| Patent application number | Description | Published |
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| 20110118735 | Electrosurgical device for creating a channel through a region of tissue and methods of use thereof - An electrosurgical device and methods are disclosed for creating a channel through a region of tissue. The device comprises an elongate member for receiving the energy from an electrical energy source. An electrical insulation layer surrounds the elongate member along the device proximal region. An electrode tip is coupled to the distal end of the elongate member for delivering the energy, the electrode tip being configured and sized for delivering the energy in a manner such that electrical arcing is generated in the region of tissue in order to create a channel through at least a portion of the region of tissue. An electrically insulative thermal shield is disposed between the electrode tip and the device proximal region for preventing arcing therebetween during the delivery of the energy and for thermally protecting the device proximal region from heat produced by the delivery of the energy through the electrode tip. | 05-19-2011 |
| 20120046657 | Stent Graft Fenestration - A method for creating a channel through a foreign material located in a body of a patient, the foreign material defining a material first surface and a substantially opposed material second surface, the channel extending through the foreign material between the material first and second surfaces, the method using an apparatus including an electrode, the method comprising: positioning the electrode substantially adjacent to the material first surface; energizing the electrode with a radiofrequency current; and using the electrode energized with the radiofrequency current to deliver energy into the foreign material to create the channel, wherein the foreign material is included in a stent graft. | 02-23-2012 |
| 20120215213 | Monitoring and controlling energy delivery of an electrosurgical device - A method is disclosed for delivering energy to a region of tissue within a patient's body using a medical treatment system. The medical treatment system comprises an energy delivery device coupled to an energy source. Energy is delivered through the energy delivery device positioned within the patient's body. An energy delivery parameter associated with the delivery of energy by the medical treatment system is monitored and if one or more values of the energy delivery parameter exceed a predetermined magnitude threshold, one or more errors are detected. The extent of the detected errors is determined or assessed and the delivery of energy is controlled if the extent of the errors detected exceeds a sensitivity threshold before the expiry of a predetermined time period. | 08-23-2012 |
| Patent application number | Description | Published |
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| 20090015266 | RESONATOR, PRINTED BOARD, AND METHOD FOR MEASURING COMPLEX DIELECTRIC CONSTANT - A plurality of through-hole vias connected to conductor layers is disposed with gaps left between these vias around opening parts disposed in the conductor layers in a printed board in which these conductor layers are disposed parallel to each other so as to sandwich a dielectric layer in between. Furthermore, through-hole vias used for excitation are disposed in the opening parts of the conductor layers and regions of the dielectric layer matching these opening parts in a non-contact manner with the conductor layers. When the complex dielectric constant is measured, a high-frequency power is applied to the through-hole vias, and the power loss between the through-hole vias and the conductor layers is measured by the S parameter method. As a result, the complex dielectric constant and the frequency dependency of this complex dielectric constant can be measured with a high precision in a frequency range extending from several gigahertzes to 20 GHz, and there is no electrical interference with other parts even when this resonator is mounted on a board. | 01-15-2009 |
| 20090015345 | BROADBAND TRANSITION FROM A VIA INTERCONNECTION TO A PLANAR TRANSMISSION LINE IN A MULTILAYER SUBSTRATE - According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; The length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations. | 01-15-2009 |
| 20090091406 | COMPACT VIA TRANSMISSION LINE FOR PRINTED CIRCUIT BOARD AND DESIGN METHOD OF THE SAME - A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band. | 04-09-2009 |
| 20090133913 | VERTICAL TRANSITIONS, PRINTED CIRCUIT BOARDS THEREWITH AND SEMICONDUCTOR PACKAGES WITH THE PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR CHIP - Provided are vertical transitions which have the high electrical performance and the high shielding properties in the wide frequency band in a multilayer PCB, printed circuit boards with the vertical transitions and semiconductor packages with the printed circuit boards and semiconductor chips. In vertical transitions for a multilayer PCB, a wave guiding channel is a conductor which includes at least more than one of signal vias | 05-28-2009 |
