Patent application number | Description | Published |
20080273402 | APPARATUS FOR IMPLEMENTING DOMINO SRAM LEAKAGE CURRENT REDUCTION - A method and apparatus implementing domino static random access memory (SRAM) leakage current reduction include a local evaluation circuit coupled to true and complement bit lines of a pair of local SRAM cell groups, receives precharge signals and provides an output connected to a global dot line. A sleep input is applied to SRAM sleep logic and a write driver including sleep control. Data true and data complement outputs of the write driver are forced to a respective selected level to discharge the bit lines and global dot lines when the sleep input transitions high. Discharging the bit lines and global dot lines is implemented through gating in the write driver without requiring any additional devices in the local evaluation circuit. | 11-06-2008 |
20090027945 | Method and Apparatus for Implementing Enhanced SRAM Read Performance Sort Ring Oscillator (PSRO) - A method and apparatus including a static random access memory (SRAM) cell implement an enhanced SRAM read performance sort ring oscillator (PSRO), and a design structure on which the subject circuit resides is provided. A pair of parallel reverse polarity connected inverters defines a static latch or cross-coupled memory cell. The SRAM cell includes independent left and right wordlines providing a respective gate input to a pair of access transistors used to access to the memory cell. The SRAM cell includes a voltage supply connection to one side of the static latch. For example, a complement side of the static latch is connected to the voltage supply. A plurality of the SRAM cells is assembled together to form a SRAM base block. A plurality of the SRAM base blocks is connected together to form the SRAM read PSRO. | 01-29-2009 |
20090027946 | METHOD AND APPARATUS FOR IMPLEMENTING ENHANCED SRAM READ PERFORMANCE SORT RING OSCILLATOR (PSRO) - A method and apparatus including a static random access memory (SRAM) cell implement an enhanced SRAM read performance sort ring oscillator (PSRO). A pair of parallel reverse polarity connected inverters defines a static latch or cross-coupled memory cell. The SRAM cell includes independent left and right wordlines providing a respective gate input to a pair of access transistors used to access to the memory cell. The SRAM cell includes a voltage supply connection to one side of the static latch. For example, a complement side of the static latch is connected to the voltage supply. A plurality of the SRAM cells is assembled together to form a SRAM base block. A plurality of the SRAM base blocks is connected together to form the SRAM read PSRO. | 01-29-2009 |
20090108457 | Apparatus for Improved Power Distribution in a Three Dimensional Vertical Integrated Circuit - A first through via is electrically insulated from surrounding wafer substrate material. A second through via is not electrically insulated from the surrounding wafer substrate material. This configuration is advantageous when the non-insulated via serves as the path for either Vdd or GND. By not insulating the through via, a first supply voltage (Vdd or GND) is allowed to flow through the surrounding wafer substrate material thereby decreasing the resistance of the first supply voltage path. | 04-30-2009 |
20090111214 | Method for Improved Power Distribution in a Three Dimensional Vertical Integrated Circuit - A first through via is electrically insulated from surrounding wafer substrate material. A second through via is not electrically insulated from the surrounding wafer substrate material. This configuration is advantageous when the non-insulated via serves as the path for either Vdd or GND. By not insulating the through via, a first supply voltage (Vdd or GND) is allowed to flow through the surrounding wafer substrate material thereby decreasing the resistance of the first supply voltage path. | 04-30-2009 |
20090174457 | IMPLEMENTING LOW POWER LEVEL SHIFTER FOR HIGH PERFORMANCE INTEGRATED CIRCUITS - A low power level shifter circuit for high performance integrated circuits includes an input inverter operating in a domain of a first voltage supply and receiving an input signal and a design structure on which the subject circuit resides is provided. An output stage operating in a domain of a higher second voltage supply includes a first output inverter connected to the input inverter and a second output inverter connected in series with the first output inverter. The second output inverter provides a level shifted output signal having a voltage level corresponding to the second voltage supply. A series connected finisher transistor and finisher control transistor are connected between the second voltage supply and an input to the first output inverter. The finisher control transistor is activated responsive to the input signal. A path control transistor controls a path between the first voltage supply and the input inverter. The path control transistor being activated responsive to the level shifted output signal. | 07-09-2009 |
