circuit which generates a first divided signal by dividing a carrier wave, and a correction circuit which generates a second divided signal by further dividing the first divided signal, and has a function of performing correction for inverting the second divided signal in a period corresponding to a half period of the clock signal during modulation of the carrier wave and selecting whether the correction is performed or not. | 04-01-2010 |
20100080074 | SEMICONDUCTOR MEMORY DEVICE - Easy and fast memory access with correcting defects is to be realized. In a spare memory in a semiconductor memory device, a redundant memory cell array that stores the number of correcting defects is provided. When a signal from the outside is received, the signal is switched to the redundant memory cell array, and the number of correcting defects is judged. Then, based on the result of the judgment, it is determined the judgment of a defective memory cell is continued or the judgment is finished to write data to a main memory cell. By providing the redundant memory cell array that stores the number of correcting defects, a state of correcting defects can be observed fast in such a manner. | 04-01-2010 |
20100163631 | Semiconductor Device, Electronic Appliance Using Semiconductor Device, and Document Using Semiconductor Device - A semiconductor device capable of wireless communication which has low power consumption in a step for decoding an encoded signal to obtain data is provided. The semiconductor device includes an antenna configured to convert received carrier waves into an AC signal, a rectifier circuit configured to rectify the AC signal into a DC voltage, a demodulation circuit configured to demodulate the AC signal into an encoded signal, an oscillator circuit configured to generate a clock signal having a certain frequency by supply of the DC voltage, a synchronizing circuit configured to generate a synchronized encoded signal by synchronizing the encoded signal obtained by demodulating the AC signal with the clock signal, a decoder circuit configured to decode the synchronized encoded signal into a decoded signal, and a register configured to store the decoded signal as a clock (referred to as a digital signal). | 07-01-2010 |
20100205519 | CYCLIC REDUNDANCY CHECK CIRCUIT AND SEMICONDUCTOR DEVICE HAVING THE CYCLIC REDUNDANCY CHECK CIRCUIT - An object of the present invention is to provide a CRC circuit with more simple structure and low power consumption. The CRC circuit includes a first shift register to a p-th shift register, a first EXOR to a (p−1)th EXOR, and a switching circuit. A data signal, a select signal, and an output of a last stage of the p-th shift register are inputted to the switching circuit, and the switching circuit switches a first signal or a second signal in response to the select signal to be outputted. | 08-12-2010 |
20100289331 | ELECTRIC POWER SUPPLY SYSTEM AND ELECTRIC POWER SUPPLY SYSTEM FOR MOTOR VEHICLE - To provide for a movable electronic device a power receiving device that when charging a battery, simplifies charging of the battery from a power feeder, which is a power supply means, and does not have faults due to an external factor relating to a relay terminal, or damage of the relay terminal, that are caused by directly connecting the battery and the power feeder, and further, to provide an electronic device including the power receiving device. An antenna circuit and a booster antenna for supplying electric power are provided in a movable electronic device. The antenna circuit receives a radio signal such as an electromagnetic wave via the booster antenna, and electric power that is obtained through the receiving of the radio signal is supplied to the battery through a signal processing circuit. | 11-18-2010 |
20110079650 | SEMICONDUCTOR DEVICE HAVING WIRELESS COMMUNICATION FUNCTION - A semiconductor device includes a memory portion, a logic portion, and a plurality of signal lines for electrically connecting the memory portion and the logic portion. In the case where a transfer rate between the semiconductor device and a communication device is α [bps], a first clock frequency generated in the logic portion is Kα [Hz] (K is an integer of 1 or more), the number of reading signal lines of the plurality of signal lines is n (n is an integer of 2 or more), and a second clock frequency generated in the logic portion is Lα/n [Hz] (L is any integer satisfying L/n04-07-2011 | |
20110315780 | SEMICONDUCTOR DEVICE AND WIRELESS COMMUNICATION SYSTEM USING THE SAME - Initialization of a semiconductor device can be efficiently performed, which transmits and receives data through wireless communication. The semiconductor device includes an antenna, a power source circuit, a circuit which uses a DC voltage generated by the power source circuit as a power source voltage, and a resistor. The antenna includes a pair of terminals and receives a wireless signal (a modulated carrier wave). The power source circuit includes a first terminal and a second terminal and generates a DC voltage between the first terminal and the second terminal by using a received wireless signal (the modulated carrier wave). The resistor is connected between the first terminal and the second terminal. In this manner, the semiconductor device and the wireless communication system can transmit and receive data accurately. | 12-29-2011 |
