Patent application number | Description | Published |
20080308976 | CERAMIC SUBSTRATE PRODUCTION PROCESS AND CERAMIC SUBSTRATE PRODUCED USING THE PROCESS - A process for producing a multilayered ceramic substrate having a step portion of a desired shape does not require complicated process steps and equipment. An auxiliary-layer-lined unfired ceramic body, which has a step portion in a principal surface thereof, has an unfired ceramic body and an auxiliary layer which is adhered to one principal surface of the unfired ceramic body and which is made of a material that is substantially unsinterable at a temperature at which the unfired ceramic body is fired. The auxiliary-layer-lined unfired ceramic body is fired at a temperature at which the unfired ceramic body is sinterable but the auxiliary layer is substantially unsinterable, while the auxiliary layer remains adhered to the unfired ceramic body. A pressing operation is performed by using a die having a projection placed on the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer, so that the step portion, having a shape corresponding to the outer shape of the die projection, is formed in the side of the auxiliary-layer-lined unfired ceramic body retaining the auxiliary layer. | 12-18-2008 |
20100038013 | METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC DEVICE - In a method for manufacturing a multilayer ceramic substrate in which, after firing is performed while restriction layers which are not sintered in the firing are disposed on primary surfaces of an unsintered ceramic laminate, the restriction layers are removed, when a bonding force generated by each restriction layer is increased, the restriction layers cannot be easily removed, and when the restriction layers are designed to be easily removed, the bonding force decreases. In an unsintered ceramic laminate, conductive patterns containing Ag as a primary component are formed, and in addition, at least one first base layer and at least one second base layer are also laminated to each other. The second base layer is disposed along at least one primary surface of the unsintered ceramic laminate, and restriction layers are disposed so as to be in contact with the second base layers. The second base layer is formed to have a composition so that Ag is likely to diffuse during firing as compared to that of the first base layer, and as a result, the glass softening point decreases; hence, a restriction force is improved without using means for decreasing the particle diameter of a sintering resistant ceramic powder contained in the restriction layers. | 02-18-2010 |
20110036622 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a laminated ceramic electronic component, in order to form a green ceramic laminate to be fired, first ceramic green layers which include first conductor patterns including Ag as a main component and which include a first ceramic material including a first glass component are disposed in surface layer portions. Second ceramic green layers which include second conductor patterns including Ag as a main component, which include a second ceramic material containing a second glass component, and which include a composition in which Ag diffuses than more easily in the first ceramic green layer during firing are disposed in inner layer portions. The green ceramic laminate is fired to produce a multilayer ceramic substrate. | 02-17-2011 |
Patent application number | Description | Published |
20110279945 | ESD PROTECTION DEVICE - An ESD protection device includes a ceramic multilayer substrate including a plurality of laminated insulating layers, an external electrode, at least one of an in-plane connecting conductor and an interlayer connecting conductor, and a mixture portion. The mixture portion is provided along a principal surface of one of the insulating layers and includes a dispersed material including at least one of metal and semiconductor; metal and ceramic; metal, semiconductor, and ceramic; semiconductor and ceramic; semiconductor; metal coated with an inorganic material; metal coated with an inorganic material and semiconductor; metal coated with an inorganic material and ceramic; and metal coated with an inorganic material, semiconductor, and ceramic. The mixture portion is connected to the external electrode and at least one of the in-plane connecting conductor and the interlayer connecting conductor. | 11-17-2011 |
20110286142 | ESD PROTECTION DEVICE AND METHOD FOR PRODUCING THE SAME - An ESD protection device includes an insulating ceramic substrate excluding a glass ceramic substrate, first and second discharge electrodes provided on the insulating ceramic substrate and including respective edges that face each other with a gap therebetween, and a discharge supporting electrode provided on the insulating ceramic substrate so as to electrically connect the first and second discharge electrodes to each other, the discharge supporting electrode including a ceramic material and metal particles whose surfaces are coated with insulating inorganic material powder. A thermosetting resin-cured layer including a cavity is provided on the insulating ceramic substrate so that the portions of the first and second discharge electrodes that face each other with a gap therebetween are present in the cavity. | 11-24-2011 |
20120299693 | ESD PROTECTION DEVICE - An ESD protection device includes a ceramic multilayer substrate in which a plurality of ceramic insulating layers are laminated; a first connecting conductor extending through the main surfaces of the insulating layer; a mixture portion extending along a main surface of the insulating layer including the first connecting conductor and connected to the first connecting conductor, the mixture portion including a material dispersed therein, the material including at least one selected from a metal and a semiconductor, a metal and a ceramic, a semiconductor and a ceramic, a semiconductor, and a metal coated with an inorganic material; and a second connecting conductor that has electrical conductivity and is connected to the mixture portion and extends along the main surface of the insulating layer on which the mixture portion is provided. | 11-29-2012 |
20130077199 | ESD PROTECTION DEVICE - A highly reliable ESD protection device that prevents failure of discharge and variation of a discharge start voltage even when protection from static electricity is repeatedly performed includes a cavity provided in a ceramic multilayer substrate. First and second discharge electrodes are provided in the ceramic multilayer substrate and face each other across a gap. A tip of the first discharge electrode and a tip of the second discharge electrode are positioned at edges of the cavity or at positions receded from the edges. | 03-28-2013 |
20130154785 | LAMINATED TYPE INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREFOR - In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state. | 06-20-2013 |
20130201585 | METHOD FOR MANUFACTURING ESD PROTECTION DEVICE AND ESD PROTECTION DEVICE - In a method for manufacturing an ESD protection device and an ESD protection device, on sheets defining insulating layers, portions defining a first connection conductor and a second connection conductor and a portion defining a mixed portion are formed, then the sheets are laminated and heated. The mixed portion is formed using a mixed portion formation material containing a cavity formation material and a solid component containing at least one of (i) a metal and a semiconductor, (ii) a metal and ceramic, (iii) a metal, a semiconductor, and ceramic, (iv) a semiconductor and ceramic, (v) a semiconductor, (vi) a metal coated with an inorganic material, (vii) a metal coated with an inorganic material and a semiconductor, (viii) a metal coated with an inorganic material and ceramic, and (ix) a metal coated with an inorganic material, a semiconductor, and ceramic. The cavity formation material disappears during heating. | 08-08-2013 |