Patent application number | Description | Published |
20130010824 | SEMICONDUCTOR OPTICAL INTEGRATED DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor optical integrated device includes a first semiconductor optical device formed over a (001) plane of a substrate and a second semiconductor optical device which is formed over the (001) plane of the substrate in a (110) orientation from the first semiconductor optical device and which is optically connected to the first semiconductor optical device. The first semiconductor optical device includes a first core layer and a first clad layer which is formed over the first core layer and which has a crystal surface on a side on a second semiconductor optical device side that forms an angle θ greater than or equal to 55 degrees and less than or equal to 90 degrees with the (001) plane. | 01-10-2013 |
20130043489 | COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A compound semiconductor device includes: a substrate; a GaN compound semiconductor multilayer structure disposed over the substrate; and a stress relief layer which is AlN-based and which is disposed between the substrate and the GaN compound semiconductor multilayer structure, wherein a surface of the stress relief layer that is in contact with the GaN compound semiconductor multilayer structure includes recesses that have a depth of 5 nm or more and that are formed at a number density of 2×10 | 02-21-2013 |
20130069072 | SEMICONDUCTOR CRYSTAL SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR CRYSTAL SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, POWER UNIT, AND AMPLIFIER - A semiconductor crystal substrate includes a substrate; and a protection layer formed by applying nitride on a surface of the substrate. The protection layer is in an amorphous state in a peripheral area at an outer peripheral part of the substrate, and the protection layer is crystallized in an internal area of the protection layer that is inside the peripheral area of the protection layer. | 03-21-2013 |
20130075788 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD - A method for fabricating a semiconductor device is disclosed. The method includes sequentially forming a first semiconductor layer, a second semiconductor layer and a semiconductor cap layer containing a p-type impurity element on a substrate, forming a dielectric layer having an opening after the forming of the semiconductor cap layer, forming a third semiconductor layer containing a p-type impurity element on the semiconductor cap layer exposed from the opening of the dielectric layer, and forming a gate electrode on the third semiconductor layer. | 03-28-2013 |
20130330867 | SEMICONDUCTOR OPTICAL INTEGRATED DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor optical integrated device includes a first semiconductor optical device formed over a (001) plane of a substrate and a second semiconductor optical device which is formed over the (001) plane of the substrate in a (110) orientation from the first semiconductor optical device and which is optically connected to the first semiconductor optical device. The first semiconductor optical device includes a first core layer and a first clad layer which is formed over the first core layer and which has a crystal surface on a side on a second semiconductor optical device side that forms an angle θ greater than or equal to 55 degrees and less than or equal to 90 degrees with the (001) plane. | 12-12-2013 |
20140091317 | METHOD OF MANUFACTURING SEMICONDUCTOR CRYSTAL SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, SEMICONDUCTOR CRYSTAL SUBSTRATE, AND SEMICONDUCTOR APPARATUS - A method of manufacturing a semiconductor crystal substrate, includes forming a nitride layer by supplying a gas including a nitrogen component to a substrate formed of a material including silicon and nitriding a surface of the substrate; and forming an AlN layer on the nitride layer by supplying the gas including the nitrogen component and a source gas including Al. | 04-03-2014 |
20150090957 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a first superlattice buffer layer formed on a substrate. A second superlattice buffer layer is formed on the first superlattice buffer layer. A first semiconductor layer is formed by a nitride semiconductor on the second superlattice buffer layer. A second semiconductor layer is formed by a nitride semiconductor on the first semiconductor layer. The first superlattice buffer layer is formed by alternately and cyclically laminating a first superlattice formation layer and a second superlattice formation layer. The second superlattice buffer layer is formed by alternately and cyclically laminating the first superlattice formation layer and the second superlattice formation layer. The first superlattice formation layer is formed by Al | 04-02-2015 |