Patent application number | Description | Published |
20080196474 | Method and apparatus for aligning and/or leveling a test head - One embodiment of the present invention is an alignment apparatus useful to align a test head that includes: (a) two or more fluid chambers disposed in fixed relation to each other, the chambers having a movable wall and one or more apertures for admitting or releasing fluid; (b) fluid channels coupled to the one or more apertures that enable fluid to flow between at least two of the fluid chambers; and (c) one or more valves disposed to enable or to stop the flow of fluid through one or more of the one or more fluid channels. | 08-21-2008 |
20080223555 | Method and apparatus for controlling temperature - One embodiment of the present invention is an apparatus useful to control temperature of a device that includes: (a) a heat transfer apparatus; (b) a combined path to the heat transfer apparatus; (c) a first path maintained at a first temperature and connected to the combined path; (d) a second path maintained at a second temperature and connected to the combined path; (e) a third path connected to the combined path; (f) a pump assembly operable to circulate thermal transfer fluid: (i) from the heat transfer apparatus, (ii) through one or more of the first, second and third paths, (iii) from the one or more of the first, second and third paths, through the combined path, and (iv) from the combined path, to and through the heat transfer apparatus; and (g) a valve assembly operable to cause predetermined amounts of thermal transfer fluid to flow into one or more of the first, second, and third paths, thereby controlling the temperature. | 09-18-2008 |
20080290503 | Compliant thermal contactor - One embodiment of the present invention is a compliant thermal contactor that includes a resilient metal film having a plurality of first thermally conductive, compliant posts disposed in an array on a top side thereof and a plurality of second thermally conductive, compliant posts disposed in an array on a bottom side thereof. | 11-27-2008 |
20080290504 | Compliant thermal contactor - One embodiment of the present invention is a compliant thermal contactor that includes a resilient metal film having a plurality of first thermally conductive, compliant posts disposed in an array on a top side thereof and a plurality of second thermally conductive, compliant posts disposed in an array on a bottom side thereof. | 11-27-2008 |
20090068858 | MINIATURE ELECTRICAL BALL AND TUBE SOCKET ASSEMBLY WITH SELF-CAPTURING MULTIPLE-CONTACT-POINT COUPLING - A socket assembly for connecting an array of bulbous terminals such as balls wherein the female element is a miniature tube that has resilient prongs that grip the corresponding terminals with varying force during insertion and deletion. The tube is of resilient conductive material that has been sliced or helically partitioned into opposing prongs forming slots of a width that increases with axial distance from the end of the tube so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube. | 03-12-2009 |
20090305523 | MINIATURE ELECTRICAL BALL AND TUBE SOCKET ASSEMBLY WITH SELF-CAPTURING MULTIPLE-CONTACT-POINT COUPLING - A socket assembly formed of hollow tubes for connecting an array of terminals off opposing electronic structures with both axial and lateral resilience, wherein the resilience is achieved through angular cuts in the tubes. | 12-10-2009 |
20090325394 | Socket for an Electronic Device - One embodiment of the present invention is a socket useful to contact an electronic device, the socket including: (a) a body comprised of two or more contactor holder plates, each including one or more through holes; and (b) one or more contactors are disposed in one or more of the through holes; wherein an aperture in the body is adapted for introduction of thermal transfer fluid between two or more of the contactor holder plates. | 12-31-2009 |
20100022105 | Connector for Microelectronic Devices - One embodiment is a connector for making electrical connection to a bulbous terminal, the connector including: a metal tube with a cylindrical wall extending from a mating end, wherein: (a) two or more slots perforate the wall and extend from the mating end along the tube; (b) two or more apertures perforate the wall and are disposed in a circumferential array disposed a distance from the mating end; and (c) each of the two or more slots transects one of the two or more apertures to divide the mating end of the tube into resilient prongs. | 01-28-2010 |