20090183044 | Method and circuit for implementing enhanced LBIST testing of paths including arrays - A method and circuit implement testing of a circuit path including a memory array and logic including Logic Built in Self Test (LBIST) diagnostics, and a design structure on which the subject circuit resides are provided. Testing of the circuit path includes initializing the memory array in the circuit path with an initialization pattern, switching to Logic Built in Self Test (LBIST) mode and providing a read only mode for the memory array, and running Logic Built in Self Test (LBIST) testing of the circuit path. | 07-16-2009 |
20090185435 | Method and Circuit for Implementing Enhanced SRAM Write and Read Performance Ring Oscillator - A method and circuit for implementing an enhanced static random access memory (SRAM) read and write performance ring oscillator, and a design structure on which the subject circuit resides are provided. A plurality of SRAM base blocks is connected together in a chain. Each of the plurality of SRAM base blocks includes a SRAM cell, such as an eight-transistor (8T) static random access memory (SRAM) cell, and a local evaluation block coupled to the SRAM cell. The SRAM cell includes independent left wordline input and right wordline input. The SRAM cell includes a read wordline connected high, and a true and complement write bitline pair connected low. In the local evaluation circuit, one input of a NAND gate receiving the read bitline input is connected high. A control signal is combined with an inverted feedback signal to start and stop the ring oscillator. | 07-23-2009 |
20100019385 | Implementing Reduced Hot-Spot Thermal Effects for SOI Circuits - Methods and structures are provided for implementing reduced hot spot thermal effects for silicon-on-insulator (SOI) circuits. A silicon-on-insulator (SOI) structure includes a silicon substrate layer, a thin buried oxide (BOX) layer carried by the silicon substrate layer, an active layer carried by the thin BOX layer, and a pad oxide layer carried by the active layer. A thermal conductive path is built to reduce thermal effects of a hotspot area in the active layer and extends from the active layer to the backside of the SOI structure. A trench etched from the topside to the active layer, and is filled with a thermal connection material. A thermal connection from a backside of the SOI structure includes an opening etched into the silicon substrate layer from the backside and filled with a thermal connection material. | 01-28-2010 |
20100032799 | Implementing Decoupling Capacitors With Hot-Spot Thermal Reduction on Integrated Circuit Chips - A method and structures are provided for implementing decoupling capacitors with hot spot thermal reduction on integrated circuit chips including silicon-on-insulator (SOI) circuits. A silicon-on-insulator (SOI) structure includes a silicon substrate layer, a thin buried oxide (BOX) layer carried by the silicon substrate layer, and an active layer carried by the thin BOX layer. A thermal conductive path is built proximate to a hotspot area in the active layer to reduce thermal effects including a backside thermal connection from a backside of the SOI structure. The backside thermal connection includes a backside etched opening extending from the backside of the SOI structure into the silicon substrate layer, a capacitor dielectric formed on said backside etched opening; and a thermal connection material deposited on said capacitor dielectric filling said backside etched opening. | 02-11-2010 |
20100046278 | Implementing Local Evaluation of Domino Read SRAM With Enhanced SRAM Cell Stability and Enhanced Area Usage - A method and circuit for implementing domino static random access memory (SRAM) local evaluation with enhanced SRAM cell stability, and a design structure on which the subject circuit resides are provided. A SRAM local evaluation circuit enabling a read and write operations of an associated SRAM cell group includes true and complement bitlines, true and complement write data propagation inputs, a precharge signal, and a precharge write signal. A respective precharge device is connected between a voltage supply VDD and the true bitline and the complement bitline. A first passgate device is connected between the complement bitline and the true write data propagation input. A second passgate device is connected between the true bitline and the complement write data propagation input. The precharge write signal disables the passgate devices during a read operation. During write operations, the precharge write signal enables the passgate devices. | 02-25-2010 |
