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| 20080310153 | Backlight and liquid crystal display device - A side light type backlight includes a light source including a plurality of LEDs, and a light guide plate. One of the end surfaces of the light guide plate is a light incidence surface at which a plurality of R-LEDs, a plurality of G-LEDs and a plurality of B-LEDs are arranged. LEDs satisfy the relationship of: a distribution range of light emitted from G-LEDs | 12-18-2008 |
| 20100027290 | BACKLIGHT AND LIQUID CRYSTAL DISPLAY DEVICE - A side light type backlight includes a light source including a plurality of LEDs, and a light guide plate. One of the end surfaces of the light guide plate is a light incidence surface at which a plurality of R-LEDs, a plurality of G-LEDs and a plurality of B-LEDs are arranged. LEDs satisfy the relationship of: a distribution range of light emitted from G-LEDs | 02-04-2010 |
| 20110075444 | BACKLIGHT AND LIQUID CRYSTAL DISPLAY DEVICE - A side light type backlight includes a light source including a plurality of LEDs, and a light guide plate. One of the end surfaces of the light guide plate is a light incidence surface at which a plurality of R-LEDs, a plurality of G-LEDs and a plurality of B-LEDs are arranged. LEDs satisfy the relationship of: a distribution range of light emitted from G-LEDs | 03-31-2011 |
| 20110181815 | REFLECTION-TYPE LIQUID CRYSTAL DISPLAY DEVICE - To suppress a decrease in the contrast caused by the reflection on the interface to the air layer without decreasing the quality of display. A reflection-type liquid crystal display device includes a light guide plate having a polarizing element stuck or adhered thereto on the side facing a reflection-type liquid crystal display panel and arranged maintaining a predetermined gap relative to the reflection-type liquid crystal display panel. The display device further includes a source of light arranged on an end surface side of the light guide plate, and a member having a light-diffusing function and interposed between the polarizing element and the light guide plate. | 07-28-2011 |
| 20110292097 | ILLUMINATION DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - An illumination device is provided which can reduce a movement blur and a tailing phenomenon on a motion picture display while a drop in display brightness is suppressed, and which can suppress power consumption, can be made small and light, and can prolong the lifetime, and a liquid crystal display device using the same is provided. A light source control part of a control circuit synchronizes a latch pulse signal outputted from a gate driver control part to a gate driver, and outputs light emission control signals to respective light source power supply circuits. The respective light source power supply circuits change emission states of cold cathode fluorescent lamps to one of a first to a third emission states on the basis of the inputted light emission control signals, and illuminate an LCD panel from a rear surface of a display area. A first stage emission state is a non-lighting state, a second stage emission state is a maximum lighting state in which maximum lighting brightness is obtained, and a third emission state is an intermediate lighting state in which brightness of about one half of the second stage emission state is obtained. | 12-01-2011 |
| 20120087150 | BACKLIGHT AND LIQUID CRYSTAL DISPLAY DEVICE - A side light type backlight includes a light source including a plurality of LEDs, and a light guide plate. One of the end surfaces of the light guide plate is a light incidence surface at which a plurality of R-LEDs, a plurality of G-LEDs and a plurality of B-LEDs are arranged. LEDs satisfy the relationship of: a distribution range of light emitted from G-LEDs | 04-12-2012 |
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| 20090135592 | LED PACKAGE, AND ILLUMINATION DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE PROVIDED THEREWITH - In an LED package, LED chips are connected in parallel by wires between lead frames connected to terminals. When an open circuit failure such as the coming off of the wire occurs in one of the LED chips in the LED package that is being energized, a current twice as high as that flowing through the other LED chip prior to the open circuit failure is passed through the other LED chip, and thus the amount of light emitted therefrom is increased about two-fold. Consequently, the amount of light emitted from the LED package does not change significantly. | 05-28-2009 |
| 20090279284 | ILLUMINATION DEVICE, LIGHT SOURCE DEVICE USED FOR THE SAME, AND LIQUID CRYSTAL DISPLAY EQUIPPED WITH THE ILLUMINATION DEVICE - In the case where RGB light emitting elements are used as light sources of a surface emitting type illumination device, the occurrence of color irregularity in the vicinity of a light incident surface is prevented, so that uniform white light is obtained on an entire light outgoing surface. In a light source device including light emitting elements of respective colors including red light emitting elements, green light emitting elements, and blue light emitting elements that emit light in a red (R) wavelength range, light in a green (G) wavelength range, and light in a blue (B) wavelength range, respectively, the light emitting elements being provided on one principal surface of a substrate, the light emitting elements of the respective colors are aligned in a longitudinal direction of the substrate, the number of the green light emitting elements is larger than the number of each of the red light emitting elements and the blue light emitting elements, and the light emitting elements of the respective colors in the longitudinal direction of the substrate are aligned at regular Intervals for each of the colors. | 11-12-2009 |
| 20100134716 | LIGHT EMITTING ELEMENT, LIGHT EMITTING ELEMENT ARRAY, BACKLIGHT UNIT, AND LIQUID CRYSTAL DISPLAY - An LED package housing member that includes a light emitting chip has a missing portion in its side walls. | 06-03-2010 |