20140027882 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In a semiconductor device including a digital circuit portion and an analog circuit portion having a capacitor portion provided over a substrate, the capacitor portion is provided with a first wiring, a second wiring and a plurality of blocks each having a plurality of capacitor elements. Further, each the plurality of capacitor elements provided in each block has a semiconductor film having a first impurity region and a plurality of second impurity regions provided apart with the first impurity region interposed therebetween, and a conductive film provided over the first impurity region with an insulating film therebetween. A capacitor is formed from the first impurity region, the insulating film, and the conductive film. | 01-30-2014 |
Patent application number | Description | Published |
20090079572 | Semiconductor device and wireless communication system using the same - Initialization of a semiconductor device can be efficiently performed, which transmits and receives data through wireless communication. The semiconductor device includes an antenna, a power source circuit, a circuit which uses a DC voltage generated by the power source circuit as a power source voltage, and a resistor. The antenna includes a pair of terminals and receives a wireless signal (a modulated carrier wave). The power source circuit includes a first terminal and a second terminal and generates a DC voltage between the first terminal and the second terminal by using a received wireless signal (the modulated carrier wave). The resistor is connected between the first terminal and the second terminal. In this manner, the semiconductor device and the wireless communication system can transmit and receive data accurately. | 03-26-2009 |
20090255995 | Semiconductor device and wireless communication system - Among transistors used in an analog circuit portion of the semiconductor device, particularly in a high frequency circuit, a power supply circuit, and a data demodulation circuit, and transistors used in a digital circuit portion (logic circuit portion), a gate length of a transistor in the analog circuit portion is not less than a gate length of a transistor in the digital circuit portion. As a result, when an excess voltage is supplied, voltage in the analog circuit with a long gate length is suppressed to prevent the damage of elements such as transistors in the digital circuit portion to which a signal is inputted from the analog circuit. | 10-15-2009 |
20100258811 | Semiconductor Device and Method of Manufacturing the Same - In manufacturing a semiconductor device, static electricity is generated while contact holes are formed in an interlayer insulating film by dry etching. Damage to a pixel region or a driving circuit region due to travel of the static electricity generated is prevented. Gate signal lines are spaced apart from each other above a crystalline semiconductor film. Therefore a first protective circuit is not electrically connected when contact holes are opened in an interlayer insulating film. The static electricity generated during dry etching for opening the contact holes moves from the gate signal line, damages a gate insulating film, passes the crystalline semiconductor film, and again damages the gate insulating film before it reaches the gate signal line. As the static electricity generated during the dry etching damages the first protective circuit, the energy of the static electricity is reduced until it loses the capacity of damaging a driving circuit TFT. The driving circuit TFT is thus prevented from suffering electrostatic discharge damage. | 10-14-2010 |
20120235153 | Semiconductor Device and Method of Manufacturing the Same - In a semiconductor device, gate signal lines are spaced apart from each other above a crystalline semiconductor film. Therefore a first protective circuit is not electrically connected when contact holes are opened in an interlayer insulating film. The static electricity generated during dry etching for opening the contact holes moves from the gate signal line, damages a gate insulating film, passes the crystalline semiconductor film, and again damages the gate insulating film before it reaches the gate signal line. As the static electricity generated during the dry etching damages the first protective circuit, the energy of the static electricity is reduced until it loses the capacity of damaging a driving circuit TFT. The driving circuit TFT is thus prevented from suffering electrostatic discharge damage. | 09-20-2012 |
20140014964 | Semiconductor Device and Method of Manufacturing the Same - In a semiconductor device, gate signal lines are spaced apart from each other above a crystalline semiconductor film. Therefore a first protective circuit is not electrically connected when contact holes are opened in an interlayer insulating film. The static electricity generated during dry etching for opening the contact holes moves from the gate signal line, damages a gate insulating film, passes the crystalline semiconductor film, and again damages the gate insulating film before it reaches the gate signal line. As the static electricity generated during the dry etching damages the first protective circuit, the energy of the static electricity is reduced until it loses the capacity of damaging a driving circuit TFT. The driving circuit TFT is thus prevented from suffering electrostatic discharge damage. | 01-16-2014 |