20100140808 | Power Distribution In A Vertically Integrated Circuit - A first through via is electrically insulated from surrounding wafer substrate material. A second through via is not electrically insulated from the surrounding wafer substrate material. This configuration is advantageous when the non-insulated via serves as the path for either Vdd or GND. By not insulating the through via, a first supply voltage (Vdd or GND) is allowed to flow through the surrounding wafer substrate material thereby decreasing the resistance of the first supply voltage path. | 06-10-2010 |
20100187525 | IMPLEMENTING TAMPER EVIDENT AND RESISTANT DETECTION THROUGH MODULATION OF CAPACITANCE - A method and tamper detection circuit for implementing tamper and anti-reverse engineering evident detection in a semiconductor chip, and a design structure on which the subject circuit resides are provided. A capacitor is formed with the semiconductor chip including the circuitry to be protected. A change in the capacitor value results responsive to the semiconductor chip being thinned, which is detected and a tamper-detected signal is generated. | 07-29-2010 |
20100188888 | Implementing Enhanced Dual Mode SRAM Performance Screen Ring Oscillator - A method and circuit for implementing an enhanced dual-mode static random access memory (SRAM) performance screen ring oscillator (PSRO), and a design structure on which the subject circuit resides are provided. The dual-mode SRAM PSRO includes a plurality of SRAM base blocks connected together in a chain. Each of the plurality of SRAM base blocks includes an eight-transistor (8T) SRAM cell, a local evaluation circuit and a logic function coupled to the SRAM cell. The eight-transistor (8T) static random access memory (SRAM) cell is an unmodified 8T SRAM cell. The dual-mode SRAM PSRO includes one mode of operation, where the output frequency is determined by write-through performance of the 8T SRAM cell; and another mode of operation, where the output frequency is determined by read performance of the 8T SRAM cell. | 07-29-2010 |
20100214859 | Implementing Boosted Wordline Voltage in Memories - A method and wordline voltage boosting circuit for implementing boosted wordline voltage in memories, and a design structure on which the subject circuit resides are provided. The wordline voltage boosting circuit receives a precharge signal, uses a switching transistor coupled to a bootstrap capacitor, and generates a boosted voltage level responsive to the precharge signal. The boosted voltage level is applied to a voltage supply of an output stage of a wordline driver, causing the wordline voltage level of a selected wordline to be boosted. The switching transistor is controlled by the precharge signal and a node of the bootstrap capacitor supplying the boosted voltage level is driven high by the switching transistor. | 08-26-2010 |
20100218055 | Implementing Enhanced Array Access Time Tracking With Logic Built in Self Test of Dynamic Memory and Random Logic - A method and circuit for implementing substantially perfect array access time tracking with Logic Built In Self Test (LBIST) diagnostics of dynamic memory array and random logic, and a design structure on which the subject circuit resides are provided. The dynamic memory array is initialized to a state for the longest read time for each bit and the dynamic memory array is forced into a read only mode. During LBIST diagnostics with the array in the read only mode, the array outputs are combined with the data inputs to provide random switching data on the array outputs to the random logic. | 08-26-2010 |
20100252868 | ENHANCED FIELD EFFECT TRANSISTOR - An enhanced FET capable of controlling current above and below a gate of the FET. The FET is formed on a semiconductor substrate. A source and drain are formed in the substrate (or in a well in the substrate). A first epitaxial layer of similar doping to the source and drain are grown on the source and drain, the first epitaxial layer is thicker than the gate, but not so thick as to cover the top of the gate. A second epitaxial layer of opposite doping is grown on the first epitaxial layer thick enough to cover the top of the gate. The portion of the second epitaxial layer above the gate serves as a body through which the gate controls current flow between portions of the first epitaxial layer over the drain and the source. | 10-07-2010 |