20100045322 | Probe Head Apparatus for Testing Semiconductors - One embodiment is a probe head for contacting microelectronic devices substantially lying in a test plane, the probe head including: (a) one or more substrate tiles having one or more probe tips disposed on a top surface thereof; and (b) a registration-alignment apparatus that holds the one or more substrate tiles: (i) in position so that the one or more probe tips are held in the test plane, and (ii) aligned so that the one or more probe tips are substantially coplanar to the test plane, which registration-alignment apparatus includes: (i) one or more capture elements affixed, directly or indirectly, to a frame; (ii) three or more posts mechanically supporting each of the one or more substrate tiles; and (iii) alignment actuators affixed, directly or indirectly, to the frame and the posts, which alignment actuators may be actuated to enable the posts to move in response to forces applied thereto from the one or more substrate tiles, and may be actuated to prevent the posts from moving. | 02-25-2010 |
20100105220 | MINIATURE ELECTRICAL BALL AND TUBE SOCKET ASSEMBLY WITH SELF-CAPTURING MULTIPLE-CONTACT-POINT COUPLING - A socket assembly for connecting an array of bulbous terminals such as balls wherein the female element is a miniature tube that has resilient prongs that grip the corresponding terminals with varying force during insertion and deletion. The tube is of resilient conductive material that has been sliced or helically partitioned into opposing prongs forming slots of a width that increases with axial distance from the end of the tube so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube. | 04-29-2010 |
20100230885 | Method and Apparatus for Holding Microelectronic Devices - One embodiment is a carrier for releasably holding devices in a contact plane that includes: a body having one or more sites each having an aperture with a portion in which a device may be held (holding portion); and at least one of the one or more sites having a first resilient prong and a second resilient prong; wherein: (i) the first resilient prong has: (a) a proximal end affixed to the body, (b) a first contactor edge disposed in the contact plane, and (c) a movable distal end extending beyond the holding portion; (ii) the second resilient prong has: (a) a proximal end affixed to the body, (b) a second contactor edge disposed in the contact plane, and (c) a movable distal end extending beyond the holding portion; (iii) a contactor edge of a first portion of a perimeter of the aperture (third contactor edge) and a contactor edge of a second portion of the perimeter are disposed in the contact plane (fourth contactor edge); (iv) an actuating edge of the movable distal end of the first prong (first actuating edge) is juxtaposed to an actuating edge of the movable distal end of the second prong (second actuating edge); (v) the first contactor edge is disposed to enable it to resiliently hold the device against the third contactor edge and the second contactor edge is disposed to enable it to resiliently hold the device against the fourth contactor edge; and (vi) urging apart the first actuating edge from the second actuating edge enables the device to be placed into or released from the carrier. | 09-16-2010 |
20100243071 | Method and Apparatus for Aligning and/or Leveling a Test Head - One embodiment of the present invention is a method for aligning a first workpiece to a second work piece that includes: (a) placing the first workpiece on an alignment apparatus including: (i) two or more fluid chambers disposed in fixed relation to each other, the chambers having a movable wall and one or more apertures for admitting or releasing fluid; (ii) fluid channels coupled to the one or more apertures that enable fluid to flow between at least two of the fluid chambers; and (iii) one or more valves disposed to enable or to stop the flow of fluid through one or more of the one or more fluid channels; (b) pumping incompressible fluid into the fluid chambers; (c) opening the one or more valves; (d) bringing the first and second workpieces into contact; (e) waiting a predetermined time for fluid flow in the fluid channels; (f) determining whether the first and second workpieces are aligned; (g) if they are aligned, shutting the valves; and (h) if they are not aligned, moving the second workpiece a predetermined amount in a predetermined direction, and returning to waiting. | 09-30-2010 |
20100273364 | Axially Compliant Microelectronic Contactor - One embodiment is an axially compliant electrical contactor for interconnecting microelectronic devices, the contactor including: an insulative sleeve having a hole therethrough; and a metal tube having a cylindrical wall being slidably disposed in the hole; wherein: (a) two or more elongated slots through the cylindrical wall extend from a first circumferential collar of the tube to a second circumferential collar of the tube; (b) the two or more slots form two or more elongated resilient legs connecting the first collar and the second collar; and (c) a portion of each elongated leg is disposed in the hole. | 10-28-2010 |
