Patent application number | Description | Published |
20100232348 | Method and Apparatus for Sending, Forwarding, and Processing Data - A method for sending data includes obtaining data packets to be sent and modulating, by each transmit diversity branch, the data packets by using modulation mode corresponding to the each transmit diversity branch, and sending the modulated data packets. The modulation modes form a preset optimized combination of modulation modes. A different modulation mode corresponds to a different group of modulation factors and/or different group of constellation modulation symbols. The different groups of modulation factors comply with a preset modulation factor mapping relationship. The different groups of constellation modulation symbols comply with a preset constellation modulation symbol mapping relationship. | 09-16-2010 |
20100331007 | METHOD AND APPARATUS FOR SUPPRESSING INTER-CELL INTERFERENCE - The present invention discloses a method and an apparatus for suppressing inter-cell interference. The method includes: obtaining edge channels whose signal interference ratio (SIR) is above a preset threshold from edge channel group to constitute a first candidate channel set; selecting an edge channel of the lowest correlation as a tier-1 channel; obtaining central channels whose SIR are above a preset threshold from central channel group to constitute a second candidate channel set; selecting a central channel of the lowest correlation as a tier-2 channel; and comparing SIRs of the tier-1 channel and the tier-2 channel and assigning the channel of a higher SIR to an edge terminal in the local cell. The present invention may suppress inter-cell interference and reduce the waste of channel resources. | 12-30-2010 |
20120114063 | METHOD, APPARATUS AND SYSTEM FOR ELIMINATING ALIASING NOISE IN MULTI-CARRIER MODULATION SYSTEM - A method, an apparatus and a system for eliminating aliasing noise in a multi-carrier modulation system are disclosed. The method includes: acquiring a first power spectrum density template; acquiring information of in-band subcarriers whose aliasing noise is greater than background noise, and acquiring a difference between the aliasing noise and the background noise of the in-band subcarriers; adjusting the first power spectrum density template according to the information of the in-band subcarriers and the corresponding difference to obtain a second power spectrum density template; and sending signals according to the second power spectrum density template. The method, the apparatus, and the system disclosed herein eliminate the aliasing crosstalk noise, improve the performance and stability of in-band services without involving upgrade or modification of the Customer Premises Equipment (CPE), and are easy to implement. | 05-10-2012 |
20120327846 | NETWORK CODING-BASED DATA PROCESSING METHOD AND SYSTEM - The present disclosure provides a network coding-based data processing method and system. The method includes: receiving modulated data packets, the modulated data packets including: a first data packet modulated by using a first constellation map, a second data packet modulated by using a second constellation map, and a third data packet modulated by using a third constellation map; where the first constellation map, the second constellation map, and the third constellation map are capable of minimizing the bit error rate of received signals, and a bit stream transmitted in the third data packet is an Exclusive-OR result of a bit stream transmitted in the first data packet and a bit stream transmitted in the second data packet, that is, c=a⊕b; and obtaining original transmitted data from the received data packets. | 12-27-2012 |
20130102305 | WIRELESS ACCESS METHOD, DEVICE, AND SYSTEM - Embodiments of the present invention disclose a wireless access method, device, and system. The method includes: sending pilot signal strength or channel characteristics to a central processing node, where the pilot signal strength or channel characteristics are fed back by a user terminal within the coverage area of a wireless access node and are between the wireless access node and the corresponding user terminal; receiving access indication information of the user terminal, which is fed back by the central processing node and is determined according to the pilot signal strength or channel characteristics, where the access indication information of the user terminal includes an identifier of the wireless access node connected with the user terminal and a corresponding coding and modulation scheme; and sending the identifier of the wireless access node connected with the user terminal and the corresponding coding and modulation scheme to the corresponding user terminal. | 04-25-2013 |
20130198523 | METHOD AND APPARATUS FOR CHECKING FIELD REPLACEABLE UNIT, AND COMMUNICATION DEVICE - The present application provides a method and an apparatus for checking a field replaceable unit, and a communication device. The method for checking the field replaceable unit includes: obtaining key identifier information saved in a security memory module; and determining trustworthiness of the field replaceable unit according to the key identifier information saved in the security memory module and key identifier information directly obtained from the field replaceable unit. The present application may implement trustworthiness checking of the field replaceable unit, the implementation is simple, and the cost is low. | 08-01-2013 |
