Patent application number | Description | Published |
20100088907 | ELECTRONIC SIGHT AND MANUFACTURING METHOD THEREOF - The electronic sight includes a base, an optical window, a point light source, a photomask and a low-reflective layer. The optical window is disposed on a first end of the base. The point light source, disposed on a second end of the base, provides a lightbeam. The photomask is disposed between the point light source and the optical window, and the low-reflective layer is formed thereon. The lightbeam passes through the photomask along a first direction, hits the optical window, and is reflected toward a second direction by the optical window. The method for manufacturing the electronic sight includes: providing a base; providing an optical window disposed on a first end of the base; providing a point light source disposed on a second end of the base; providing a photomask; forming a low-reflective layer on the photomask; and positioning the photomask between the point light source and the optical window. | 04-15-2010 |
20120195023 | OPTICAL SIGHT - An optical sight of the present invention may aim at an object via a cross. The optical sight has a focusing adjuster for focusing and a brightness adjuster for adjusting luminance on a cross. The focusing adjuster and the brightness adjuster are made at the same position that user may operate the optical sight more conveniently. | 08-02-2012 |
20140096431 | Sight - A sight includes a body and an adjusting dial. The body has a surface and a depression disposed on the surface. The adjusting dial is disposed on the surface of the body. The depression extends from an edge of the body to the adjusting dial. | 04-10-2014 |
20140347751 | SIGHT - A sight includes a cylinder, a first lens, a first lens seat, and at least one first elastic member. The first lens is disposed in the cylinder. The first lens seat carrying the first lens is disposed in the cylinder. The first elastic member is disposed between an outer surface of the first lens seat and an inner periphery of the cylinder, wherein the first lens seat is tightly fitted with the cylinder and light enters the cylinder through the first lens. | 11-27-2014 |
Patent application number | Description | Published |
20110143498 | SEMICONDUCTOR PACKAGE WITH A SUPPORT STRUCTURE AND FABRICATION METHOD THEREOF - A semiconductor package with a support structure and a fabrication method thereof are provided. With a chip being electrically connected to electrical contacts formed on a carrier, a molding process is performed. A plurality of recessed portions formed on the carrier are filled with an encapsulant for encapsulating the chip during the molding process. After the carrier is removed, the part of the encapsulant filling the recessed portions forms outwardly protruded portions on a surface of the encapsulant, such that the semiconductor package can be attached to an external device via the protruded portions. | 06-16-2011 |
20110156252 | SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND FABRICATION METHOD THEREOF - A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability. | 06-30-2011 |
20110221049 | QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME - A Quad Flat No-Lead (QFN) semiconductor package includes a die pad; I/O connections disposed at the periphery of the die pad; a chip mounted on the die pad; bonding wires; an encapsulant for encapsulating the die pad, the I/O connections, the chip and the bonding wires while exposing the bottom surfaces of the die pad and the I/O connections; a surface layer formed on the bottoms surfaces of the die pad and the I/O connections; a dielectric layer formed on the bottom surfaces of the encapsulant and the surface layer and having openings for exposing the surface layer. The surface layer has good bonding with the dielectric layer that helps to prevent solder material in a reflow process from permeating into the die pad and prevent solder extrusion on the interface of the I/O connections and the dielectric layer, thereby increasing product yield. | 09-15-2011 |
20110298126 | CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD - A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on the metal studs an antioxidant layer such as a silver plating layer or an organic solderable protection layer; and performing die-bonding, wire-bonding and molding processes respectively to form a second encapsulant encapsulating the chip. The recess grooves are filled with the first encapsulant to enhance the adhesion between the first encapsulant and the metal carrier, thereby solving the conventional problem of having a weak and pliable copper plate and avoiding transportation difficulty. The invention eliminates the use of costly metals as an etching resist layer to reduce fabrication cost, and further allows conductive traces to be flexibly disposed on the metal carrier to enhance electrical connection quality. | 12-08-2011 |
20120007234 | SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD THEREOF - A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer. | 01-12-2012 |
20130161802 | SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND FABRICATION METHOD THEREOF - A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability. | 06-27-2013 |
20140162409 | METHOD FOR FABRICATING QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE - A Quad Flat No-Lead (QFN) semiconductor package includes a die pad; I/O connections disposed at the periphery of the die pad; a chip mounted on the die pad; bonding wires; an encapsulant for encapsulating the die pad, the I/O connections, the chip and the bonding wires while exposing the bottom surfaces of the die pad and the I/O connections; a surface layer formed on the bottoms surfaces of the die pad and the I/O connections; a dielectric layer formed on the bottom surfaces of the encapsulant and the surface layer and having openings for exposing the surface layer. The surface layer has good bonding with the dielectric layer that helps to prevent solder material in a reflow process from permeating into the die pad and prevent solder extrusion on the interface of the I/O connections and the dielectric layer, thereby increasing product yield. | 06-12-2014 |