20110039424 | MINIATURE ELECTRICAL SOCKET ASSEMBLY WITH SELF-CAPTURING MULTIPLE-CONTACT-POINT COUPLING - A socket assembly formed of hollow tubes for connecting an array of terminals off opposing electronic structures with both axial and lateral resilience, wherein the resilience is achieved through angular cuts in the tubes. | 02-17-2011 |
20110074080 | Carrier for Holding Microelectronic Devices - One embodiment is a carrier for holding devices that includes a tray having one or more sites in which a device may be held, and a frame resiliently coupled to the tray so the tray is movable with respect to the frame. | 03-31-2011 |
20110074458 | Transport Apparatus for Moving Carriers of Test Parts - One embodiment is a transport apparatus for moving carriers of microelectronic devices along a track, the transport apparatus including: (a) a track with two rails adapted to support the carriers; (b) a trolley adapted to be transported in a direction along the track by a linear actuator; and (c) a first and a second engagement feature attached to the trolley wherein the first engagement feature is adapted to engage temporarily with a first of the carriers, and the second engagement feature is adapted to engage temporarily with a second of the carriers; wherein a predetermined movement of the trolley slidably moves the first carrier onto a test position and slidably moves the second carrier off the test position simultaneously. | 03-31-2011 |
20120137512 | Method for Stacking Microelectronic Devices - Method for stacking microelectronic devices using two or more carriers, each holding microelectronic devices in an array so they may be registered. Each device is releasably held by its edges in a carrier to allow access to top and bottom surfaces of the device for joining. Arrays of devices held in two or more carriers are juxtaposed and joined to form an array of stacked devices. A resulting stacked device is released from the juxtaposed carriers holding each device by releasing forces of the corresponding carrier urging upon edges of the device, thereby permitting removal of the stacked device. | 06-07-2012 |
20120139176 | Precision Carrier for Microelectronic Devices - A carrier for one or more microelectronic devices, for example and without limitation, bare semiconductor chips, that are releasably held on their edges in apertures in a planar body. A device may be released from an aperture by resilient distortion of the aperture in the plane of the planar body. | 06-07-2012 |
20120142210 | Socket Cartridge and Socket Cartridge Assembly - A socket cartridge including: a contactor holder adapted to hold one or more electrical contactors disposed therein; and one or more pairs of spring structures; wherein each spring structure (a) is attached at a proximal end to the contactor holder, (b) includes an engagement feature disposed at a distal end thereof and a spring member attached to the engagement feature, and (c) the spring member is adapted to urge the engagement feature in a direction that points outward from a distal end of the contactor holder. A socket assembly that includes: (a) a mounting plate having one or more pairs of mating guides disposed on opposite sides of an aperture; and (b) the socket cartridge disposed in the aperture. | 06-07-2012 |
20130068442 | Method and Apparatus for Controlling Temperature - Apparatus to control a temperature of a device includes: a fluid path adapted to be in thermal contact with the device and to receive thermal transfer fluid from a combined path and to output it fluidly to a pump assembly disposed to output the thermal transfer fluid fluidly to a first path thermally connected to a heating assembly and fluidly connected to the combined path, a second path thermally connected to a cooling assembly and fluidly connected to the combined path, and a third path fluidly connected to the combined path; a temperature sensor in communication with a controller to sense a temperature in response to the fluid path; and first, second and third valves operable in response to the controller in the respective paths. | 03-21-2013 |
20130228914 | Heat Sink Apparatus for Microelectronic Devices - One embodiment of the present invention is a heat sink apparatus for cooling a semiconductor device includes: (a) a rigid support ring having a top surface and a bottom surface; (b) a thermally conductive bottom sheet having a top and a bottom surface, wherein the top surface of the sheet is attached to the bottom surface of the rigid support ring; and (c) a channel for cooling fluid formed by a volume contained by the rigid support ring, the sheet, and an enclosure; wherein the sheet is held in tension by the rigid support ring, thereby reducing the macroscopic coefficient of thermal expansion (CTE) of the sheet. In use, thermally induced mechanical stress in a semiconductor device attached to the bottom surface of the sheet may be ameliorated by the reduction in macroscopic CTE, thereby increasing reliability of an assembly as it is cycled in temperature during normal operation. | 09-05-2013 |