Patent application number | Description | Published |
20110287955 | POLYPEPTIDE MARKER FOR DIAGNOSIS OF ARTERIOSCLEROSIS, METHOD FOR DETECTION OF ARTERIOSCLEROSIS BY USING THE MAKER OR THE LIKE, AND KIT FOR DIAGNOSIS OF ARTERIOSCLEROSIS - Disclosed are: a polypeptide marker for diagnosing arteriosclerosis; a gene marker for diagnosing arteriosclerosis; an antibody; a probe for detecting an arteriosclerosis marker gene; a DNA microarray or a DNA chip for detecting an arteriosclerosis marker gene; a method for detecting arteriosclerosis; and a kit for diagnosing arteriosclerosis; with which an arteriosclerotic lesion can be detected with much improved accuracy. Specifically disclosed are: a polypeptide marker for diagnosing arteriosclerosis, which comprises a polypeptide having an amino acid sequence set forth in any one of SEQ ID NOs: 1, 3, 5, 7, 9, 11, 13, 15, 17, 19, 21, 23, 25, 27, 29, 31, 33, and 35 of the Sequence Listing, or a partial amino acid sequence thereof; a gene which encodes the amino acid sequence; a probe for detecting the gene; a DNA microarray or a DNA chip comprising the probe; an antibody bindable to the polypeptide as an antigen; a kit comprising any one of the above-mentioned items; and a method for detecting arteriosclerosis by using any one of the above-mentioned items. | 11-24-2011 |
20130183691 | POLYPEPTIDE MARKER FOR DIAGNOSIS OF ARTERIOSCLEROSIS, METHOD FOR DETECTION OF ARTERIOSCLEROSIS BY USING THE MAKER OR THE LIKE, AND KIT FOR DIAGNOSIS OF ARTERIOSCLEROSIS - Disclosed are: a polypeptide marker for diagnosing arteriosclerosis; a gene marker for diagnosing arteriosclerosis; an antibody; a probe for detecting an arteriosclerosis marker gene; a DNA microarray or a DNA chip for detecting an arteriosclerosis marker gene; a method for detecting arteriosclerosis; and a kit for diagnosing arteriosclerosis; with which an arteriosclerotic lesion can be detected with much improved accuracy. Specifically disclosed are: a polypeptide marker for diagnosing arteriosclerosis, which comprises a polypeptide having an amino acid sequence set forth in any one of SEQ ID NOs: 1, 3, 5, 7, 9, 11, 13, 15, 17, 19, 21, 23, 25, 27, 29, 31, 33, and 35 of the Sequence Listing, or a partial amino acid sequence thereof; a gene which encodes the amino acid sequence; a probe for detecting the gene; a DNA microarray or a DNA chip comprising the probe; an antibody bindable to the polypeptide as an antigen; a kit comprising any one of the above-mentioned items; and a method for detecting arteriosclerosis by using any one of the above-mentioned items. | 07-18-2013 |
Patent application number | Description | Published |
20090171013 | WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTOELECTRONIC PART CASE, AND MOLDING METHOD - A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed. | 07-02-2009 |
20090192258 | SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION METHOD, AND SEMICONDUCTOR DEVICE - A semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, and (D) carbon black is prepared by mixing a carbon black feedstock and the curing agent with an organic solvent, filtering off coarse particles of carbon black which remain over a mesh sheet with an opening of 20 μm, removing the solvent from the filtrate to yield a premix of curing agent and carbon black, and kneading the premix with the remaining components. | 07-30-2009 |
20090239997 | WHITE THERMOSETTING SILICONE RESIN COMPOSITION FOR MOLDING AN OPTICAL SEMICONDUCTOR CASE AND OPTICAL SEMICONDUCTOR CASE - A white thermosetting silicone resin composition for molding an optical semiconductor case and a case for an optical semiconductor such as LED are provided. The composition comprises (A) a thermosetting organopolysiloxane, (B) a white pigment, (C) an inorganic filler (excluding the white pigment), (D) a condensation catalyst, and (E) a coupling agent represented by the following formula: R | 09-24-2009 |
20100148380 | THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflective material; (D) an inorganic filler; and (E) a curing catalyst. The internal mold release agent of component (B) comprises a carboxylate ester represented by: | 06-17-2010 |
Patent application number | Description | Published |
20090262556 | H-BRIDGE BUCK-BOOST CONVERTER - An H-bridge buck-boost converter includes a first half-bridge portion having at least one first transistor, an inductor portion connected to the first half-bridge portion at a first connection, a second half-bride portion connected to the inductor portion at a second connection, the second half-bridge portion having at least one second transistor, and a control portion configured to provide a first switching signal to a gate of the first transistor of the first half-bridge portion as a function of a voltage at the first connection. | 10-22-2009 |
20130076252 | CURRENT CONTROLLING CIRCUIT FOR A LIGHT-EMITTING DIODE DRIVER AND PRODUCING METHOD THEREFOR - The present disclosure proposes a fully integrated accurate LED output current controlling circuit and method, which can be seamlessly combined with true PWM dimming. The current controlling circuit has an auto zero function in the light-emitting diode driver to eliminate offsets caused by the system, process variations, parasitic effects, dimming and so on in an LED driver application, and thus is capable of controlling the LED current with high accuracy. Moreover, the driver of the present disclosure does not require the use of external components such as an external resistor to regulate current accuracy. | 03-28-2013 |
