Patent application number | Description | Published |
20130136885 | LIGHT SOURCE CHIP AND A THERMALLY ASSISTED HEAD WITH THE SAME, AND MANUFACTURING METHODS THEREOF - A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. | 05-30-2013 |
20130250742 | THERMALLY-ASSISTED MAGNETIC RECORDING HEAD, HEAD GIMBALS ASSEMBLY, HEAD ARM ASSEMBLY, MAGNETIC DISK UNIT, AND LIGHT TRANSMISSION UNIT - The thermally-assisted magnetic recording head includes: a laser light source having an emission surface, the emission surface allowing laser light to be emitted therefrom; a waveguide having a core and a cladding, the core allowing the laser light emitted from the laser light source to propagate therethrough, and the cladding surrounding the core; a magnetic pole; and a plasmon generator. Each of the core and the cladding has an end surface facing the emission surface, and the end surface of the cladding suppresses returning of the laser light to the laser light source. | 09-26-2013 |
20130258823 | LIGHT SOURCE CHIP AND A THERMALLY ASSISTED HEAD WITH THE SAME, AND MANUFACTURING METHODS THEREOF - A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off. | 10-03-2013 |