Patent application number | Description | Published |
20120273773 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device which has low power consumption and can operate at high speed. The semiconductor device includes a memory element including a first transistor including crystalline silicon in a channel formation region, a capacitor for storing data of the memory element, and a second transistor which is a switching element for controlling supply, storage, and release of charge in the capacitor. The second transistor is provided over an insulating film covering the first transistor. The first and second transistors have a source electrode or a drain electrode in common. | 11-01-2012 |
20120275214 | SEMICONDUCTOR DEVICE AND DRIVING METHOD THEREOF - In a memory module including a memory cell array including memory cells arranged in matrix, each including a first transistor using an oxide semiconductor and a first capacitor; a reference cell including a p-channel third transistor, a second capacitor, and a second transistor using an oxide semiconductor; and a refresh timing detection circuit including a resistor and a comparator, wherein when a potential is supplied to the first capacitor through the first transistor, a potential is supplied to the second capacitor through the second transistor, wherein a drain current value of the third transistor is changed in accordance with the potential stored in the second capacitor, and wherein when the drain current value of the third transistor is higher than a given value, a refresh operation of the memory cell array and the reference cell are performed. | 11-01-2012 |
20130069132 | SEMICONDUCTOR STORAGE DEVICE - Probability of malfunction of a semiconductor storage device is reduced. A shielding layer is provided between a memory cell array (e.g., a memory cell array including a transistor formed using an oxide semiconductor material) and a peripheral circuit (e.g., a peripheral circuit including a transistor formed using a semiconductor substrate), which are stacked. With this structure, the memory cell array and the peripheral circuit can be shielded from radiation noise generated between the memory cell array and the peripheral circuit. Thus, probability of malfunction of the semiconductor storage device can be reduced. | 03-21-2013 |
20130135185 | DRIVER CIRCUIT FOR DISPLAY DEVICE AND DISPLAY DEVICE INCLUDING THE DRIVER CIRCUIT - A display device driver circuit in which a lookup table can be written into a memory circuit within a retrace period even when the lookup table is constantly reconstructed in accordance with a change in the external environment and stored in the memory circuit, and data of the lookup table can be held even if supply of power supply voltage stops. In a driver circuit for a display device, a memory circuit including a transistor having a semiconductor layer containing an oxide semiconductor is used as a memory circuit that stores a lookup table for correcting image signals in accordance with a change in the external environment. | 05-30-2013 |
20130148411 | MEMORY DEVICE - A memory device including first to fourth memory cell arrays and a driver circuit including a pair of bit line driver circuits and a pair of word line driver circuits is provided. The first to fourth memory cell arrays are overlap with the driver circuit. Each of the pair of bit line driver circuits and a plurality of bit lines are connected through connection points on an edge along the boundary between the first and second memory cell arrays or on an edge along the boundary between the third and fourth memory cell arrays. Each of the pair of word line driver circuits and a plurality of word lines are connected through second connection points on an edge along the boundary between the first and fourth memory cell arrays or on an edge along the boundary between the second and third memory cell arrays. | 06-13-2013 |
20130155790 | STORAGE DEVICE - Noise attributed to signals of a word line, in first and second bit lines which are overlapped with the same word line in memory cells stacked in a three-dimensional manner is reduced in a storage device with a folded bit-line architecture. The storage device includes a driver circuit including a sense amplifier, and first and second memory cell arrays which are stacked each other. The first memory cell array includes a first memory cell electrically connected to the first bit line and a first word line, and the second memory cell array includes a second memory cell electrically connected to the second bit line and a second word line. The first and second bit lines are electrically connected to the sense amplifier in the folded bit-line architecture. The first word line, first bit line, second bit line, and second word line are disposed in this manner over the driver circuit. | 06-20-2013 |