20140239925 | INDUCTOR CURRENT EMULATION CIRCUIT FOR A SWITCHING CONVERTER - An inductor current emulation circuit for use with a switching converter in which regulating the output voltage includes comparing an output which varies with the difference between the output voltage and a reference voltage with a ‘ramp’ signal which emulates the current in the output inductor. A current sensing circuit produces an output which varies with the current in the switching element that is turned on during the ‘off’ time, an emulated current generator circuit produces the ‘ramp’ signal during both ‘off’ and ‘on’ times, a comparator circuit compares the ‘ramp’ signal with at least one threshold voltage which varies with the sensed current and toggles an output when the ‘ramp’ exceeds the thresholds, and a feedback circuit produces an output which adjusts the ‘ramp’ signal each time the comparator circuit output toggles until the ‘ramp’ signal no longer exceeds the threshold voltages. | 08-28-2014 |
Patent application number | Description | Published |
20090061537 | METHOD OF MANUFACTURING OSCILLATOR DEVICE - A method of manufacturing oscillator devices each having an oscillator and a resilient supporting member for supporting the oscillator for oscillatory motion, includes a step of processing one and the same substrate to form oscillators and resilient supporting members of oscillator devices so that oscillators of adjacent oscillator devices are connected to each other, a step of forming or placing a magnetic material so that it extends across the connected oscillators of the adjacent oscillator devices, and a step of simultaneously cutting and separating the connected oscillators and the magnetic material formed or placed to extend across the connected oscillators, whereby oscillator devices such as oscillatory type actuators having good reliability and performance evenness can be manufactured with a good productivity. | 03-05-2009 |
20120256518 | ELECTROMECHANICAL TRANSDUCER AND METHOD OF PRODUCING THE SAME - A method of producing an electromechanical transducer includes forming an insulating film on a first electrode, forming a sacrificial layer on the insulating film, forming a first membrane on the sacrificial layer, forming a second electrode on the first membrane, forming an etching-hole in the first membrane and removing the sacrificial layer through the etching-hole, and forming a second membrane on the second electrode, and sealing the etching-hole. Forming the second membrane and sealing the etching-hole are performed in one operation. | 10-11-2012 |
20120256519 | ELECTROMECHANICAL TRANSDUCER AND METHOD OF PRODUCING THE SAME - An electromechanical transducer includes a substrate, a first electrode disposed on the substrate, and a vibration film including a membrane disposed on the first electrode with a space therebetween and a second electrode disposed on the membrane so as to oppose the first electrode. The first electrode has a surface roughness value of 6 nm RMS or less. | 10-11-2012 |
20120256520 | ELECTROMECHANICAL TRANSDUCER AND METHOD OF PRODUCING THE SAME - An electromechanical transducer includes a first electrode; a silicon oxide film disposed on the first electrode; and a vibration film including a silicon nitride film disposed on the silicon oxide film with a space therebetween and a second electrode disposed on the silicon nitride film so as to oppose the first electrode. | 10-11-2012 |
20140241129 | ELECTROMECHANICAL TRANSDUCER AND METHOD OF PRODUCING THE SAME - An electromechanical transducer includes a substrate, a first electrode disposed on the substrate, and a vibration film including a membrane disposed on the first electrode with a space therebetween and a second electrode disposed on the membrane so as to oppose the first electrode. The first electrode has a surface roughness value of 6 nm RMS or less. | 08-28-2014 |
Patent application number | Description | Published |
20110068687 | BULB-SHAPED LAMP AND LIGHTING DEVICE - [Problem to be Solved] To provide a bulb-type lamp that can achieve improvement in the heat dissipation properties and size/weight reduction simultaneously, and that can lighten thermal load on a lighting circuit. | 03-24-2011 |
20110089831 | BULB-SHAPED LAMP AND LIGHTING DEVICE - Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb ( | 04-21-2011 |
20120002421 | BULB-SHAPED LAMP AND LIGHTING DEVICE - A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S | 01-05-2012 |
20120044684 | BULB-TYPE LAMP AND LIGHTING DEVICE - Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of | 02-23-2012 |
20120057371 | LAMP AND LIGHTING APPARATUS - A lamp capable of suppressing an increase in a temperature of semiconductor light-emitting devices such as LED is provided. The lamp includes an LED module ( | 03-08-2012 |
20120127733 | LIGHTING DEVICE - A compact LED lamp ( | 05-24-2012 |
20120140480 | BULB-SHAPED LAMP - One end of a cylindrical mount | 06-07-2012 |
20120300448 | BULB-SHAPED LAMP AND LIGHTING DEVICE - A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5≦S | 11-29-2012 |
20130201700 | LAMP - A lamp comprises a light emitting module including a substrate and LEDs mounted on the substrate, a heat sink that is cylindrical and that discharges heat produced during light emission by the LEDs, a base provided at one end of the heat sink, a mounting member having a front surface whereon the light emitting module is mounted, and a circuit unit positioned partially in the heat sink, receiving power through the base and causing the light emitting element to emit light. The mounting member is in contact with the heat sink so that the heat produced during light emission is transmitted to the heat sink. The circuit unit includes a circuit board and a plurality of electronic components mounted on the circuit board. The circuit board or at least one of the electronic components is thermally connected to the mounting member through a thermally conductive member. | 08-08-2013 |