Patent application number | Description | Published |
20090100952 | Speed Change Device for Traveling Vehicle - 1. A speed change device for a traveling vehicle comprising: | 04-23-2009 |
20100025842 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE - A semiconductor module includes an insulating resin layer, a wiring layer provided on one main surface S | 02-04-2010 |
20100069748 | SYRINGE-LIKE HAND SWITCH - At the insertion movement of plunger member in cylinder member, a photosensor is in the position of sensing the movement of slit area. As a result, when the plunger member is pressed inward by an operator, light transmission zones and light shielding zones alternately provided in the slit area are sensed by the photosensor. Accordingly, there can be provided a syringe-like hand switch such that in the chemical introduction control of injector head for injection of chemicals, such as a contrast medium, in patients, both parameters for injection speed and injection quantity can be controlled by the senses at use of conventional syringes. | 03-18-2010 |
20100108497 | WATER TREATMENT APPARATUS - A water softening module has a case body which includes cover members secured to their respective ends of a cylindrical case. A pair of electrodes are provided in the case body. A fibrous medium is located in contact with a water-outlet-side face of the electrodes. The fibrous medium has a stacked structure constituted of a first fiber layer and a second fiber layer, which are electrically conductive. The first fiber layer is positioned in contact with the upstream side of the second fiber layer, and the first fiber layer is positioned in contact with the downstream-side face of the electrodes. The specific surface area of the first layer is smaller than that of the second fiber layer. | 05-06-2010 |
20100132992 | DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE - In a semiconductor module having the structure in which a bump electrode provided on a wiring layer is connected to a device electrode provided on a semiconductor device, connection reliability between the bump electrode and the device electrode is improved. An insulating resin layer is provided between the semiconductor device and the wiring layer. The bump electrode, formed integrally with the wiring layer and projected from the wiring layer toward the insulating resin layer, is electrically connected to the device electrode provided on the semiconductor device. Part of the height of the wiring layer on the end side in a bump connection area is lower than that of the wiring in a wiring area extending toward the side opposite to the end side. | 06-03-2010 |
20110266660 | INSULATING FILM FOR SEMICONDUCTOR DEVICE, PROCESS AND APPARATUS FOR PRODUCING INSULATING FILM FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING THE SEMICONDUCTOR DEVICE - An object is to provide an insulating film for a semiconductor device which has characteristics of a low permittivity, a low leakage current, and a high mechanical strength, undergoes less change in these characteristics with the elapse of time, and has an excellent water resistance, as well as to provide a process and an apparatus for producing the insulating film for a semiconductor device, a semiconductor device, and a process for producing the semiconductor device. A gas containing a raw material gas which gasified a predetermined alkylborazine compound is supplied in a chamber ( | 11-03-2011 |
20140077354 | SEMICONDUCTOR MODULE AND AN INVERTER MOUNTING SAID SEMICONDUCTOR MODULE - A semiconductor module has a first substrate and a second substrate placed opposite to the first substrate. A first semiconductor element is provided such that the high-heat main face of the first semiconductor faces the second substrate and is thermally connected to the second substrate via a wiring layer. A second semiconductor element is provided such that the high-heat main face of the second semiconductor faces the first substrate and is thermally connected to the first substrate via another wiring layer. The emitter electrode of the first semiconductor element and the collector electrode of the second semiconductor element are electrically connected to each other via a heat spreader. | 03-20-2014 |
20150202425 | STOPCOCK FLOW PATH SWITCHING DEVICE - This stopcock flow path switching device includes: a three-way stopcock having a flow path switching cock and provided to, by switching of the flow path switching cock, allow flow path switching between a state in which a contrast agent introducing flow path is formed by coupling a flow path on the patient side to a flow path on the injector head side and a state in which a blood pressure measuring flow path is formed by coupling the flow path on the patient side to a flow path on the blood pressure transducer side; and a clamp mechanism for closing the flow path of the three-way stopcock communicating with the injector head side, in the state in which the blood pressure measuring flow path is formed. | 07-23-2015 |