Patent application number | Description | Published |
20120095488 | LANCET PRICKING DEVICE - There is provided a lancet pricking device which is prevented from being re-used, and also the pricking pathway of the needle thereof is improved. The lancet pricking device comprising a lancet equipped with a pricking needle and a trigger for launching the pricking needle. The trigger comprises a first trigger part and a second trigger part disposed such as to cover the first trigger part. The lancet is in engagement with the first trigger part before the pricking needle is launched. When the second trigger part is pushed from the outside for the launching of the pricking needle, the displacement of the first trigger part is caused by the second trigger part, and thereby ceasing the engagement between the lancet and the first trigger part to launch the pricking needle. | 04-19-2012 |
20120203259 | LANCET PUNCTURE DEVICE - A lancet pricking device comprising a lancet, a launching spring and a lancet holder for housing therein the lancet and the launching spring. The lancet pricking device of the present invention is characterized in that the lancet comprises a lancet body, a lancet cap and a pricking needle, and the pricking needle is disposed in both the lancet body and the lancet cap; wherein the launching spring is attached to the lancet body, and the lancet body is secured by abutting against the lancet holder such that the launching spring is kept compressed before a pricking operation; and wherein, when the lancet cap is removed, the lancet body becomes capable of warping upon being pressed from an outside to cause the secured lancet body to be released. | 08-09-2012 |
20130317533 | LANCET DEVICE - There is provided a lancet device comprising a pricking part and a pressing part. In the lancet device of the present invention, the pricking part is comprised of a needle shaft component equipped with a pricking needle, a driving shaft component, and an intermediate shaft component therebetween, the needle shaft component, the driving shaft component and the intermediate shaft component being connected to each other via a joint component. When a pricking operation is performed, the driving shaft component of the pricking part is at least partly rotated by being pressed by a pressing action of the pressing part, and thereby the intermediate shaft component of the pricking part is displaced causing the needle shaft component to move in a pricking direction. | 11-28-2013 |
Patent application number | Description | Published |
20080206997 | Method for Manufacturing Insulating Film and Method for Manufacturing Semiconductor Device - A method for manufacturing an insulating film, by which the insulating film can be formed of a non-photosensitive siloxane resin and formed into a desired shape by wet etching. A thin film is formed with a suspension in which a siloxane resin or a siloxane-based material is included in an organic solvent; a first heat treatment is performed on the thin film; a mask is formed over the thin film after the first heat treatment; wet etching with an organic solvent is performed to process the shape of the thin film after the first heat treatment; and a second heat treatment is performed on the processed thin film. | 08-28-2008 |
20080309581 | SEMICONDUCTOR DEVICE - In a semiconductor device in which a copper plating layer is used for a conductor of an antenna and in which an integrated circuit and the antenna are formed over the same substrate, an object is to prevent an adverse effect on electrical characteristics of a circuit element due to diffusion of copper, as well as to provide a copper plating layer with favorable adhesiveness. Another object is to prevent a defect in the semiconductor device that stems from poor connection between the antenna and the integrated circuit, in the semiconductor device in which the integrated circuit and the antenna are formed over the same substrate. In the semiconductor device, a copper plating layer is used for the antenna, an alloy of Ag, Pd, and Cu is used for a seed layer thereof, and TiN or Ti is used for a barrier layer. | 12-18-2008 |
20090246953 | Method for Manufacturing Semiconductor Device - It is an object of the present invention to provide a semiconductor device including a wiring having a preferable shape. A manufacturing method includes the steps of forming a first conductive layer connected to an element and a second conductive layer thereover; forming a resist mask over the second conductive layer; processing the second conductive layer by dry etching with the use of the mask; and processing the first conductive layer by wet etching with the mask left, wherein the etching rate of the second conductive layer is higher than that of the first conductive layer in the dry etching, and wherein the etching rate of the second conductive layer is the same as or more than that of the first conductive layer in the wet etching. | 10-01-2009 |
20090305467 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An object is to provide a highly reliable semiconductor device that is reduced in thickness and size and has tolerance to external stress and electrostatic discharge. Another object is to prevent defective shapes and defective characteristics due to the external stress or an electrostatic discharge in the manufacturing process, and to manufacture a semiconductor device with high yield. Still another object is to manufacture a semiconductor device at low cost and with high productivity. With the use of a conductive shield covering a semiconductor integrated circuit, electrostatic breakdown (malfunctions of the circuit or damages of a semiconductor element) due to electrostatic discharge of the semiconductor integrated circuit is prevented. The conductive shield is formed so that at least the conductive shields on the top and bottom surfaces are electrically connected by a plating method. In addition, a semiconductor device can be formed at low cost with high productivity because a plating method is used for the formation of the conductive shield. | 12-10-2009 |
20100270868 | SEMICONDUCTOR DEVICE - An object of the present invention is to prevent electrical characteristics of circuit elements from being adversely affected by copper diffusion in a semiconductor device having an integrated circuit and an antenna formed over the same substrate, which uses copper plating for the antenna. Another object is to prevent a defect of a semiconductor device due to poor connection between an antenna and an integrated circuit in a semiconductor device having the integrated circuit and the antenna formed over the same substrate. In a semiconductor device having an integrated circuit | 10-28-2010 |
