Patent application number | Description | Published |
20090132820 | Content data management system and method - Embodiments of the present invention provide a simplified authentication transaction for reconnecting a storage device to a host apparatus that has completed authentication in the past. According to one embodiment, an authentication log is recorded in the host. Plural units of this log information are recorded in the storage device. At the time of transferring a content decryption key and usage rules between the host and the storage device, the decryption key and usage rules are recorded into the host as a log for the transfer. The used authentication log is recorded into the storage device as RAPDI. If RAPDI indicates the authentication log in the simplified authentication transaction, recovery transaction is permitted. The host device deletes/invalidates or holds the log for the transfer in accordance with non-permission/permission. In the case of permission, the key and usage rules are recovered by using a log for the transfer prior to the simplified authentication transaction. | 05-21-2009 |
20090327718 | Content data mangement system and method - Embodiments of the present invention allow encrypted data to restrict unlimited output of content data recorded in an area where reading can be performed by standard commands. According to one embodiment, a data storage area of a storage device is provided with an accessible area which can be accessed from the outside of an interface by specifying an address, and a hidden access area which can be accessed from the outside only in a specified case where an authentication condition is satisfied. In the hidden area, a table is recorded in which one entry includes an entry number and a field of a content identifier. An expansion area is provided in each sector of the accessible area, and data output control information and an entry number are recorded. The data output control information indicates information of one of (1) output is allowed only when there is information capable of decrypting the data, and (2) output is allowed without limitation. In the case where data recorded in the accessible area is read by a standard read command, output of content data recorded in the storage device is controlled based on the data output control information recorded in the expansion area. | 12-31-2009 |
20100111299 | DATA TRANSFER SYSTEM, DATA TRANSFER METHOD, DATA TRANSMISSION DEVICE AND DATA RECEIVING DEVICE - A data transfer system. The data transfer system includes a first device and a second device. The first device is configured to encrypt a partial information group of the plurality of information groups and to transfer an encrypted information group to the second device, to generate an omission information group with information having a predetermined relation omitted from at least remaining information groups of the plurality of information groups, to encrypt and to transfer the omission information group to the second device, when a partial kind of information of the plurality of information groups has the predetermined relation. The second device is configured to decrypt the partial information group and the omission information group, to restore omitted information based on the omitted information having the predetermined relation included in a transferred partial information group, and to add the restored information to the transferred omission information group. | 05-06-2010 |
20100330742 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A first conductive member made of metal is provided over a first wiring substrate, which is a mounting substrate in the lower tier, a through hole is provided in a second wiring substrate, which is a mounting substrate in the upper tier, at a position corresponding to the first conductive member in a plan view, and a wiring is exposed at the sidewall of the through hole. The first conductive member is inserted into the through hole on the corresponding first wiring substrate side and the first wiring substrate and the second wiring substrate are electrically coupled by filling the through hole with a second conductive member. an electrode pad that is electrically coupled to the second conductive member and over which a semiconductor member in the upper tier is mounted is formed on the main surface side of the second wiring substrate. | 12-30-2010 |
20110076800 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes. | 03-31-2011 |
20110089563 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step. | 04-21-2011 |
20110107108 | CONTENT RECORDER/PLAYER AND CONTENT WRITING AND READING METHOD - A content recorder/player. The content recorder/player includes a first data-storage medium including a first data-storage area, a second data-storage medium including a second data-storage area, and a control section. The control section is configured: to encrypt information groups having a predetermined relationship for writing into the first data-storage area; to generate and to encrypt an individual information group from which the information having the predetermined relationship is omitted, and to perform writing thereof into the second data-storage area; to read and to decrypt the individual information group, and to read and to decrypt an information group recorded on a first recording-destination location; and to restore, from an information group read from the second data-storage area, and from an information group read from the first data-storage area, an information group correlated with the content data based on the predetermined relationship, and to transmit the restored information group to an external device. | 05-05-2011 |
20130059417 | METHOD FOR MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE - Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step. | 03-07-2013 |
20140073068 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is a semiconductor device having improved reliability. In the semiconductor device in an embodiment, a mark is provided correspondingly to the bonding area of a belt-like wiring exposed from an opening provided in a solder resist. As a result, in an alignment step for the wire bonding area, the coordinate position of the wire bonding area can be adjusted using not the end portion of the opening formed in the solder resist, but the mark formed correspondingly to the wire bonding area as a reference. Also, in the semiconductor device in the embodiment, the mark serving as a characteristic pattern is formed. This allows the wire bonding area to be adjusted based on camera recognition. | 03-13-2014 |