20150249488 | ARRAY ANTENNA, METHOD AND DEVICE FOR TRANSMITTING AND RECEIVING SIGNAL - The present application discloses an array antenna, a method and a device for transmitting and receiving a signal. The array antenna includes at least two active antennas, wherein each active antenna is surrounded by at least two different parasitic antennas, respective parasitic antennas are respectively coupled to controllable loads, and the controllable loads are respectively coupled to a control circuit. With the arrangement of at least two active antennas, when a channel is in a good state, channel capacity can be adjusted by adjusting the controllable loads coupled to the parasitic antennas; and when the channel is not in the good state, the bit error ratio can be reduced by both adjusting the controllable loads coupled to the parasitic antennas and adjusting transmitting directional diagrams of the active antennas according to an adjustment vector, meanwhile, miniaturization can also be realized. | 09-03-2015 |
20150288076 | SINGLE RADIO FREQUENCY DOUBLE-STREAM TRANSMISSION APPARATUS, USE METHOD AND ANTENNA SYSTEM - Embodiments of the present disclosure provide a single radio frequency double-stream transmission apparatus, wherein the apparatus includes: a radio frequency link, a reactance control circuit, a parasitic reactor, an active antenna and an even number M of parasitic antennas, wherein M is larger than 2; the radio frequency link is configured to generate a radio frequency signal; the active antenna is connected with the radio frequency link, the parasitic antennas are respectively connected with the parasitic reactor, the distances from the parasitic antennas to the active antenna are the same, and the radian between adjacent parasitic antennas is | 10-08-2015 |
Patent application number | Description | Published |
20090321932 | Coreless substrate package with symmetric external dielectric layers - A thin die Package Substrate is described that may be produced using existing chemistry. In one example, a package substrate is built over a support material. A dry film photoresist layer is formed over the package substrate. The support material is removed from the package substrate. The dry film photoresist layer is removed from the substrate and the substrate is finished for use with a package. | 12-31-2009 |
20110147933 | MULTIPLE SURFACE FINISHES FOR MICROELECTRONIC PACKAGE SUBSTRATES - Multiple surface finishes are applied to a substrate for a microelectronics package by applying a first surface finish to connection pads of a first area of the substrate masking the first area of the substrate without masking a second area of the substrate, applying a second different surface finish to connection pads of the second area of the substrate, and removing the mask. | 06-23-2011 |
20120074209 | ELECTROLYTIC DEPOSITON AND VIA FILLING IN CORELESS SUBSTRATE PROCESSING - Electronic assemblies including coreless substrates and their manufacture using electrolytic plating, are described. One method includes providing a core comprising a metal, and forming a dielectric material on the core. The method also includes forming vias in the dielectric material, the vias positioned to expose metal regions. The method also performing an electrolytic plating of metal into the vias and on the metal regions, wherein the core is electrically coupled to a power supply during the electrolytic plating of metal into the vias and delivers current to the metal regions. The method also includes removing the metal core after the electrolytic plating of metal into the vias. Other embodiments are described and claimed. | 03-29-2012 |
20120077054 | ELECTROLYTIC GOLD OR GOLD PALLADIUM SURFACE FINISH APPLICATION IN CORELESS SUBSTRATE PROCESSING - Electronic assemblies including coreless substrates having a surface finish, and their manufacture, are described. One method includes electrolytically plating a first copper layer on a metal core in an opening in a patterned photoresist layer. A gold layer is electrolytically plated on the first copper layer in the opening. An electrolytically plated palladium layer is formed on the gold layer. A second copper layer is electrolytically plated on the palladium layer. After the electrolytically plating the second copper layer, the metal core and the first copper layer are removed, wherein a coreless substrate remains. Other embodiments are described and claimed. | 03-29-2012 |
20120161330 | DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DEFINED PADS - Package substrates enabling reduced bump pitches and package assemblies thereof. Surface-level metal features are embedded in a surface-level dielectric layer with surface finish protruding from a top surface of the surface-level dielectric for assembly, without solder resist, to an IC chip having soldered connection points. Package substrates are fabricated to enable multiple levels of trace routing with each trace routing level capable of reduced minimum trace width and spacing. | 06-28-2012 |