20100275989 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - An object relates to an electrode of a semiconductor device or a method for manufacturing a semiconductor device, which includes a bonding step, and problems are: (1) high resistance of a semiconductor device due to the use of an Al electrode, (2) formation of an alloy by Al and Si, (3) high resistance of a film formed by a sputtering method, and (4) defective bonding in a bonding step which is caused if a bonding surface has a large unevenness. A semiconductor device includes a metal substrate or a substrate provided with a metal film, a copper (Cu) plating film over and bonded to the metal substrate or the metal film by employing a thermocompression bonding method, a barrier film over the Cu plating film, a single crystal silicon film over the barrier film, and an electrode layer over the single crystal silicon film. | 11-04-2010 |
20110220891 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a wiring embedded in an insulating layer, an oxide semiconductor layer over the insulating layer, a source electrode and a drain electrode electrically connected to the oxide semiconductor layer, a gate electrode provided to overlap with the oxide semiconductor layer, and a gate insulating layer provided between the oxide semiconductor layer and the gate electrode. The insulating layer is formed so that part of a top surface of the wiring is exposed. The part of the top surface of the wiring is positioned higher than part of a surface of the insulating layer. The wiring in a region exposed from the insulating layer is electrically connected to the source electrode or the drain electrode. The root-mean-square roughness of a region which is part of the surface of the insulating layer and in contact with the oxide semiconductor layer is 1 nm or less. | 09-15-2011 |
20120074407 | Semiconductor device and method for manufacturing the same - An object is to provide a semiconductor device having a novel structure in which a transistor including an oxide semiconductor and a transistor including a semiconductor material other than an oxide semiconductor are stacked. The semiconductor device includes a first transistor, an insulating layer over the first transistor, and a second transistor over the insulating layer. In the semiconductor device, the first transistor includes a first channel formation region, the second transistor includes a second channel formation region, the first channel formation region includes a semiconductor material different from a semiconductor material of the second channel formation region, and the insulating layer includes a surface whose root-mean-square surface roughness is less than or equal to 1 nm. | 03-29-2012 |
20120108014 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An object is to provide a highly reliable semiconductor device that has tolerance to external stress and electrostatic discharge. Another object is to prevent defective shapes and defective characteristics due to the external stress or an electrostatic discharge in the manufacturing process, and to manufacture a semiconductor device with high yield. Still another object is to manufacture a semiconductor device at low cost and with high productivity. With the use of a conductive shield, electrostatic breakdown (malfunctions of the circuit or damages of a semiconductor element) due to electrostatic discharge of the semiconductor integrated circuit is prevented. The conductive shield is formed so that at least the conductive shields on the top and bottom surfaces are electrically connected by a plating method. In addition, a semiconductor device can be formed at low cost with high productivity because a plating method is used for the formation of the conductive shield. | 05-03-2012 |
20120146065 | LIGHTING EMITTING DEVICE, MANUFACTURING METHOD OF THE SAME, ELECTRONIC DEVICE HAVING THE SAME - One pixel is divided into a first region including a first light emitting element and a second region including a second light emitting element, wherein the first region emits light in one direction and the second region emits light in the direction opposite to that of the first region. Independently driving the first light emitting element and the second light emitting element allows images to be displayed independently on the surface. | 06-14-2012 |
20120187396 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A base insulating film is formed over a substrate. A first oxide semiconductor film is formed over the base insulating film, and then first heat treatment is performed to form a second oxide semiconductor film. Then, selective etching is performed to form a third oxide semiconductor film. An insulating film is formed over the first insulating film and the third oxide semiconductor film. A surface of the insulating film is polished to expose a surface of the third oxide semiconductor film, so that a sidewall insulating film is formed in contact with at least a side surface of the third oxide semiconductor film. Then, a source electrode and a drain electrode are formed over the sidewall insulating film and the third oxide semiconductor film. A gate insulating film and a gate electrode are formed. | 07-26-2012 |
20120193435 | SEMICONDUCTOR DEVICE - An object of the present invention is to prevent electrical characteristics of circuit elements from being adversely affected by copper diffusion in a semiconductor device having an integrated circuit and an antenna formed over one substrate, which uses copper plating for the antenna. Another object is to prevent a defect of a semiconductor device due to poor connection between an antenna and an integrated circuit in a semiconductor device having the integrated circuit and the antenna formed over one substrate. In a semiconductor device having an integrated circuit | 08-02-2012 |
