Tang, AZ
Andrew Tang, Tucson, AZ US
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20160022312 | MODIFIED VERESS NEEDLE FOR TENSION PNEUMOTHORAX DECOMPRESSION - Disclosed are devices and methods for treating tension pneumothorax. A needle assembly may include an outer cannula defining a lumen and having a distal end portion with a sharp bevel, and an inner cannula slidably-disposed through the lumen of the outer cannula. The inner cannula moves between an extended and retracted position and includes a blunt distal end portion configured to extend beyond the sharp bevel of the outer cannula when the inner cannula is in the extended position. The blunt distal end portion can retract within the lumen of the outer cannula when the inner cannula is in the retracted position, thereby exposing the sharp bevel. The needle assembly further includes a bias disposed inside the housing and coupled to the inner cannula. A proximal end portion of the inner cannula is configured to extend through the housing when the inner cannula is in the retracted position. | 01-28-2016 |
Chenhong Tang, Tempe, AZ US
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20160045611 | SUGAR-LINKER-DRUG CONJUGATES - The present disclosure relates to sugar-linker-drug conjugates, of the formula [A-B-]n-L-D, wherein A is a saccharide; B is a spacer, n is an integer selected from 1 to 3; L is a linker group and D is a drug having a chemically reactive functional group selected from the group consisting of a primary or secondary amine, hydroxyl, sulfhydryl, carboxyl, aldehyde and ketone. Pharmaceutical compositions comprising the conjugates and methods of using them are also provided. | 02-18-2016 |
Clive Tang, Chandler, AZ US
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20090088098 | GAIN CONTROL METHODS FOR WIRELESS DEVICES AND TRANSMITTERS - Embodiments of wireless devices and transmitters are provided, which perform embodiments of automatic gain control methods. The embodiments of wireless devices and transmitters include a ramp generator, a digital gain signal generator, a combiner, and a variable gain amplifier. The ramp generator is adapted to receive a gain control input signal and to generate a gain ramp signal based on the gain control input signal. The digital gain signal generator is adapted to generate and incorporate a gain arc into a digital gain signal. A combiner is adapted to receive and combine a digital input signal with the digital gain signal, to generate a pre-compensated digital signal. The variable gain amplifier is adapted to apply gains indicated in the gain ramp signal to a pre-adjusted analog signal, which is generated based on the pre-compensated digital signal, in order to generate a gain-adjusted analog signal. | 04-02-2009 |
20120064847 | Systems and Methods for Spurious Emission Cancellation - In accordance with some embodiments of the present disclosure, a method may include digitally pre-distorting a digital baseband signal with an opposite phase of a C-IM3 distortion term such that the pre-distortion and C-IM3 distortion cancel each other out in a transmitter. The method may also include digitally conditioning the pre-distorted digital signal in order to provide a flat amplitude response of a composite filter comprising a baseband filter and a digital half-band filter of the transmitter, and to provide a linear phase response for the composite filter. | 03-15-2012 |
Clive K. Tang, Chandler, AZ US
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20090175360 | TECHNIQUES FOR COMPRESSING DIFFERENTIAL SAMPLES OF BANDWIDTH-LIMITED DATA TO REDUCE BANDWIDTH AND POWER CONSUMPTION BY AN INTERFACE - Techniques and technologies are provided for compressing differential samples of bandwidth-limited data and coding the compressed differential samples to reduce bandwidth and power consumption when communicating bandwidth-limited data over a serial interface which couples one integrated circuit to another integrated circuit. | 07-09-2009 |
20100048149 | Techniques for Adaptive Predistortion Direct Current Offset Correction in a Transmitter - A technique for performing adaptive predistortion in a transmitter includes receiving, at a first input of an error signal unit, a delayed version of a baseband input signal. The technique also includes receiving, at a second input of the error signal unit, a power amplifier feedback signal from an output of a power amplifier. An input error signal that corresponds to a difference between the delayed version of the baseband input signal and the power amplifier feedback signal is then provided at an output of the error signal unit. The input error signal is then received at an input of a signal conditioner. An adjusted error signal that has a lower direct current offset than the input error signal is provided at an output of the signal conditioner. | 02-25-2010 |
20100111238 | ERROR SIGNAL PROCESSING SYSTEMS FOR GENERATING A DIGITAL ERROR SIGNAL FROM AN ANALOG ERROR SIGNAL - Apparatus, systems, and methods are provided for controlling the output of a transmitter using a digital error signal. A method comprises generating a digital reference signal based on a baseband input signal and converting the digital reference signal to an analog reference signal. The method further comprises generating an analog error signal in response to a difference between the analog reference signal and an analog output signal. The method further comprises generating a digital error signal from the analog error signal, and generating an input signal for the transmitter based on the baseband input signal and the digital error signal. | 05-06-2010 |
