Te-Chung
Te-Chung Chen, New Taipei City TW
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20150104751 | GAS STOVE WITH FLAME DETECTION - A gas stove with flame detection comprises a switch module, a flame detection module and a processing module. The switch module generates an ignition signal when a gas stove flame is lit. The flame detection module generates a first light wave signal when the flame detection module detects light wave having wavelengths of about 400 nm to 500 nm, and the flame detection module generates an second light wave signal when the flame detection module detects light wave having wavelengths of about 600 nm to 780 nm. The processing module turns on an air drafting device and an alarm device when the processing module receives the first light wave signal and the second light wave signal at the same time or only receives the second light wave signal. | 04-16-2015 |
Te-Chung Cho, Taichung City TW
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20150349824 | METHODS AND DEVICES FOR DISPLAYING MULTIPLE SUBSCRIBER IDENTITY MODULE CARD SLOTS INFORMATION - A method for displaying SIM card slot information for use in a device including M SIM card slots, each of which may have a SIM card inserted therein or no SIM card inserted therein. The method includes the following steps. A set of predetermined rules are first determined by the device. Statuses of the M SIM card slots corresponding to the set of predetermined rules are then acquired. Information regarding N of the M SIM card slots are displayed on a display unit of the device according to the set of predetermined rules determined by the current associated network and the acquired statuses of the M SIM card slots, where N | 12-03-2015 |
Te-Chung Hung, Changhua TW
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20140143945 | MOBILE TOILET STRUCTURE - An improved mobile toilet structure may include a base, four side bars, four sleeve tubes, four panels and a lid. The base has four threaded holes at four corners of the upper side of the base, and a vertical exhaust pipe at one side of the rear portion of the base. The side bar has a first threaded portion on its upper end and a second threaded portion on its lower end. The sleeve tube has an opening on one side and the two margins of the opening extend outwards and form two wing-like structures. Among the four panels, the front one has a board installed in the panel that can be opened and closed, whereas all others may have transom windows opened at their upper portions. The lid is integrally molded, with its size and shape determined by the base. | 05-29-2014 |
Te-Chung Liu, Taoyuan Shien TW
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20120299525 | VENTILATION APPARATUS WITH FEEDBACK COMPENSATION CONTROL AND METHOD FOR OPERATING THE SAME - A ventilation apparatus with a two-section feedback compensation control and a method for operating the same are disclosed. The ventilation apparatus includes a power conversion trait ( | 11-29-2012 |
Te-Chung Liu US
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20110138908 | HUMIDITY SENSING CIRCUIT WITH TEMPERATURE COMPENSATION - A humidity sensing circuit with temperature compensation includes a wave producing module, a phase processing module, a sensing module and a detecting module. The wave producing module outputs a wave signal. The phase processing module outputs an oscillatory wave and an invert oscillatory wave according to the wave signal. The sensing module has a temperature sensor and a humidity sensor which are connected in series. The temperature sensor and the humidity sensor respectively receive the oscillatory wave and the invert oscillatory wave. The sensing module outputs a parameter signal according to the oscillatory wave and the invert oscillatory wave. The detecting module outputs a detection signal according to the parameter signal. Hence, the humidity sensing circuit with temperature compensation senses the temperature and humidity by the simple circuit design. Moreover, it is feasible for circuit design and application. | 06-16-2011 |
Te-Chung Wang, Shenzhen City TW
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20140180484 | FAN NOISE AND VIBRATION ELIMINATION SYSTEM - A fan noise and vibration elimination system includes a sound wave sensor, a vibration sensor, a computing controller, a sound wave generator and a vibration generator. The sound wave sensor and the vibration sensor respectively receive noise and vibration produced by a fan during operation thereof to generate corresponding sound wave detection signal and vibration detection signal to the computing controller. Based on the received sound wave detection signal and vibration detection signal, the computing controller generates a sound wave cancel-out signal and a vibration cancel-out signal to the sound wave generator and the vibration generator, respectively, for the latter to generate a phase-inverted sound wave and a reverse vibration frequency to cancel the noise and the vibration produced by the operating fan. | 06-26-2014 |
Te-Chung Wang, Hsinchu Cty TW
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20120241752 | LOW CONTACT RESISTANCE SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME - A low contact resistance semiconductor structure includes a substrate, a semiconductor stacked layer, a low contact resistance layer and a transparent conductive layer. The low contact resistance layer is formed on one side of a P-type GaN layer of the semiconductor stacked layer. The low contact resistance layer is formed at a thickness smaller than 100 Angstroms and made of a material selected from the group consisting of aluminum, gallium, indium, and combinations thereof. Through the low contact resistance layer, the resistance between the P-type GaN layer and transparent conductive layer can be reduced and light emission efficiency can be improved when being used on LEDs. The method of fabricating the low contact resistance semiconductor structure of the invention forms a thin and consistent low contact resistance layer through a Metal Organic Chemical Vapor Deposition (MOCVD) method to enhance matching degree among various layers. | 09-27-2012 |
Te-Chung Wang, Taichung City TW
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20150115309 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure includes a substrate, an N-type semiconductor layer, a light emitting layer, a P-type semiconductor layer, a composite conductive layer, a first electrode, and a second electrode. The N-type semiconductor layer is located on the substrate. The light emitting layer is located on a portion of the N-type semiconductor layer. The P-type semiconductor layer is located on the light emitting layer. The composite conductive layer sequentially has a first conductive layer, a second conductive layer, and a third conductive layer. The first conductive layer is attached to the P-type semiconductor layer, and the resistance of the first conductive layer is greater than the resistance of the third conductive layer. The first electrode is located on the third conductive layer. The second electrode is located on another portion of the N-type semiconductor layer that is not covered by the light emitting layer. | 04-30-2015 |
20150188009 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present disclosure provides a method of manufacturing a semiconductor device, including providing a semiconductor structure including a sequential stack of an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. A first metal layer and a second metal layer on the first metal layer are formed on the semiconductor structure. A heat treatment process is performed, such that the first metal layer is oxidized to form a first metal oxide layer and the second metal layer is reversed to form a second metallic compound layer between the first metal oxide layer and the p-type semiconductor layer. The first metal oxide layer and the second metallic compound layer are removed. A mesa etching process is performed after performing the heat treatment process, to form a mesa region exposing a part of the n-type semiconductor layer. | 07-02-2015 |
20150255681 | LIGHT-EMITTING DIODE CHIP - A light-emitting diode (LED) chip is disclosed. The chip includes a light-emitting diode and an electrode layer on the light-emitting diode. The electrode layer includes a reflective metal layer. The reflective metal layer includes a first composition and a second composition. The first composition includes aluminum or silver, and the second composition includes copper, silicon, tin, platinum, gold or a combination thereof. The weight percentage of the second composition is greater than 0% and less than 20%. | 09-10-2015 |
Te-Chung Wang, Hsinchu TW
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20110210343 | SEMICONDUCTOR WAFER - A semiconductor wafer includes a substrate, a first separating structure and a semiconductor stacked layer structure. The substrate has a first surface. The first separating structure is formed on the first surface to divide the first surface into a plurality of independent regions. The minimum area of each of the regions is more than or equal to one square inch. The semiconductor stacked layer structure is disposed on the first surface and the first separating structure. The semiconductor wafer can prevent bowing of the semiconductor wafer during an epitaxial growth process so as to enhance quality of the semiconductor wafer. | 09-01-2011 |