20140203978 | SEMICONDUCTOR DEVICE - In a semiconductor device in which a copper plating layer is used for a conductor of an antenna and in which an integrated circuit and the antenna are formed over the same substrate, an object is to prevent an adverse effect on electrical characteristics of a circuit element due to diffusion of copper, as well as to provide a copper plating layer with favorable adhesiveness. Another object is to prevent a defect in the semiconductor device that stems from poor connection between the antenna and the integrated circuit, in the semiconductor device in which the integrated circuit and the antenna are formed over the same substrate. In the semiconductor device, a copper plating layer is used for the antenna, an alloy of Ag, Pd, and Cu is used for a seed layer thereof, and TiN or Ti is used for a barrier layer. | 07-24-2014 |
Patent application number | Description | Published |
20090176374 | PATTERN FORMING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND STORAGE MEDIUM - A pattern forming method includes (a) forming pairs of deposits on sidewalls of mask portions in first mask patterns by forming a thin film thereon, etching it to leave deposits, and exposing a top surface of a second-layer film between the deposits; (b) forming second mask patterns formed of mask portions corresponding to the deposits by removing the mask portion, plasma etching the second-layer film, and removing the deposits; (c) forming a thin film thereon, and etching it to leave deposits on sidewalls of mask portions facing each other and to expose a third-layer film between the deposits while leaving deposits between adjacent mask portions; and (d) forming grooves thereon by removing the second mask portion, and etching off the third-layer film. | 07-09-2009 |
20090206253 | SUBSTRATE INSPECTION METHOD, SUBSTRATE INSPECTION APPARATUS AND STORAGE MEDIUM - In a substrate inspection method, it is inspected whether the metal electrode is electrically connected to the conductive film by radiating electron beams onto a surface of the substrate to detect the number of secondary electrons emitted therefrom. The method includes placing the substrate onto a mounting table; inspecting the metal electrode by radiating electron beams onto an area of the substrate including the metal electrode at a first acceleration voltage and detecting secondary electrons emitted from the metal electrode; and radiating electron beams onto an area of the substrate not including the metal electrode at a second acceleration voltage. The second acceleration voltage is set such that a difference between the number of electrons entering the insulation film and the number of secondary electrons emitted from the insulation film is smaller at the second acceleration voltage than at the first acceleration voltage. | 08-20-2009 |
20120160671 | SPUTTERING DEVICE - Provided is a sputtering device which can achieve a sputtering while blocking light that enters from a sputtering space onto a substrate as an object to be sputtered on which an organic thin film is formed, thereby preventing the deterioration in properties of the organic thin film. Specifically provided is a sputtering device for achieving a sputtering of a substrate that is placed on the side of a sputtering space, wherein the sputtering space is formed between a pair of targets that are so placed as to face each other. The sputtering device comprises: an electric power source configured to apply a voltage between the pair of targets; a gas supply unit configured to supply an inert gas to the sputtering space; and a light-shielding mechanism configured to be placed between the sputtering space and the substrate. | 06-28-2012 |
20130126939 | SEALING FILM FORMING METHOD, SEALING FILM FORMING DEVICE, AND LIGHT-EMITTING DEVICE - A sealing film forming method is capable of forming a sealing film having high moisture permeability resistance in a shorter time and at lower cost. The sealing film forming method for forming a sealing film | 05-23-2013 |
Patent application number | Description | Published |
20110090612 | ATMOSPHERE CLEANING DEVICE - Provided is an atmosphere cleaning device comprising a means for establishing a down-flow in the atmosphere, in which a treating object is positioned, a plurality of ionizers arranged at positions above the treating object and symmetrically in the layout, as viewed downward, across the treating object, for feeding either cation or anion transversely of the down-flow, and a means for applying such a DC voltage to the treating object as has the same polarity as that of the voltage being applied to those ionizers. The atmosphere cleaning device is characterized in that the symmetrically arranged ionizers are arranged to face each other. | 04-21-2011 |
20110240223 | SUBSTRATE PROCESSING SYSTEM - There is provided a substrate processing system having high maintainability by widening a gap between various processing apparatuses connected with side surfaces of transfer modules and capable of achieving sufficient productivity by avoiding deterioration in throughput. The substrate processing system for manufacturing an organic EL device by forming a multiple number of layers including, e.g., an organic layer on a substrate includes at least one transfer module configured to be evacuable and arranged along a straight transfer route. Within the transfer module, a multiple number of loading/unloading areas for loading/unloading the substrate with respect to a processing apparatus and at least one stocking area positioned between the loading/unloading areas are alternately arranged along the transfer route in series, and the processing apparatus is connected with a side surface of the transfer module at a position facing each of the loading/unloading areas. | 10-06-2011 |
20120031339 | DEPOSITION HEAD AND FILM FORMING APPARATUS - There is provided a deposition head capable of discharging a material gas having a uniform flow rate and equi-thermal property from each component in a large-sized substrate as well as a conventional small-sized one for forming a uniform thin film. A deposition apparatus including the deposition head is also provided. The deposition head is provided within a deposition apparatus for forming a thin film on a substrate and configured to discharge a material gas toward the substrate. The deposition head includes an outer casing, and an inner casing provided within the outer casing and into which the material gas is introduced. In the inner casing, an opening configured to discharge the material gas toward the substrate is formed, and a heater configured to heat the material gas is provided at an outer surface of the outer casing or in a space between the outer casing and the inner casing. | 02-09-2012 |