Fu Tang, Gilbert, AZ US
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20140027884 | SYSTEM AND METHOD FOR GAS-PHASE SULFUR PASSIVATION OF A SEMICONDUCTOR SURFACE - Improved methods and systems for passivating a surface of a high-mobility semiconductor and structures and devices formed using the methods are disclosed. The method includes providing a high-mobility semiconductor surface to a chamber of a reactor and exposing the high-mobility semiconductor surface to a gas-phase sulfur precursor to passivate the high-mobility semiconductor surface. | 01-30-2014 |
Lei Tang, Oro Valley, AZ US
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20120301885 | CYTOGENIC ANALYSIS OF METAPHASE CHROMOSOMES - The present invention relates to methods and systems for analyzing chromosomes, and in particular to methods and systems for simultaneously performing banding and in situ hybridization on metaphase chromosomes. | 11-29-2012 |
20130196880 | PATTERNED DEVICES AND METHODS FOR DETECTING ANALYTES - Disclosed herein are devices for the detection of target molecules and methods for their use and production. The disclosed devices may include optically decipherable patterns that facilitate an understanding of binding events between a target molecule and a detection molecule. In one example, a device includes a macroscopic pattern constructed using microscopic elements that can be chromogenically developed to memorialize a binding event. In another example, a device includes characters that can be chromogenically developed using an automated slide staining instrument to memorialize a binding event. | 08-01-2013 |
Shouhong Tang, Tucson, AZ US
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20080285053 | MEASURING THE SHAPE, THICKNESS VARIATION, AND MATERIAL INHOMOGENEITY OF A WAFER - In one embodiment, an interferometer system comprises an unequal path interferometer assemble comprising; a first reference flat having a first length L | 11-20-2008 |
20080304078 | METHOD AND APPARATUS FOR OPTICALLY ANALYZING A SURFACE - In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer. | 12-11-2008 |
20090284734 | MEASURING THE SHAPE AND THICKNESS VARIATION OF A WAFER WITH HIGH SLOPES - In one embodiment, an interferometer system comprises two unequal path interferometers assemble comprising; a first reference flat having a first length L | 11-19-2009 |
20100208272 | METHOD AND APPARATUS FOR MEASURING SHAPE OR THICKNESS INFORMATION OF A SUBSTRATE - An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices. | 08-19-2010 |
Toni Tang, Gilbert, AZ US
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20110305959 | TUNED HYDROPHOBICITY - An electrochemical cell comprising an electrolyte comprising water and a hydrophobic ionic liquid comprising positive ions and negative ions. The electrochemical cell also includes an air electrode configured to absorb and reduce oxygen. A hydrophilic or hygroscopic additive modulates the hydrophobicity of the ionic liquid to maintain a concentration of the water in the electrolyte is between 0.001 mol % and 25 mol %. | 12-15-2011 |
Weihua Tang, Chandler, AZ US
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20140291843 | HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING - Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect. | 10-02-2014 |
20150060527 | NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL COMPRESSION BONDING - Embodiments of a method for performing a thermal compression bonding process with a non-uniform temperature pattern and a heater having the non-uniform temperature pattern are disclosed. In some embodiments, the heater includes a plurality of heating element segments configured to generate the non-uniform temperature pattern. The configuration comprises a plurality of heating element segment densities or a plurality of heating element segment resistances. | 03-05-2015 |
Yuping Tang, Tempe, AZ US
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20090298784 | ISOLATION AND STRUCTURE OF TURBOSTATINS 1-4 - Described herein are novel cerebroside compounds, designated as Turbostatin 1, Turbostatin 2, Turbostatin 3, and Turbostatin 4. These compounds were extracted and isolated from the marine mollusk Turbo stenogyrus, and their structures elucidated. The new compounds exhibit significant cancer cell growth inhibition activity against a variety of murine and human cancer cell lines, and as such appear will be useful in the treatment of various forms of neoplastic disease. | 12-03-2009 |
Zhizhong Tang, Tempe, AZ US
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20140264820 | PASTE THERMAL INTERFACE MATERIALS - Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an IC package includes an IC component, a heat spreader, and a paste TIM disposed between the die and the heat spreader. The paste TIM may include particles of a metal material distributed through a matrix material, and may have a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns. Other embodiments may be described and/or claimed. | 09-18-2014 |
20140264821 | MOLDED HEAT SPREADERS - Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed. | 09-18-2014 |