20130285242 | PIN GRID INTERPOSER - An interposer to form a frame around a bottom chip bonded to a package substrate and to standoff a top chip or package for clearance of the bottom chip. The interposer has pins arrayed on a first side which are soldered to the package substrate for reduced interposer z-height and pads arrayed on a second side to which the top package (chip) is bonded. During assembly, the interposer pins may be pressed against pre-soldered pads and the solder reflowed to join the interposer to the package substrate. A top package (chip) is then joined to an opposite side of the interposer to integrate the first and second chips. | 10-31-2013 |
20130320547 | ENABLING PACKAGE-ON-PACKAGE (POP) PAD SURFACE FINISHES ON BUMPLESS BUILD-UP LAYER (BBUL) PACKAGE - A bumpless build-up layer (BBUL) integrated circuit package and method of manufacturing are presented. In some embodiments, the package-on-package (PoP) pads of the BBUL integrated circuit package has a surface finish that can be palladium, nickel-palladium, nickel-gold, nickel-palladium-gold, or palladium-nickel-palladium-gold. In some embodiments, the PoP pad surface finish can be formed using either an electroless or electrolytic process. | 12-05-2013 |
20140004361 | SUBSTRATE CORES FOR LASER THROUGH HOLE FORMATION | 01-02-2014 |
20140061927 | CHIP PACKAGE INCORPORATING INTERFACIAL ADHESION THROUGH CONDUCTOR SPUTTERING - This disclosure relates generally to an electronic device and method having can include a method of making a chip package. An insulator layer comprising an insulator material, the insulator layer positioned with respect to a first conductive line, forming a second conductive line with respect to the insulator layer, wherein the insulator layer is positioned between the first conductive line and the second conductive line, forming a opening in the insulator layer between the first conductive line and the second conductive line, at least some of the insulator material within the opening being exposed, and chemically bonding a conductor to the at least some of the insulator material within the opening, wherein the conductor electrically couples the first conductive line to the second conductive line. | 03-06-2014 |
20140151875 | CROSSTALK POLARITY REVERSAL AND CANCELLATION THROUGH SUBSTRATE MATERIAL TUNING - Transmission lines with a first dielectric material separating signal traces and a second dielectric material separating the signal traces from a ground plane. In embodiments, mutual capacitance is tuned relative to self-capacitance to reverse polarity of far end crosstalk between a victim and aggressor channel relative to that induced by other interconnect portions along the length of the channels, such as inductively coupled portions. In embodiments, a transmission line for a single-ended channel includes a material of a higher dielectric constant within the same routing plane as a microstrip or stripline conductor, and a material of a lower dielectric constant between the conductor and the ground plane(s). In embodiments, a transmission line for a differential pair includes a material of a lower dielectric constant within the same routing plane as a microstrip or stripline conductors, and a material of a higher dielectric constant between the conductors and the ground plane(s). | 06-05-2014 |
20140160707 | NON-UNIFORM SUBSTRATE STACKUP - Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described. | 06-12-2014 |
20140174808 | REDUCED CAPACITANCE LAND PAD - A land grid array (LGA) land pad having reduced capacitance is disclosed. The conductive portion of a land pad that overlaps a parallel ground plane within the substrate is reduced by one or more non-conductive voids though the thickness of the conductive portion of the land pad. The voids may allow the contact area of the land pad, as defined by the perimeter of the land pad, to remain the same while reducing the conductive portion that overlaps the parallel ground plane. Capacitance between the land pad and the parallel ground plane is reduced by an amount proportional to the reduction in overlapping conductive area. | 06-26-2014 |
20150021778 | CHIP PACKAGE INCORPORATING INTERFACIAL ADHESION THROUGH CONDUCTOR SPUTTERING - This disclosure relates generally to an electronic device and method having can include a method of making a chip package. An insulator layer comprising an insulator material, the insulator layer positioned with respect to a first conductive line, forming a second conductive line with respect to the insulator layer, wherein the insulator layer is positioned between the first conductive line and the second conductive line, forming a opening in the insulator layer between the first conductive line and the second conductive line, at least some of the insulator material within the opening being exposed, and chemically bonding a conductor to the at least some of the insulator material within the opening, wherein the conductor electrically couples the first conductive line to the second conductive line. | 01-22-2015 |