20120094014 | VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD - There is provided a vapor deposition apparatus and a vapor deposition method capable of efficiently sublimating/melting a granular organic material with high mobility. The vapor deposition apparatus for forming a thin film on a substrate by vapor deposition includes a depressurizable material supply apparatus configured to supply a material gas, and a film forming apparatus configured to form a thin film on the substrate. The material supply apparatus includes a quantity control unit configured to control a quantity of a material, and a material gas generating unit configured to vaporize the material supplied from the quantity control unit. | 04-19-2012 |
Patent application number | Description | Published |
20080239283 | Particle measuring method and particle measuring apparatus - The present invention relates to a particle measuring method for irradiating light to a surface of a substrate to scatter the light so as to measure a condition of particles on the substrate based on the scattered light. The particle measuring method according to the present invention comprises the steps of: heating a certain liquid to obtain a steam; supplying the steam onto a substrate so that a content of the steam is absorbed by each particle, while a temperature of the substrate is maintained in such a manner that the steam does not condense on the substrate; cooling the substrate before the particle dries so that the content absorbed by the particle is solidified, while preventing generation of solidified substance on regions of the surface of the substrate to which no particle adheres; and irradiating light to the substrate to scatter the light and detecting the scattered light, under a condition in which the content absorbed by the particle has been solidified. | 10-02-2008 |
20080274288 | VACUUM PROCESSING APPARATUS AND METHOD - A gas exhaust unit evacuates the inside of a vacuum transfer chamber at a constant exhaust rate. An gas exhaust valve is kept normally open, and a purge gas (N | 11-06-2008 |
20090194233 | Component for semicondutor processing apparatus and manufacturing method thereof - A component ( | 08-06-2009 |
20110244693 | COMPONENT FOR SEMICONDUCTOR PROCESSING APPARATUS AND MANUFACTURING METHOD THEREOF - A component for a semiconductor processing apparatus includes a matrix defining a shape of the component, and a protection film covering a predetermined surface of the matrix. The protection film consists essentially of an amorphous oxide of a first element selected from the group consisting of aluminum, silicon, hafnium, zirconium, and yttrium. The protection film has a porosity of less than 1% and a thickness of 1 nm to 10 μm. | 10-06-2011 |
20120298132 | SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND SUBSTRATE PROCESSING APPARATUS - A substrate cleaning apparatus is capable of cleaning an entire periphery of a substrate end portion at a time by simple control without polishing the end portion and without generating plasma. The substrate cleaning apparatus has a mounting table | 11-29-2012 |
Patent application number | Description | Published |
20110067904 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A flex-rigid wiring board includes a flexible substrate having a first surface and a second surface on the opposite side of the first surface, a first conductive pattern formed on the first surface of the flexible substrate, a second conductive pattern formed on the second surface of the flexible substrate, and a conductor made of a conductive paste and formed in a first hole penetrating through the flexible substrate such that the first conductive pattern and the second conductive pattern are electrically connected to each other. | 03-24-2011 |
20120181074 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion. | 07-19-2012 |
20130014982 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer. | 01-17-2013 |
20130020120 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad. | 01-24-2013 |
20130081857 | METHOD FOR MANUFACTURING MULTI-PIECE SUBSTRATE AND MULTI-PIECE SUBSTRATE - A method for manufacturing a multi-piece substrate includes preparing a first frame having a connecting portion to which a first piece substrate is to be connected, forming on a portion of the first piece substrate connected to a second frame a conductive pattern having a contour corresponding to the periphery of the connecting portion of the first frame, irradiating laser along the boundary between the second frame and the conductive pattern on the first piece substrate such that the first piece substrate having a joint portion which engages with the connecting portion of the first frame is detached from the second frame, and fitting the joint portion of the first piece substrate into the connecting portion of the first frame such that the first piece substrate is connected to the first frame. | 04-04-2013 |
20130153269 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer. | 06-20-2013 |
20130305530 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion. | 11-21-2013 |
20140063770 | METHOD FOR PLUG-IN BOARD REPLACEMENT, METHOD FOR MANUFACTURING MULTI-PIECE BOARD AND MULTI-PIECE BOARD - A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board. | 03-06-2014 |
20140131074 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate has a frame including a metal material and having a connecting portion, and a piece substrate connected to the connecting portion of the frame and having a metal pattern. The metal pattern of the piece substrate has a contour which is corresponding to an outer edge of the connecting portion of the frame. | 05-15-2014 |
20140133110 | COMBINED WIRING BOARD - A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction. | 05-15-2014 |
20140133111 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD - A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame. | 05-15-2014 |
20150055313 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD - A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame. | 02-26-2015 |
20150083471 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions. | 03-26-2015 |
20150085461 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD - A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards. | 03-26-2015 |
Patent application number | Description | Published |