20140206146 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES - A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability. | 07-24-2014 |
20140315351 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER - A semiconductor package without a chip carrier formed thereon and a fabrication method thereof. A metallic carrier is half-etched to form a plurality of grooves and metal studs corresponding to the grooves. The grooves are filled with a first encapsulant and a plurality of bonding pads are formed on the metal studs. The first encapsulant is bonded with the metal studs directly. Each of the bonding pads and one of the metal studs corresponding to the bonding pad form a T-shaped structure. Therefore, bonding force between the metal studs and the first encapsulant is enhanced such that delamination is avoided. Die mounting, wire-bonding and molding processes are performed subsequently. Since the half-etched grooves are filled with the first encapsulant, the drawback of having pliable metallic carrier that makes transportation difficult to carry out as encountered in prior techniques is overcome, and the manufacturing cost is educed by not requiring the use of costly metals as an etching resist layer. | 10-23-2014 |
Patent application number | Description | Published |
20090283566 | Switch mechanism for staplers - A switch mechanism for a stapler includes a trigger and a pivotable member and a swing member are pivotably connected to the trigger by two pins. The pivotable member has a first protrusion extending from a top of the pivotable member. The pivotable member is received in a recess of the slide member a second protrusion extends from an inner top end thereof. A spring is connected between the first and second protrusions so that the slide member is movable relative to the pivotable member. The swing member includes a first curved part and a second curved part which is located at a side of the pivotable member. The curved part of the swing member is inserted into a hole of the slide member when pulling the trigger, the slide member is moved downward to change the relative position between the slide member and the valve of the stapler. | 11-19-2009 |
20100051667 | Switching mechanism for stapling modes of a stapler - The purpose of this invention is to propose a switching mechanism for switching stapling modes of a stapler, which mainly comprises a trigger, a supporting member, a slide member, a spring, a hooking member and a torsion spring. When the safety device of the stapler is pushed, then it further pushes the slide member to open the air valve, then at the moment, if the trigger is further pressed, the stapling counterforce will make the slide member escape the pressure from the safety device so to finish single stapling process. When the trigger is pressed first and then the safety device is pushed to further push the slide member to open the air valve, it will make stapling contentiously until the trigger is released. Above process then makes a contentious stapling. | 03-04-2010 |
Patent application number | Description | Published |
20160097917 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image, along the optical axis in order from an object side to an image side, include a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power; and at least one of the image-side surface and object-side surface of each of the five lens elements are aspheric. The optical lens can increase aperture value and improve the imagining quality for use in compact cameras. | 04-07-2016 |
20160097918 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image, along the optical axis in order from an object side to an image side, include a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power. An image-side surface of the fifth lens can be concave, and both surfaces thereof are both aspheric, wherein at least one surface thereof has an inflection point. The first to the fifth lenses of the five-piece optical lens have refractive power. The optical lens can increase aperture value and improve the imaging quality for use in compact cameras. | 04-07-2016 |
20160103298 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image includes, in order from an object side to an image side, a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power. An image-side surface of the fifth lens can be concave, and both surfaces thereof are both aspheric, wherein at least one surface thereof has an inflection point. The first to the fifth lenses of the five-piece optical lens have refractive power. The optical lens can increase aperture value and improve the imaging quality for use in compact cameras. | 04-14-2016 |
Patent application number | Description | Published |
20130292832 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package includes: a first insulating layer; a plurality of first conductive elements disposed in the first insulating layer; a first circuit layer formed on the first insulating layer; a semiconductor chip disposed on the first insulating layer; and an encapsulant formed on the first insulating layer and encapsulating the semiconductor chip. The first conductive elements that are bonding wires have a small diameter and thus occupy desired limited space on the first insulating layer. Therefore, more space is available for the first circuit layer. | 11-07-2013 |
20130307152 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield. | 11-21-2013 |
20140091462 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace layer. Since a strong bonding is formed between the dielectric layer and the conductive trace layer, the present invention can prevent delamination between the dielectric layer and the conductive trace layer from occurrence, thereby improving reliability and facilitating the package miniaturization by current fabrication methods. | 04-03-2014 |
20140308780 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield. | 10-16-2014 |