20150318238 | DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DEFINED PADS - Package substrates enabling reduced bump pitches and package assemblies thereof. Surface-level metal features are embedded in a surface-level dielectric layer with surface finish protruding from a top surface of the surface-level dielectric for assembly, without solder resist, to an IC chip having soldered connection points. Package substrates are fabricated to enable multiple levels of trace routing with each trace routing level capable of reduced minimum trace width and spacing. | 11-05-2015 |
20160056102 | DUAL SIDE SOLDER RESIST LAYERS FOR CORELESS PACKAGES AND PACKAGES WITH AN EMBEDDED INTERCONNECT BRIDGE AND THEIR METHODS OF FABRICATION - A coreless package substrate with dual side solder resist layers is disclosed. The coreless package substrate has a top side and a bottom side opposite of the top side and includes a single build-up structure formed of at least one insulating layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a bottom plurality of contact pads on the bottom side, and a top plurality of contact pads on the top side. A bottom solder resist layer is on the bottom side, and a top solder resist layer is on the top side. The concept of dual side solder resist is extended to packages with interconnect bridge with C4 interconnection pitch over a wide range. | 02-25-2016 |
20160104632 | NON-UNIFORM SUBSTRATE STACKUP - Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described. | 04-14-2016 |
Patent application number | Description | Published |
20110160986 | METHOD AND APPARATUS FOR TRAFFIC INFORMATION CONVERSION USING TRAFFIC INFORMATION ELEMENT KNOWLEDGE BASE - A method and apparatus for conversion of traffic information based on traffic information element knowledge base are provided. According to the present invention, a road network is described using roads, intersections and sections as traffic information elements and a correspondence between these elements and a road topological network in a digital map is established, so that a universal traffic information describing model, which is compatible with language used in people's daily life, can be established. Further, a traffic information element knowledge base can be generated based on the roads, intersections and sections, their respective attributes and the relationship between them, to support inter-conversion between road topological network traffic information and text-based traffic information. With the universal traffic information describing model and the traffic information element knowledge base according to the present invention, it is possible to support fusion and conversion for traffic data from various sources and to support various forms of presentation and interaction for traffic information, such as presentation of traffic information on digital navigation map, textual description of traffic information, map presentation of traffic information for urban trunk roads, interaction for natural language queries of traffic information, etc. | 06-30-2011 |
20110160987 | METHOD AND APPARATUS FOR PROCESSING TRAFFIC INFORMATION BASED ON INTERSECTIONS AND SECTIONS - A method and apparatus for representing a road network and a method and system for processing traffic information data using the method for representing a road network are provided. The method for processing traffic information data comprises: conversion step of converting traffic information data based on road networks of one or more types of road maps into traffic information data of intersections and sections, based on correspondence between the road networks of one or more types of road maps and the road network represented by the intersections and the sections, wherein the road network represented by the intersections and the sections is obtained by the method for representing a road network; and fusion step of fusing the converted traffic information data of intersections and sections to obtain unified traffic information data. The present invention proposes using a road network represented by intersections and sections as an intermediate model, which emphasizes the importance of intersections as hub nodes of the road network, and is compatible with various forms of map representations and universal. In this way, more accurate and comprehensive information can be obtained by fusing traffic information data from different data sources, which is advantageous for services such as traffic information prediction. | 06-30-2011 |
20110161261 | METHOD AND SYSTEM FOR TRAFFIC PREDICTION BASED ON SPACE-TIME RELATION - A system and method for traffic prediction based on space-time relation are disclosed. The system comprises a section spatial influence determining section for determining, for each of a plurality of sections to be predicted, spatial influences on the section by its neighboring sections; a traffic prediction model establishment section for establishing, for each of the plurality of sections to be predicted, a traffic prediction model by using the determined spatial influences and historical traffic data of the plurality of sections; and a traffic prediction section for predicting traffic of each of the plurality of sections to be predicted for a future time period by using real-time traffic data and the traffic prediction model. An apparatus and method for determining spatial influences among sections, as well as an apparatus and method for traffic prediction, are also disclosed. With the present invention, a spatial influence of a section can be used as a spatial operator and a time sequence model can be incorporated, such that the influences on a current section by its neighboring section for a plurality of spatial orders can be taken into account. In this way, the traffic condition in a spatial scope can be measured more practically, so as to improve accuracy of prediction. | 06-30-2011 |