20080271824 | Spring Steel Wire - The present invention provides a spring steel wire which has a tempered martensitic structure brought about by quenching-tempering. The present spring steel wire has a 40% or higher reduction of area and a 1,000 MPa or higher shear yield stress after subjected to heat treatment for at least hours at a temperature ranging from 420° C. to 480° C. The present steel wire preferably constitutes, based on mass %, C: 0.50-0.75%, Si: 1.80-2.70%, Mn: 0.1-0.7%, Cr: 0.70-1.50%, Co: 0.02-1.00%, and remnants consisting of Fe and impurities, or constitutes, based on mass %, C: 0.50-0.75%, Si: 1.80-2.70%, Mn: over 0.7-1.50%, Cr: 0.70-1.50%, and remnants consisting of Fe and impurities. | 11-06-2008 |
20090174129 | HIGH-STRENGTH STAINLESS STEEL SPRING AND METHOD OF MANUFACTURING THE SAME - Provided is a high-strength stainless steel spring exhibiting a good workability and having a high load characteristic. Thus, the high-strength stainless steel spring of the invention has an chemical component containing 0.04 to 0.08% by mass of C, 0.15 to 0.22% by mass of N, 0.3 to 2.0% by mass of Si, 0.5 to 3.0% by mass of Mn, 16 to 20% by mass of Cr, 8.0 to 10.5% by mass of Ni, 0.5 to 3.0% by mass of Mo, and the balance of Fe and inevitable impurities, and when the average diameter of the coil is represented by D and further the diameter of the steel wire is represented by d in the case that cross sections of the stainless steel wire are in a complete round form or the value obtained by subtracting the average coil diameter from the outer diameter of the coil is represented by d′ in the case that the cross sections of the stainless steel wire are in a form other than the complete round form, the spring has a spring index D/d or D/d′ of 2 to 6. | 07-09-2009 |
20090293998 | Oil-Tempered Wire and Method of Producing the Same - An oil-tempered wire that has high fatigue strength and toughness after the nitriding treatment, and a method of producing the same, and a spring using the oil-tempered wire are provided. The oil-tempered wire has a tempered martensite structure. A lattice constant of a nitride layer formed on a surface of the wire is 2.870 Å to 2.890 Å when the oil-tempered wire is nitrided. The oil-tempered wire is produced by wire drawing a steel wire and quenching and tempering the wire drawn steel wire. The quenching is performed after the radiation heating is performed at 850 to 950° C. for over 30 sec to 150 sec, and the tempering is performed at 400 to 600° C. | 12-03-2009 |
Patent application number | Description | Published |
20110108557 | PRESSURE VESSEL HAVING IMPROVED SEALING ARRANGEMENT - In a pressure vessel ( | 05-12-2011 |
20130205669 | WINDOW REGULATOR - A window regulator including a drive gear connected to a drive motor, an elongate push-pull member which is open ended and flexible, meshes with the drive gear, and can be pushed and pulled by bidirectional rotations of the drive gear, a carrier which is connected with one end of the elongate push-pull member and is also connected with window glass, and a guide rail which guides the elongate push-pull member and the carrier in a drive path. The window regulator further includes a frame in which a means for fixing and supporting the drive motor, a means for fixing and supporting the guide rail, a means for holding an orbit of the elongate push-pull member in an idle path, and a means for mounting on an object are integrally formed. | 08-15-2013 |
20130219794 | WINDOW REGULATOR - A window regulator includes: a drive gear attached to a drive motor; an open-ended pliable elongate push-pull member that meshes with the drive gear and is push-pulled by the two-way rotation of the drive gear; and a career connected to one end of the elongate push-pull member as well as a window glass, wherein, as viewed from a direction substantially perpendicular to the plate surface of the window glass, a drive route of the elongate push-pull member from an meshing portion between the drive gear and the elongate push-pull member to a mounting portion of the career is formed in a straight line, while at least a part of an idle route from the meshing portion to the other end of the elongate member is formed in a curved shape. | 08-29-2013 |
Patent application number | Description | Published |
20080224803 | SWITCH - A central magnet of a plurality of magnets arranged to be different in polarities is detected by two hall ICs; therefore, reduction in size can be achieved by reducing the number of the magnets; and at the same time, the number of the hall ICs can be maintained and the reliability can be secured, as compared with a configuration in which the magnets and the hall ICs individually respond in one to one correspondence. | 09-18-2008 |
20100164423 | SERVO SYSTEM AND SAFETY CONTROL DEVICE - This invention aims to achieve safety without interchanging an entire existing servo system to a servo system having the safety function. In a servo system including a servo motor, and a servo amplifier for controlling the drive of the servo motor based on the output of an encoder attached to the servo motor, a safety control device for monitoring presence of abnormality based on the output of the encoder, and shielding the supply of drive power to the servo motor if abnormality is present is arranged, and the monitoring content is set as setting information. | 07-01-2010 |
20120032690 | PROXIMITY SWITCH - Disclosed is a proximity switch provided with an actuator unit and a sensor unit. The sensor unit is provided with an antenna coil, a transmitting circuit which transmits electromagnetic waves at a constant frequency to the antenna coil, a receiving circuit which detects external signals received by means of the antenna coil, and control circuits. The actuator unit is provided with an antenna coil, a power supply circuit which rectifies an electromotive force generated in the antenna coil, and a signal processing circuit which receives power supply from the power supply circuit, performs frequency-dividing to the signals received by means of the antenna coil, and transmits the signals from the antenna coil after the frequency-dividing. The control circuit of the sensor unit has memory for registering the frequency of the signals transmitted from the actuator unit. The control circuit determines whether the actuator unit is in proximity to the sensor unit or not by checking the received signals detected by means of the receiving circuit with the operations of the transmitting circuit and the frequency registered in the memory. | 02-09-2012 |
