Tatsuyama
Atsushi Tatsuyama, Okayama JP
Patent application number | Description | Published |
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20100269721 | LETTERPRESS PRINTING ORIGINAL PLATE FOR LASER ENGRAVING AND A LETTERPRESS PRINTING PLATE OBTAINED THEREFROM - To provide a photosensitive resin composition which is a material for a printing original plate for laser engraving which generates no printing deficiencies and from which a printing plate with a satisfactory resolution can be produced. A printing original plate for laser engraving where image is formed by irradiation of laser beam to form a printing plate, characterized in that the photosensitive resin composition layer consists of a photosensitive resin composition in which soluble polyamide or soluble polyether urethane urea, ethylenic unsaturated monomer and photopolymerization initiator are essential ingredients and the amount of (meth)acryloyl group in the photosensitive resin composition is 0.25 to 0.40 mol per 100 g of the photosensitive resin composition. | 10-28-2010 |
Koichi Tatsuyama, Chiyoda-Ku JP
Patent application number | Description | Published |
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20140029217 | ELECTRONIC DEVICE - An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic component mounted on the printed circuit board, a heat dissipation fin provided on the electronic component, and a fixing unit that is made of a conductive material and fixes the heat dissipation fin by pressing the fin against the printed circuit board side, wherein a notch is formed in two sides of the printed circuit board that face each other with the electronic component therebetween, and the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to the notch and is such that hook portions locked to the notch are arranged in the prohibited region. | 01-30-2014 |
Koichi Tatsuyama, Tokyo JP
Patent application number | Description | Published |
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20150216074 | HEAT DISSIPATION PLATE - A heat dissipation plate includes: a substantially rectangular heat transfer surface that comes in contact with an electronic component; a plurality of side walls that are provided respectively in four directions of the heat transfer surface; and a heat-dissipation base surface that is connected to the heat transfer surface via the side walls. The heat generated by the electronic component is received by the heat transfer surface, is transmitted from the heat transfer surface to the heat-dissipation base surface via the side walls, and is dissipated from the heat-dissipation base surface. A plurality of vents are provided on at least one of the side walls. | 07-30-2015 |