Patent application number | Description | Published |
20090234968 | SERVER SELECTION FOR ROUTING CONTENT TO A CLIENT USING APPLICATION LAYER REDIRECTION - In one embodiment, a first request is received for a probe link from a client that has downloaded a page. The request is received from an application. A test may be performed to determine a server that could optimally service a content request from the client. After receiving the request, the content router sends a re-direct to the client where the re-direct causes the client to follow the re-direct to the server. The server then sends a re-direct back to the client, which the client follows by sending a second request to the content router. The second request is associated with the client and the round-trip time is calculated for the server. It is then determined if the location for the server should be designated as the content deliverer to the client based on the calculated round-trip time. | 09-17-2009 |
20090327215 | LINEAR HINT VIDEO STREAMING - A streaming file is constructed with a file header section that includes a file header object, a media data file descriptor, and an index descriptor. A hinting index section includes a first level hinting index with a linear organization corresponding to timing tick key values. A second level hinting index has a non-sequential organization corresponding to such timing tick key values. A special mark in the second level hinting index indicates that the first level hinting index must be consulted for a next timing tick key value. Such mark is positioned in the last of a sequential run of timing tick key values associated with its entries. A data section that can be put in a separate file, and it accepts media data blocks associated in sequential runs of timing tick key values as its entries. Thus hinting is provided for a non-sequential media data file. | 12-31-2009 |
20100003008 | Dynamically Creating Trick Files To Hide Latency In Streaming Networks - A system and process are provided to reduce the latency associated with delivery of data for trick functions (e.g., fast-forward or rewind) in data distribution systems. In response to a request for a trick function associated with program data being streamed to a user terminal, first trick data frames for the trick function are retrieved from a first computing apparatus (e.g., a storage server) and in the meantime second trick data frames for the trick function are generated at a second computing apparatus (e.g., streaming server). Until the first trick data frames arrive from the first computing apparatus, the second computing device streams the second trick data frames to the user terminal. The second computing apparatus streams the first trick data frame to the user terminal as they arrive. A user at the user terminal experiences minimal delay in viewing a requested trick function since the second computing apparatus begins sending the trick data to the user terminal before the pre-built trick data arrives for streaming to the user terminal. The streaming server also buffers trick data frames for a current speed trick that may be used for dynamically generating trick data frames a next higher speed trick requested by the user terminal. | 01-07-2010 |
20100107001 | Activating Correct Ad-Splicer Profile In Ad-Splicer Redundancy Framework - In particular embodiments, method and system for detecting a failure of a primary ad-splicer, conveying a failure information for the failed primary ad-splicer to a redundant ad-splicer, dynamically forwarding one or more pre-spliced packets intended for the failed primary ad-splicer to the redundant ad-splicer, receiving one or more post-spliced packets from the redundant ad-splicer, and transmitting the post-spliced packets towards one or more target receivers are provided. | 04-29-2010 |
20100191858 | FAILOVER MECHANISM FOR REAL-TIME PACKET STREAMING SESSIONS - Techniques are provided herein for failover streaming mechanisms. At a first device (e.g., a content router device) that is configured to interface with a plurality of streaming servers for real-time protocol packet streams, communications are configured with a client device and a first of the plurality of streaming servers associated with a streaming session from the first streaming server to the client device so that the first device receives client session control and session feedback messages associated with the streaming session and so that a packet stream associated with the streaming session transmitted by the first streaming server to the client device does not pass through the first device. The first device stores session state information comprising an address of the client device, streaming session identification information and data representing a current state of the streaming session at the client device derived from the client session control and session feedback messages. Upon detecting a failure of the first streaming server, the first device selects a second of the plurality of streaming servers for serving the streaming session previously served by the first streaming server, and then initiates a streaming session from the second streaming server to the client device in order to continue from a state of the streaming session previously served by the first streaming server prior to the failure without any indication at the client device of the switching from the first streaming server to the second streaming server. | 07-29-2010 |
Patent application number | Description | Published |
20080251148 | Fluid Handling System for Wafer Electroless Plating and Associated Methods - A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber. | 10-16-2008 |
20080254225 | Method and Apparatus for Wafer Electroless Plating - A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen. | 10-16-2008 |
20080254621 | Wafer Electroless Plating System and Associated Methods - A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM). | 10-16-2008 |
20090308413 | APPARATUS AND SYSTEM FOR CLEANING A SUBSTRATE - An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate. | 12-17-2009 |
20100059088 | Method and Apparatus for Removing Contamination from Substrate - A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate. | 03-11-2010 |
20120045897 | Wafer Electroless Plating System and Associated Methods - A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM). | 02-23-2012 |
20130280917 | Method and Apparatus for Wafer Electroless Plating - A semiconductor wafer electroless plating apparatus includes a platen and a fluid bowl. The platen has a top surface defined to support a wafer, and an outer surface extending downward from a periphery of the top surface to a lower surface of the platen. The fluid bowl has an inner volume defined by an interior surface so as to receive the platen, and wafer to be supported thereon, within the inner volume. A seal is disposed around the interior surface of the fluid bowl so as to form a liquid tight barrier when engaged between the interior surface of the fluid bowl and the outer surface of the platen. A number of fluid dispense nozzles are positioned to dispense electroplating solution within the fluid bowl above the seal so as to rise up and flow over the platen, thereby flowing over the wafer when present on the platen. | 10-24-2013 |
20150040947 | Method and Systems for Cleaning A Substrate - An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate. | 02-12-2015 |