Patent application number | Description | Published |
20110128549 | INTERFERENCE FILTER, OPTICAL SENSOR, AND OPTICAL MODULE - An interference filter includes: a first substrate; a second substrate that faces one side of the first substrate and is bonded to the first substrate; a first reflection film formed on the side of the first substrate that faces the second substrate; and a second reflection film provided on the second substrate and faces the first reflection film, the first substrate including a first gap formation region in which the first reflection film is disposed and which is not contact with the second substrate, and wherein the first substrate and the second substrate are adhesively bonded to each other with the adhesive applied into the adhesive grooves with the first bonding region and the second bonding region bonded to each other. | 06-02-2011 |
20120287438 | OPTICAL FILTER, OPTICAL FILTER MODULE, AND PHOTOMETRIC ANALYZER - An optical filter includes a first substrate, a second substrate opposed to the first substrate, a first optical film provided on a surface of the first substrate facing the second substrate, a second optical film provided on the second substrate and opposed to the first optical film via a gap, a first electrode provided on the surface of the first substrate facing the second substrate, and a second electrode provided on the second substrate and opposed to the first electrode, wherein a first charged body film with charge is formed on top of the first optical film, a second charged body film with charge is formed on top of the second optical film, and the first charged body film and the second charged body film are charged with the same polarity and opposed. | 11-15-2012 |
20130044377 | VARIABLE WAVELENGTH INTERFERENCE FILTER, OPTICAL MODULE, AND OPTICAL ANALYZER - A variable wavelength interference filter includes: a first reflective film disposed on a face of a first substrate facing a second substrate; a second reflective film disposed on a face of the second substrate facing the first substrate and the first reflective film; a first electrode disposed on the face of the first substrate; and a second electrode disposed on the face of the second substrate. The second substrate includes a movable portion on which the second reflective film is disposed and a connection maintaining portion maintaining the movable portion to be movable in a substrate thickness direction, the connection maintaining portion circumscribes the movable portion and is thinner than the movable portion, and the second electrode is disposed on a portion of the second substrate that is thicker than the connection maintaining portion. | 02-21-2013 |
20130083400 | WAVELENGTH VARIABLE INTERFERENCE FILTER, OPTICAL FILTER DEVICE, OPTICAL MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING THE WAVELENGTH VARIABLE INTERFERENCE FILTER - A wavelength variable interference filter includes a fixed substrate including a fixed reflective film, a movable substrate including a movable reflective film, and a bonding section configured to bond the fixed substrate and the movable substrate. The movable substrate includes a movable section, a holding section, and a substrate outer circumferential section. The holding section includes a flat section having a uniform thickness dimension and a curved surface section provided on the outer circumferential side of the flat section, a thickness dimension of the curved surface section increasing toward the substrate outer circumferential section. The bonding section is provided in an outer circumferential region extending along substrate outer circumferential edges on surfaces opposed to each other of the fixed substrate and the movable substrate. The inner circumferential edge of the bonding section is provided further on the inner side than the outer circumferential edge of the curved surface section. | 04-04-2013 |
20130107262 | SPECTROPHOTOMETER | 05-02-2013 |
20130271839 | VARIABLE WAVELENGTH INTERFERENCE FILTER, OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS - A variable wavelength interference filter includes a stationary substrate including a stationary reflecting film and a stationary electrode, and a movable substrate including a movable reflecting film and a movable electrode, the stationary electrode and the movable electrode are disposed outside an optical interference region where the stationary reflecting film and the movable reflecting film overlap each other in a filter plan view, an inner peripheral edge of the stationary electrode is located nearer to the optical interference region than an outer peripheral edge of the movable electrode, and an outer peripheral edge of the stationary electrode is located further from the optical interference region than an outer peripheral edge of the movable electrode. | 10-17-2013 |
20140092479 | WAVELENGTH TUNABLE INTERFERENCE FILTER, OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS - A wavelength tunable interference filter, an optical filter device, an optical module, and an electronic apparatus include a fixed substrate, a movable substrate, a fixed reflective film provided on the fixed substrate, a movable reflective film provided on the movable substrate and facing the fixed reflective film with an inter-reflective film gap interposed therebetween, and an electrostatic actuator that changes the size of the inter-reflective film gap. The movable substrate is curved in a convex shape in a direction away from the fixed substrate in an initial state. The reflective film has reflectance characteristics in which the first reflectance at a predetermined first wavelength in a measurement wavelength range is lower than the second reflectance at a second wavelength longer than the first wavelength. | 04-03-2014 |
