Patent application number | Description | Published |
20080299384 | BARRIER COATING AND METHOD - A barrier coating for a composite article is provided. The barrier coating includes an organic zone; an inorganic zone; and an interface zone between the organic zone and the inorganic zone. | 12-04-2008 |
20100133683 | SYSTEM AND APPARATUS FOR VENTING ELECTRONIC PACKAGES AND METHOD OF MAKING SAME - An apparatus and method, the apparatus includes a substrate configured to support a plurality of dielectric layers, a device coupling area positioned in the substrate, and a plurality of gas exit apertures formed through the substrate. The plurality of gas exit apertures is configured to provide venting of at least one of moisture and outgassed material and the device coupling area is configured to receive an electronic device coupleable to the plurality of dielectric layers. | 06-03-2010 |
20100207261 | CHIP ATTACH ADHESIVE TO FACILITATE EMBEDDED CHIP BUILD UP AND RELATED SYSTEMS AND METHODS - Present embodiments are directed to an adhesive and method for assembling a chip package. The adhesive may be used to couple a chip to a substrate, and the adhesive may include an epoxy-based dielectric material, an epoxy resin, a photoacid generator, an antioxidant, and a cold catalyst corresponding to the photoacid generator. | 08-19-2010 |
20100296261 | ELECTRICAL CONNECTORS FOR OPTOELECTRONIC DEVICE PACKAGING - Packaged optoelectronic device include a first barrier layer having a plurality of feedthrough apertures communicating with at least one electrode layer of the device, and a plurality of conductive patches disposed on at least one of the plurality of feedthrough apertures for electrically connecting the device to a power supply. Each conductive patch includes a conductive metal surface layer and a non-conducting surface layer having an opening exposing the metal surface layer. | 11-25-2010 |
20110215480 | STRESS RESISTANT MICRO-VIA STRUCTURE FOR FLEXIBLE CIRCUITS - A chip package is disclosed that includes an electronic chip having a plurality of die pads formed on a top surface thereof, with a polyimide flex layer positioned thereon by way of an adhesive layer. A plurality of vias is formed through the polyimide flex layer and the adhesive layer corresponding to the die pads. A plurality of metal interconnects are formed on the polyimide flex layer each having a cover pad covering a portion of a top surface of the polyimide flex layer, a sidewall extending down from the cover pad and through the via along a perimeter thereof, and a base connected to the sidewall and forming an electrical connection with a respective die pad. Each of the base and the sidewall is formed to have a thickness that is equal to or greater than a thickness of the adhesive layer. | 09-08-2011 |
20120146234 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF - A semiconductor device package includes a semiconductor device having connection pads formed thereon, with the connection pads being formed on first and second surfaces of the semiconductor device with edges of the semiconductor device extending therebetween. A first passivation layer is applied on the semiconductor device and a base dielectric laminate is affixed to the first surface of the semiconductor device that has a thickness greater than that of the first passivation layer. A second passivation layer having a thickness greater than that of the first passivation layer is applied over the first passivation layer and the semiconductor device to cover the second surface and the edges of the semiconductor device, and metal interconnects are coupled to the connection pads, with the metal interconnects extending through vias formed through the first and second passivation layers and the base dielectric laminate sheet to form a connection with the connection pads. | 06-14-2012 |
20120222721 | PHOTOVOLTAIC MODULE PACKAGE AND FABRICATION METHOD - A photovoltaic module package and fabrication method. The module includes photovoltaic cells, a dielectric material, and metallized material. Each photovoltaic cells includes a substrate material having a sun side and a backside, first doped regions interdigitated with second doped regions, both doped regions being located on the backside, and one being positively doped and the being negatively doped, and electrical contacts on each of the first and second doped regions. The dielectric material is adhered to the backside of the substrate material. Vias are formed through the dielectric material, extending to at least a portion of the electrical contacts. The metallized material extends from the electrical contacts through the vias and are patterned on a backside of the dielectric material. The metallized material is formed of a material that is both electrically and thermally conductive. | 09-06-2012 |
20120329207 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF - A semiconductor device package includes a semiconductor device having connection pads formed thereon, with the connection pads being formed on first and second surfaces of the semiconductor device with edges of the semiconductor device extending therebetween. A first passivation layer is applied on the semiconductor device and a base dielectric laminate is affixed to the first surface of the semiconductor device that has a thickness greater than that of the first passivation layer. A second passivation layer having a thickness greater than that of the first passivation layer is applied over the first passivation layer and the semiconductor device to cover the second surface and the edges of the semiconductor device, and metal interconnects are coupled to the connection pads, with the metal interconnects extending through vias formed through the first and second passivation layers and the base dielectric laminate sheet to form a connection with the connection pads. | 12-27-2012 |
20130045575 | EPOXY ENCAPSULATING AND LAMINATION ADHESIVE AND METHOD OF MAKING SAME - An adhesive includes an epoxy resin and a hardener. The hardener includes trioxdiamine, diaminodicyclohexylmethane, toluene diamine, and bisphenol-A dianhydride. | 02-21-2013 |
20130214435 | EPOXY ENCAPSULATING AND LAMINATION ADHESIVE AND METHOD OF MAKING SAME - An adhesive includes an epoxy resin and a hardener. The hardener includes trioxdiamine, diaminodicyclohexylmethane, toluene diamine, and bisphenol-A dianhydride. | 08-22-2013 |