20150091150 | PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A method for fabricating a POP structure is disclosed. First, a first package is provided, which has: a dielectric layer; a stacked circuit layer embedded in the dielectric layer and exposed from upper and lower surfaces of the dielectric layer; a plurality of conductive posts and a semiconductor chip disposed on the upper surface of the dielectric layer and electrically connected to the stacked circuit layer; and an encapsulant formed on upper surface of the dielectric layer for encapsulating the semiconductor chip and the conductive posts and having a plurality of openings for exposing top ends of the conductive posts. Then, a second package is disposed on the encapsulant and electrically connected to the conductive posts. The formation of the conductive posts facilitates to reduce the depth of the openings of the encapsulant, thereby reducing the fabrication time and increasing the production efficiency and yield. | 04-02-2015 |
20150305162 | PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A fabrication method of a packaging substrate is provided, which includes the steps of: forming first conductive portions on a carrier; sequentially forming a conductive post and an alignment layer on each of the first conductive portions; forming an encapsulant on the carrier for encapsulating the first conductive portions, the conductive posts and the alignment layers; forming a conductive via on each of the alignment layers in the encapsulant and forming second conductive portions on the conductive vias and the encapsulant; and removing the carrier. Each of the first conductive portions and the corresponding conductive post, the alignment layer and the conductive via form a conductive structure. The alignment layer has a vertical projection area larger than those of the conductive post and the conductive via to thereby reduce the size of the conductive post and the conductive via, thus increasing the wiring density and the electronic element mounting density. | 10-22-2015 |
20150366060 | CIRCUIT STRUCTURE AND FABRICATION METHOD THEREOF - A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand. | 12-17-2015 |
Patent application number | Description | Published |
20100024235 | WHEELED DISTANCE MEASURING DEVICE - A wheeled distance measuring device includes a wheel with a measuring unit connected to a side of the wheel and a pole unit is connected to the wheel, the pole unit includes a first section, a second section and a third section. The first section has two first holes and two second holes defined in two ends thereof. The first section is movably inserted into the second section which has two third holes and movably inserted into the third section which has two fourth holes. Two positioning units are respectively located between the first and second section, and between the second and third sections. The positioning units control the retractable movement of the sections so as to adjust the length of the pole unit. A handle is connected to the pole unit and controls the positioning units by an action rod. | 02-04-2010 |
20100024236 | BRAKE MECHANISM FOR WHEELED DISTANCE MEASURING DEVICE - A brake mechanism for a wheeled distance measuring device includes a first brake rod and a second brake rod, both of which are located in a pole unit of the distance measuring device. The first brake rod is connected with a brake key and the second brake rod is connected with a contact section which has a brake pad connected thereto. The brake key includes first and second protrusions and a control rod is connected with the first brake rod, the control rod includes third and fourth protrusions. A locking recess is defined between the third and fourth protrusions. The first and second brake rods are lowered to brake the wheel by the brake pad when the first protrusion presses the third protrusion. The second protrusion is locked in the locking recess and presses the third protrusion to keep the wheel to be braked. | 02-04-2010 |
20100025558 | POLE UNIT FOLDING MECHANISM FOR WHEELED DISTANCE MEASURING DEVICE - A pole unit for a wheeled distance measuring device includes a first tube having a first pivotable portion and a first engaging portion extending radially outward therefrom respectively. A second tube has a second pivotable portion and a second engaging portion extending radially outward therefrom in two opposite directions. The second pivotable portion is pivotably connected to the first pivotable portion. A third tube and a fourth tube respectively connected to the first and second tubes respectively. A first connection member is connected to the second tube and has a second hook which is hooked with the first engaging portion. A connection mechanism has a second connection member pivotably connected to the first tube, and a third connection member which is removably connected with the first connection member so as to allow the first and second tubes to be pivotable. | 02-04-2010 |
20110119822 | STOOL FLUSH CONTROL DEVICE - The present invention discloses a stool flush control device, which comprises a main pipe, an independent casing pipe, an indirect connecting pipe, a lock ring and a valve assembly. The main pipe includes flow passage, inclined kerf and screw-thread section. The casing pipe has penetrating hole, a plurality of hollow-out holes, U-shaped tying collar, and two flat kerfs. The lock ring is screw-coupled with the screw-thread section of the main pipe so as to fix in water reservoir tank. The valve assembly connects top flat kerf of the casing pipe. The tying collar ties the manifold. The top of the indirect pipe connects the casing pipe, and the bottom has an inclined opening couplably connecting the inclined kerf of the main pipe. A bolt and a nut are tightened together to press the tying collar so that the valve assembly, the casing pipe, the indirect pipe and the main pipe are closely couple-connected. Thus, the stool flush control device can be easily dismounted and mounted, and fit different sizes of assembly components. | 05-26-2011 |