20140240837 | VARIABLE-WAVELENGTH INTERFERENCE FILTER, OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS - A variable-wavelength interference filter includes a pair of substrates, a pair of reflection films provided on these substrates, a first electrode, a second electrode, a first conduction electrode provided on the first substrate and provided from the first electrode up to an outer peripheral edge side of the first substrate over the first electrode, a second conduction electrode provided on the second substrate and electrically connected to the first conduction electrode. The first substrate has a first conduction electrode surface facing a contact surface where the first conduction electrode and the second conduction electrode contact each other. The second substrate has a second conduction electrode surface facing the contact surface. A minimum distance from the first conduction electrode surface to the second conduction electrode surface is different from a minimum distance from the first bonding surface to the second bonding surface. | 08-28-2014 |
20150029591 | INTERFERENCE FILTER, OPTICAL FILTER DEVICE, OPTICAL MODULE, ELECTRONIC APPARATUS, MANUFACTURING METHOD OF INTERFERENCE FILTER, AND MEMS ELEMENT - A wavelength variable interference filter includes a fixed substrate, a movable substrate that faces the fixed substrate, a pair of reflective films, a fixed extraction electrode provided on the fixed substrate, and a movable connection electrode that is provided on the movable substrate and is in contact with the fixed extraction electrode at a connection position, in which the movable substrate includes a first groove that is provided at the connection position in a plan view in which the fixed substrate and the movable substrate are viewed from a substrate thickness direction, and a second groove that has a larger area than an area of the first groove in the plan view and is connected to the first groove. | 01-29-2015 |
20150070767 | VARIABLE WAVELENGTH INTERFERENCE FILTER, OPTICAL MODULE, AND OPTICAL ANALYZER - A variable wavelength interference filter includes: a first reflective film disposed on a face of a first substrate facing a second substrate; a second reflective film disposed on a face of the second substrate facing the first substrate and the first reflective film; a first electrode disposed on the face of the first substrate; and a second electrode disposed on the face of the second substrate. The second substrate includes a movable portion on which the second reflective film is disposed and a connection maintaining portion maintaining the movable portion to be movable in a substrate thickness direction, the connection maintaining portion circumscribes the movable portion and is thinner than the movable portion, and the second electrode is disposed on a portion of the second substrate that is thicker than the connection maintaining portion. | 03-12-2015 |
Patent application number | Description | Published |
20090293822 | GENERAL-PURPOSE V-TYPE ENGINE - To a first bank B | 12-03-2009 |
20090301421 | Engine air intake system for engine-powered walk-behind working machine - An engine air intake system for an engine-powered working machine includes a lever cover which covers at least a base portion of an operation control lever mounted on an operation handle for operation by a human operator to control operation of at least one of the working machine and an engine of the working machine, a lower cover disposed inside the lever cover so as to define jointly with the lever cover a hollow space, an air intake portion having an air inlet opening and disposed in the lever cover such that at least the air inlet opening is disposed within the hollow space, and a fresh air guide hose interconnecting the air intake portion and the interior of an air-cleaner case. | 12-10-2009 |
20110155727 | PLASTIC FUEL TANK - A plastic fuel tank is disclosed including polyethylene layers laminated respectively onto an upper surface and a lower surface of an ethylene/vinyl alcohol layer for preventing fuel seepage. The outermost polyethylene layer laminated onto the upper surface is a high-density polyethylene layer colored black so as to minimize transmission of ultraviolet light. | 06-30-2011 |
20110155731 | PLASTIC FUEL TANK - A plastic fuel tank having polyethylene layers is disclosed. The polyethylene layer positioned as the outermost layer of the plastic fuel tank is a high-density polyethylene layer admixed with an ultraviolet inhibitor for minimizing transmission of ultraviolet light. | 06-30-2011 |
20140305107 | AIR-COOLED ENGINE FOR WORKING MACHINE - An air-cooled engine for a working machine includes a fan cover, a muffler protector, and an insulator. The fan cover has a guide opening for guiding a cooling air toward an exhaust muffler. The muffler protector has air discharge holes for discharging the cooling air, which has been introduced through the guide opening into a guide passage, in a direction away from the working machine. The insulator has a deflector section bent toward a carburetor so that the cooling air having passed through another guide passage between the insulator and cylinder barrel is guided by the deflector section in a direction away from the working machine. | 10-16-2014 |
Patent application number | Description | Published |
20130135439 | STEREOSCOPIC IMAGE GENERATING DEVICE AND STEREOSCOPIC IMAGE GENERATING METHOD - A stereoscopic image generating device includes: a correction parameter calculating unit that calculates correction parameters based on a plurality of pairs of feature points corresponding to the same points on the object, from the first image and a second image photographing the object; a correction error calculating unit that, for each pair of feature points, corrects the position of the feature point on at least one image, using the correction parameters, and calculates the amount of correction error; a maldistribution degree calculating unit that finds the degree of maldistribution of feature points; a threshold value determining unit that determines a threshold value such that the threshold value is smaller when the degree of maldistribution increases; and a correction unit that, when the amount of correction error is equal to or lower than the threshold value, corrects the position of the object in the images using the correction parameters. | 05-30-2013 |
20130147918 | STEREO IMAGE GENERATION APPARATUS AND METHOD - There is provided a stereo image generation apparatus which extracts a plurality of sets of feature points from each image of a subject formed in a left-half area and a right-half area captured using a stereo adapter such that feature points in each set correspond to the same one of points on the subject. The apparatus then calculates a set of correction parameters based on the sets of feature points and an evaluation value indicating a degree of likelihood of being correct feature point for a point with respect to a corresponding feature point extracted. For a given feature point of interest extracted from the one of the left-half and right-half areas, the evaluation value is high in a possible shifting area within which image shifting may occur due to distortion caused by the structure of the stereo adapter and the mounting potion error of the stereo adapter. | 06-13-2013 |