20140068300 | MICROCONTROLLER - To provide a microcontroller that can operate in a low power consumption mode. The microcontroller includes a CPU, a memory, and a peripheral circuit such as a timer circuit. A register of the peripheral circuit is formed at an interface with a bus line. A power gate is provided for control of power supply, and the microcontroller can operate in the low power consumption mode where some circuits alone are active, in addition to in a normal operation mode where all circuits are active. A register with no power supply in the low power consumption mode, such as a register of the CPU, includes a volatile memory and a nonvolatile memory. | 03-06-2014 |
20140108836 | MICROCONTROLLER AND METHOD FOR MANUFACTURING THE SAME - A microcontroller which operates in a low power consumption mode is provided. A microcontroller includes a CPU, a memory, and a peripheral circuit such as a timer circuit. A register in the peripheral circuit is provided in an interface with a bus line. A power gate for controlling supply control is provided. The microcontroller can operate not only in a normal operation mode where all circuits are active, but also in a low power consumption mode where some of the circuits are active. A volatile memory and nonvolatile memory are provided in a register, such as a register of the CPU. Data in the volatile memory is backed up in the nonvolatile memory before the power supply is stopped. In the case where the operation mode returns to the normal mode, when power supply is started again, data in the nonvolatile memory is written back into the volatile memory. | 04-17-2014 |
20140121787 | CENTRAL CONTROL SYSTEM - Provided is a structure which is capable of central control of an electric device and a sensor device and a structure which can reduce power consumption of an electric device and a sensor device. A central control system includes at least a central control device, an output unit, and an electric device or a sensor device. The central control device performs arithmetic processing on information transmitted from the electric device or the sensor device and makes the output unit output information obtained by the arithmetic processing. It is possible to know the state of the electric device or the sensor device even apart from the electric device or the sensor device. The electric device or the sensor device includes a transistor which includes an activation layer using a semiconductor with the band gap wider than that of single crystal silicon. | 05-01-2014 |
20140310533 | SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME - An object is to solve all of the following problems caused when a volatile register and a non-volatile register are used as registers in a processor: degradation of the integrity of data stored in the non-volatile register; loss of data security due to the processor and a non-volatile memory device that are provided apart from each other; and slow data processing speed due to wiring delay or the like caused by these devices provided apart from each other. When data maintained in the volatile register is stored in the non-volatile register before supply of power supply voltage is stopped, the data is encrypted by an encryption circuit and stored in a non-volatile memory device that is provided separately from the processor. Then, the data stored in the non-volatile register is compared with the compressed and encrypted data stored in the non-volatile memory device. | 10-16-2014 |
20140355339 | DRIVING METHOD OF SEMICONDUCTOR DEVICE - In a memory cell including first to third transistors, the potential of a bit line is set to VDD or GND when data is written through the first transistor. In a standby period, the potential of the bit line is set to GND. In reading operation, the bit line is brought into a floating state at GND, and a source line is set to a potential VDD−α, consequently, the third transistor is turned on. Then, the potential of the source line is output according to the potential of a gate of the second transistor. Note that α is set so that the second transistor is surely off even when the potential of the gate of the second transistor becomes lower from VDD by ΔV in the standby period. That is, Vth+ΔV<α is satisfied where Vth is the threshold value of the second transistor. | 12-04-2014 |
20150054571 | CHARGE PUMP CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - Efficiency of a charge pump circuit is increased. The charge pump circuit includes serially connected fundamental circuits each including a diode-connected transistor and a capacitor. At least one transistor is provided with a back gate, and the back gate is connected to any node in the charge pump circuit. For example, the charge pump circuit is of a step-up type; in which case, if the transistor is an n-channel transistor, a back gate of the transistor in the last stage is connected to an output node of the charge pump circuit. Back gates of the transistors in the other stages are connected to an input node of the charge pump circuit. In this way, the voltage holding capability of the fundamental circuit in the last stage is increased, and the conversion efficiency can be increased because an increase in the threshold of the transistors in the other stages is prevented. | 02-26-2015 |