Patent application number | Description | Published |
20100032832 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE - In this semiconductor chip | 02-11-2010 |
20100127382 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a semiconductor carrier with a top surface on which a plurality of electrodes are disposed; and a semiconductor element electrically connected through a plurality of bump electrodes to the plurality of associated electrodes. The plurality of electrodes are substantially uniformly spaced. | 05-27-2010 |
20100181667 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL - While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding use resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding use resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. In the semiconductor chip mounted structure formed in this way, entire side faces at the corner portions of the semiconductor chip are covered with the seal-bonding use resin. As a result, loads generated at corner portions of the semiconductor chip due to board flexures for thermal expansion differences and thermal contraction differences among the individual members caused by heating process and cooling process in mounting operation as well as for mechanical loads after the mounting operation so that internal breakdown of the semiconductor chip can be avoided. | 07-22-2010 |
20100265683 | SEMICONDUCTOR DEVICE - The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip | 10-21-2010 |
20110001233 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND SEMICONDUCTOR DEVICE MOUNTING METHOD - In a semiconductor device mounted structure in which device electrodes of a semiconductor device and board electrodes of a board are connected to each other via bump electrodes, respectively, and in which a sealing-bonding use resin is placed between the semiconductor device and the board, a void portion is placed at a position corresponding to an edge portion of the semiconductor device in the sealing-bonding use resin. Thus, stress loads generated at corner portions of the semiconductor device due to board flexures for differences in thermal expansion and thermal contraction among the individual members caused by heating and cooling steps in mounting process of the semiconductor device, as well as for mechanical loads after the mounting process, can be absorbed by the void portion and thereby reduced, so that breakdown of the semiconductor device mounted structure is prevented. | 01-06-2011 |
20110279996 | SEMICONDUCTOR ASSEMBLY AND MULTILAYER WIRING BOARD - A multilayer wiring board is inhibited from being warped when flip-chip bonding a semiconductor device to the multilayer wiring board, thereby increasing the reliability of connecting the semiconductor assembly to a motherboard. | 11-17-2011 |
20120298310 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING METHOD, AND PRESSING TOOL - While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided. | 11-29-2012 |
20140124911 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor chip; an extension formed at a side surface of the first semiconductor chip; a connection terminal formed on the first semiconductor chip; a re-distribution part formed over the first semiconductor chip and the extension and including an interconnect connected to the connection terminal and an insulating layer covering the interconnect; and an electrode formed above the extension on a surface of the re-distribution part and connected to the interconnect at an opening of the insulating layer. The electrode is mainly made of a material having an elastic modulus higher than that of the interconnect. The electrode includes a bonding region where the electrode is bonded to the interconnect at the opening, and an outer region closer to an end part of the extension. The interconnect is formed so as not to continuously extend to a position right below the outer region. | 05-08-2014 |
20140124957 | EXPANDED SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE - A semiconductor device includes: a first semiconductor chip having a surface provided with first electrodes; and an expanded semiconductor chip including a second semiconductor chip and an expanded portion extending outward from at least one side surface of the second semiconductor chip. The expanded semiconductor chip has a surface provided with second electrodes. The surface of the first semiconductor chip provided with the first electrodes faces the surface of the expanded semiconductor chip provided with the second electrodes so that the first electrodes are connected to the second electrodes. Each one of the second electrodes that is connected to an associated one of the first electrodes is located only on the expanded portion. | 05-08-2014 |