20110248349 | Vertical Stacking of Field Effect Transistor Structures for Logic Gates - Vertically stacked Field Effect Transistors (FETs) are created where a first FET and a second FET are controllable independently. The vertically stacked FETs may be connected in series or in parallel, thereby suitable for use as a portion of a NAND circuit or a NOR circuit. Epitaxial growth over a source and drain of a first FET, and having similar doping to the source and drain of the first FET provide a source and drain of a second FET. An additional epitaxial growth of a type opposite the doping of the source and drain of the first FET provides a body for the second FET. | 10-13-2011 |
20120081143 | DELAY CHAIN BURN-IN FOR INCREASED REPEATABILITY OF PHYSICALLY UNCLONABLE FUNCTIONS - A circuit and method increases the repeatability of physically undetectable functions (PUFs) by enhancing the variation of signal delay through two delay chains during chip burn-in. A burn-in circuit holds the inputs of the two delay chains at opposite random values during the burn-in process. All the PFETs in the delay chains with a low value at the input will be burned in with a higher turn on voltage. Since the PFETs affected in the two delay chains are driven by opposite transitions at burn-in, alternating sets of delay components in the two delay chains are affected by the burn-in cycle. Under normal operation, both of the delay chains see the same input so only one chain has an increase in delay to achieve a statistically reliable difference in the two delay paths thereby increasing the overall repeatability of the PUF circuit. | 04-05-2012 |
20120087176 | DATA SECURITY FOR DYNAMIC RANDOM ACCESS MEMORY USING BODY BIAS TO CLEAR DATA AT POWER-UP - A circuit and method erase at power-up all data stored in a DRAM chip for increased data security. All the DRAM memory cells are erased by turning on the transistors for the DRAM storage cells simultaneously by increasing the body voltage of cells. In the example circuit, the body voltage is increased by a charge pump controlled by a power-on-reset (POR) signal applying a voltage to the p-well of the memory cells. The added voltage to the p-well lowers the threshold voltage of the cell, such that the NFET transistor of the memory cell will turn on. With all the devices turned on, the data stored in the memory cells is erased as the voltage of all the cells connected to a common bitline coalesce to a single value. | 04-12-2012 |
20120106235 | IMPLEMENTING PHYSICALLY UNCLONABLE FUNCTION (PUF) UTILIZING EDRAM MEMORY CELL CAPACITANCE VARIATION - A method and embedded dynamic random access memory (EDRAM) circuit for implementing a physically unclonable function (PUF), and a design structure on which the subject circuit resides are provided. An embedded dynamic random access memory (EDRAM) circuit includes a first EDRAM memory cell including a memory cell true storage capacitor and a second EDRAM memory cell including a memory cell complement storage capacitor. The memory cell true storage capacitor and the memory cell complement storage capacitor include, for example, trench capacitors or metal insulator metal capacitors (MIM caps). A random variation of memory cell capacitance is used to implement the physically unclonable function. Each memory cell is connected to differential inputs to a sense amplifier. The first and second EDRAM memory cells are written to zero and then the first and second EDRAM memory cells are differentially sensed and the difference is amplified to consistently read the same random data. | 05-03-2012 |
20130001701 | Vertical Stacking of Field Effect Transistor Structures for Logic Gates - Vertically stacked Field Effect Transistors (FETs) are created where a first FET and a second FET are controllable independently. The vertically stacked FETs may be connected in series or in parallel, thereby suitable for use as a portion of a NAND circuit or a NOR circuit. Epitaxial growth over a source and drain of a first FET, and having similar doping to the source and drain of the first FET provide a source and drain of a second FET. An additional epitaxial growth of a type opposite the doping of the source and drain of the first FET provides a body for the second FET. | 01-03-2013 |