20120239607 | DEVICE AND METHOD FOR RECOGNIZING USER BEHAVIOR - A device for recognizing user behavior is provided, which includes: a position data receiving unit configured to receive user position data and adjust the data based on time to obtain user position data in time series; a data pretreating unit configured to pretreat the user position data in time series; a feature vector extracting unit configured to extract a feature vector for recognizing a type of a user activity according to the pretreated user position data; and a user behavior recognizing unit configured to recognize the type of a user activity according to the feature vector extracted by the feature vector extracting unit and to obtain behavior features of the user. A method for recognizing user behavior is also provided. Deep level behavior features of the user can be obtained, such that the recognition result for each user can be more accurate and richer. | 09-20-2012 |
20140160564 | POLARIZER SUPPORT MEMBER AND LIGHTING-INSPECTION EQUIPMENT HAVING THE SAME - The present invention belongs to the technology field of a tool for testing an optical property of a structural member, and discloses a polarizer support member of a lighting-inspection equipment and a lighting-inspection equipment. By providing a connecting portion at each corner region of the support plate, and providing a fixing member which is detachably connected with the connecting portion at a location on the frame of the lighting-inspection equipment corresponding to each connecting portion, the forces applied to the support plate between the connecting portions and the fixing members are balanced so as to remain the support plate in a horizontal state, thus, the supporting stability of the support plate is ensured and the damage to the panel or other parts due to the sag of one end of the support plate is avoided. In addition, the structure of the support member is simple and the installation and detachment of the support is easy. The lighting-inspection equipment having the above polarizer support member as its upper polarizer support member can stably support the upper polarizer support member, and have a better inspection effect. | 06-12-2014 |
20150213259 | Web Service Sandbox System - A web service sandbox system. The web service sandbox system provides a secure mechanism with little to no risk to an origination domain hosting a user agent for the user agent to retrieve content from a potentially insecure web service hosted in another domain and using JSONP to bypass same-origin policy restrictions. The user agent posts a command message to a separate quarantined web session of a sandbox service acting as intermediary between the user agent web session and the web service. The sandbox service makes the actual call to and parses the response from the web service. Scripts from the response are executed only in the quarantined web session of the sandbox service. The resulting “safe” content obtained from the web service by the sandbox service is returned to the user agent where it may be rendered. | 07-30-2015 |
20150303954 | SYSTEM, METHOD, AND APPARATUS FOR ANALOG SIGNAL CONDITIONING OF HIGH-SPEED DATA STREAMS - A device includes circuitry configured to receive a signal burst, apply one or more filters to the signal burst based to achieve a predetermined image rejection rate, apply at least one harmonic rejection mode to the signal burst, and amplify the signal burst based on a gain partitioning determination. | 10-22-2015 |
20150370101 | METHOD OF REPAIRING DISPLAY PANEL, AND DISPLAY PANEL - The present invention discloses a method for repairing a display panel, in which a path for electrically connecting two ends of an opened data line at an opened part thereof is formed by using first line segments and a first common electrode, wherein each of the first line segments is a part of one of common electrode lines in the display panel intersecting the opened data line, and the first common electrode is one of a plurality of common electrodes in a pixel array that is electrically connected with the first line segments. Further, a welding process is performed at an intersecting region between the first line segments and the opened data line to form an electrical connection, and electrical connections between the path and other common electrode lines and other common electrodes outside the path are cut off. This method for repairing data lines employs existing common electrode lines and common electrodes to repair an opened data line, so that no additional repairing line needs to be disposed in the display panel to facilitate a narrow bezel design of the display panel and thus repairing the data lines is no longer limited by the number of the repairing lines. Furthermore, the influence on data signals is negligible because no new line is introduced. | 12-24-2015 |