20130155055 | DISPLAY DEVICE, DISPLAY METHOD, AND RECORDING MEDIUM - A display device includes a memory and a processor coupled to the memory, wherein the processor executes a process including acquiring user information including a parallax amount, counting the number of users from each piece of the user information and generating a display schedule indicating timing of opening/closing of first and second shutters of each pair of glasses with shutters of each user on the basis of the number of users; adjusting data of a plurality of stereo images, included in image information, each of which includes a pair of a first image and a second image according to a parallax amount of each user included in each piece of the user information, controlling opening/closing of each of the first and second shutters of the each pair of glasses with shutters on the basis of the display schedule, and outputting image information adjusted by the adjustment unit. | 06-20-2013 |
20130155200 | STEREOSCOPIC IMAGE GENERATING DEVICE AND STEREOSCOPIC IMAGE GENERATING METHOD - A stereoscopic image generating device includes: a brightness calculation unit that, on an image that is photographed using a stereo adapter, obtains the brightness representative value of the first area where neither of two beams from the object is incident; a threshold value determining unit that obtains a threshold value based on the brightness representative value; and an object area extracting unit that extracts two sets of pixels having brightness value higher than the threshold value on the image, as a second area where one of the two beams is incident and a third area where the another of the two beams is incident, and produces a stereoscopic image by a pair of a first partial image that is cut out from the second area, and a second partial image that is cut out from the third area. | 06-20-2013 |
20130258461 | 3D DISPLAY DEVICE AND METHOD - A 3D display device that includes: a first optical section of focal distance f1 provided with a group of small lenses arrayed along a specific direction; and a second optical section of focal distance f2 that converges N beams of parallel light that are emitted from the first optical section and hit the individual small lenses by converging so as to offset the N beams from an optical axis. A distance d1 between the first optical section and the second optical section satisfies f2−f1≦d1≦f2 and a viewing distance d2 from the second optical section satisfies d2≈f2. | 10-03-2013 |
20140233100 | IMAGE DISPLAY APPARATUS AND IMAGE DISPLAY METHOD - A display displays a composite image including element pixels. Each element pixel is formed by arranging, in a direction, pixels respectively extracted from images having different viewpoints. A first optical element includes lenses arrayed in the direction to correspond to the element pixels and emits in parallel light rays emitted from pixels respectively included in the element pixels, for a particular image. A second optical element condenses the light rays. An output circuit selects a pixel of the particular image which is included in a particular element pixel and outputs its pixel value to the display. At this time, a pixel more distant from an optical axis of the second optical element along the direction in the particular image is selected as a distance between the first and second optical elements becomes smaller than a focal length of the second optical element. | 08-21-2014 |
20150077523 | STEREO IMAGING APPARATUS AND STEREO IMAGE GENERATING METHOD - A stereo imaging apparatus includes: an imaging unit which generates an image; a stereo adapter which is mounted on the front of the imaging unit, and splits light from a subject into a first light flux and a second light flux along a parallax direction and guides the first and second light fluxes so that the first and second light fluxes are incident side by side on the imaging unit in a direction perpendicular to the parallax direction; and a stereo image generating unit which, based on the image, generates stereo images. The stereo image generating unit includes: a dividing unit which divides the image into two sub-images along the direction perpendicular to the parallax direction; a horizontal direction correcting unit which corrects any rotation of the subject in the two sub-images; and a trapezoidal distortion correcting unit which corrects any trapezoidal distortion of the subject in the two sub-images. | 03-19-2015 |
Patent application number | Description | Published |
20090092469 | SUBSTRATE PROCESSING UNIT, SUBSTRATE TRANSFER METHOD, SUBSTRATE CLEANSING PROCESS UNIT, AND SUBSTRATE PLATING APPARATUS - To provide a substrate processing unit, a substrate transfer method, a substrate cleansing process unit, and a substrate plating apparatus that make it possible for a substrate carry-in mechanism such as a robot arm to quickly release hold on the substrate after carrying in the substrate so as to shorten the time for holding the substrate and improve throughput. The substrate processing unit | 04-09-2009 |
20090291624 | SUBSTRATE POLISHING APPARATUS AND METHOD - A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished. | 11-26-2009 |
20100221432 | SUBSTRATE PROCESSING METHOD AND APPARATUS - A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment. | 09-02-2010 |
20110094442 | SUBSTRATE HOLDING APPARATUS, SUBSTRATE HOLDING METHOD, AND SUBSTRATE PROCESSING APPARATUS - A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section. | 04-28-2011 |
20110203518 | SUBSTRATE PROCESSING METHOD AND APPARATUS - A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment. | 08-25-2011 |
20110237163 | SUBSTRATE POLISHING APPARATUS AND METHOD - A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished. | 09-29-2011 |
20120141246 | SUBSTRATE HOLDING APPARATUS, SUBSTRATE HOLDING METHOD, AND SUBSTRATE PROCESSING APPARATUS - A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section. | 06-07-2012 |