| 20100231613 | ILLUMINATION DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE PROVIDED THEREWITH - An illumination device includes a light source section with white LEDs on a side of a light guide plate. The white LED includes a first white LED and a second white LED, and they emit light of different chromaticities. In a chromaticity diagram, a white color area is divided into two subareas by a dividing line passing through a target chromaticity; light emitted by the first white LED falls within a first subarea, and light emitted by the second white LED falls within a second subarea. By individually controlling the light emission of the first white LED and the second white LED, it is possible to emanate a desired white light from the light guide plate. | 09-16-2010 |
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| 20090120362 | TEMPERATURE MEASUREMENT IN A SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus is configured to provide in series a plurality of processing blocks, each block including a processing unit and a transport robot transporting a substrate. A substrate rest is provided in a connecting portion of adjacent processing blocks. A sensor plate with sensor coils is provided spanning over support pins of the substrate rest. Once a temperature-measurement substrate with temperature-measuring elements, each element formed by connecting a coil to a quartz resonator, is placed on the support pins, a transmitter-receiver transmits transmission waves corresponding to the characteristic frequencies of the quartz resonators to the temperature-measuring elements through the sensor coils. After the stop of the transmission, the transmitter-receiver receives electromagnetic waves from the temperature-measuring elements through the sensor coils, and the temperature computer computes the substrate temperature based on the frequencies of the electromagnetic waves. | 05-14-2009 |
| 20100075054 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected. | 03-25-2010 |
| 20100126527 | APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE SUBJECTED TO EXPOSURE PROCESS - A method of processing a substrate subjected to an exposure process includes the steps of: transporting a substrate subjected to the exposure process to a cleaning processing part and performing a cleaning process in said cleaning processing part on said substrate subjected to the exposure process. The method also includes the steps of transporting said substrate subjected to the cleaning process from said cleaning processing part to a heating processing part and performing a heating process in said heating processing part on said substrate subjected to the cleaning process. A first interprocess time interval between the instant at which the exposure process of a substrate is completed and the instant at which the heating process of the substrate is started is made approximately constant, and a second interprocess time interval between the instant at which the cleaning process of the substrate is completed and the instant at which the heating process of the substrate is started is made approximately constant. | 05-27-2010 |
| 20100202867 | SUBSTRATE PROCESSING APPARATUS - A mode selection is carried out prior to the outward transfer of a substrate to be processed from an indexer block. When a “processing sequence priority mode” is selected, a transport path for the substrate is defined prior to the outward transfer of the substrate. The definition of the transport path is carried out by determining to which of a plurality of parallel processing parts for performing each parallel process the substrate is to be transported. Next, based on the defined transport path, an adjustment is made to a processing condition established for each substrate processing part included in the transport path. Thereafter, the unprocessed substrate is transferred outwardly from the indexer block, and is transported and processed along the defined transport path. On the other hand, when a “throughput priority mode” is selected, a substrate is transported to a vacant one of the plurality of parallel processing parts. | 08-12-2010 |
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| 20080226830 | Method and system for removal of films from peripheral portions of a substrate - A substrate processing apparatus includes an anti-reflection film processing block, a resist film processing block, and a resist cover film processing block. In the processing blocks, an anti-reflection film, a resist film, and a resist cover film are formed on a substrate, respectively. Additionally, a film formed at a peripheral edge of the substrate is removed. The film formed at the peripheral edge of the substrate is removed by supplying a removal liquid capable of dissolving and removing the film to the peripheral edge of the substrate during rotation. When the peripheral edge of the film is removed, the position of the substrate is corrected such that the center of the substrate coincides with the center of a rotation shaft. | 09-18-2008 |
| 20090173364 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME - A fluid supply pipe is inserted through a motor supporting member, a spin motor, a rotating shaft, and a plate supporting member. A first flange is integrally formed in the vicinity of a curved portion of a straight portion, extending in the vertical direction, of the fluid supply pipe. The first flange is fixed to a motor supporting member. Thus, the fluid supply pipe is fixed to the spin motor through the motor supporting member. The fluid supply pipe has a configuration in which a gas supply pipe made of resin and a plurality of cleaning liquid supply pipes made of resin are accommodated inside a guide pipe made of stainless. Inside the guide pipe, the one gas supply pipe is surrounded by the plurality of cleaning liquid supply pipes. | 07-09-2009 |
| 20120037593 | METHOD AND SYSTEM FOR REMOVAL OF FILMS FROM PERIPHERAL PORTIONS OF A SUBSTRATE - A substrate processing apparatus includes an anti-reflection film processing block, a resist film processing block, and a resist cover film processing block. In the processing blocks, an anti-reflection film, a resist film, and a resist cover film are formed on a substrate, respectively. Additionally, a film formed at a peripheral edge of the substrate is removed. The film formed at the peripheral edge of the substrate is removed by supplying a removal liquid capable of dissolving and removing the film to the peripheral edge of the substrate during rotation. When the peripheral edge of the film is removed, the position of the substrate is corrected such that the center of the substrate coincides with the center of a rotation shaft. | 02-16-2012 |