| 20100052821 | COMPACT FILTERING STRUCTURE - An electromagnetic band gap (EGB) structure includes a substrate made of an isolating material. A plurality of identical planar transmission line segments are formed one under another in conductor layers embedded in the substrate. Vertical transitions connect one by one the plurality of planar transmission line segments. Adjacent ones of the vertical transitions are equally spaced on a predetermined distance in a direction parallel to the transmission line segments, thereby the vertical transitions serve as periodical inclusions forming the EBG structure. | 03-04-2010 |
| 20100321135 | DIFFERENTIAL-COMMON MODE RESONANT FILTERS - A filter is provided with a multilayer board incorporating a resonator formed by two ground plates opposed to each other and conductive side walls connected to the ground plates; two signal vias provided through the resonator; and two terminals connected to the signal vias to receive a pair of signals. The resonator has a first face of symmetry vertical to the ground plates. The signal vias are disposed symmetrically with respect to the first face of symmetry on a distance from the first face of symmetry. | 12-23-2010 |
| 20110203843 | MULTILAYER SUBSTRATE - To provide more compact dimensions of a via structure formed by signal via pairs and ground vias in multilayer substrate. A multilayer substrate is provided such that the multilayer substrate comprising a high-isolated via cell wherein the high-isolated via cell comprises: two signal via pairs; a shield structure around two signal via pairs consisting of ground vias and ground strips connected to ground vias wherein the shield structure is formed symmetrically in respect to two via pairs to reduce the transformation between mixed modes and also leakage from two signal via pairs; a clearance hole separating signal via pairs from other conductive parts of the multilayer substrate and having predetermined dimensions to provide broadband operation of the high-isolated via cell; and the separating strip disposed symmetrically between said signal via pairs to provide crosstalk reduction between two signal via pairs and common mode decrease. | 08-25-2011 |
| 20110248800 | FILTER BASED ON A COMBINED VIA STRUCTURE - A filter is provided with a planar transmission line and a combined via structure connected to (both) one ends of the planar transmission line. The planar transmission line and the combined via structure are disposed in a same multilayer board. The combined via structure comprises two working parts. The first working part comprises a segment of signal via and a plurality of segments of ground vias surrounding the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias, smooth conductive plate and corrugated conductive plate. The smooth conductive plate and the corrugated conductive plate are connected to the signal via. The second working part comprises a segment of the same signal via, a plurality of segments of the same ground vias and corrugated conductive plate. The corrugated conductive plate is connected to the signal via. | 10-13-2011 |
| 20110279195 | BROADBAND TRANSITION FROM A VIA INTERCONNECTION TO A PLANAR TRANSMISSION LINE IN A MULTILAYER SUBSTRATE - According to one embodiment, a broadband transition to joint a via structure and a planar transmission line in a multilayer substrate is formed as an intermediate connection between the signal via pad and the planar transmission line disposed at the same conductor layer. The transverse dimensions of the transition are equal to the via pad diameter at the one end and strip width at another end; the length of the transition can be equal to the characteristic dimensions of the clearance hole in the direction of the planar transmission line or defined as providing the minimal excess inductive reactance in time-domain according to numerical diagrams obtained by three-dimensional full-wave simulations. | 11-17-2011 |
| 20120119853 | RESONANT ELEMENTS DESIGNED VERTICALLY IN A MULTILAYER BOARD AND FILTERS BASED ON THESE ELEMENTS - A resonant element is provided with a multilayer board, comprising a plurality of conductor layers isolated by a dielectric, a signal via conductor, penetrating through the multilayer board, and a plurality of ground vias, penetrating thought the multilayer board and disposed around the signal via conductor. The multilayer board comprises a first conductor layer, a second conductor layer, and a corrugated conductor layer disposed between the first and the second conductor layers. The corrugated conductor layer comprises a corrugated signal plate, connected to the signal via conductor, and a corrugated ground plate, connected to the plurality of ground vias, isolated from the corrugated signal plate by the dielectric. | 05-17-2012 |
