Tan, Penang
Ai-Mei Tan, Penang MY
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20150366496 | SAFETY NEEDLE BLOOD SAMPLING DEVICES AND RELATED METHODS - Blood collection assemblies with safety features are disclosed. The assemblies have a housing for receiving a vacutainer, which has a septum that penetrates a sharp needle tip. The disclosed assemblies further have a shield for covering the other end of the needle following use to prevent accidental contact with the distal needle tip. The shield is spring loaded so that the spring force moves the shield over the needle. The shield can be secured or held in an initial position and allowed to move to cover the needle upon actuation or activation of an activator unit. | 12-24-2015 |
Chin Nyap Tan, Penang MY
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20090219722 | CERAMIC LIGHT EMITTING DEVICE - A light emitting device comprising a ceramic substrate is disclosed. And embodiment of the substrate comprises a mounting portion, a peripheral wall extending from the mounting portion, and a reflective surface extending from the peripheral wall opposite the mounting portion. The reflective surface has a reflective material located thereon. The peripheral wall, the mounting portion, and the reflective surface form a well. A light emitter is located adjacent the mounting portion. A transparent material is located in the well. The peripheral wall is devoid of the reflective material. | 09-03-2009 |
20110024785 | Light Emitting Diode Device - An electronic assembly includes a Light Emitting Diode (LED) and a substrate. The LED has a solderable surface other than the contacts. The substrate has an opening. The solderable surface is mounted substantially over the opening. When the opening is filled with solder, the solderable surface is metallically bonded with the solder in the opening. | 02-03-2011 |
Chong Hin Tan, Penang MY
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20090230567 | METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE - A method of grinding a molded semiconductor package to a desired ultra thin thickness without damage to the package is disclosed. Prior to grinding a molded package to a desired package thickness, the package may be protected from excessive mechanical stress generated during grinding by applying a protective tape to enclose interconnects formed on the package. This way, the protective tape provides support to the semiconductor package during package grinding involving the mold material as well as the die. In the post-grind package, the grinded die surface may be exposed and substantially flush with the mold material. The protective tape may then be removed to prepare the post-grind package for connection with an external device or PCB. | 09-17-2009 |
20120175786 | METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE - A method of grinding a molded semiconductor package to a desired ultra thin thickness without damage to the package is disclosed. Prior to grinding a molded package to a desired package thickness, the package may be protected from excessive mechanical stress generated during grinding by applying a protective tape to enclose interconnects formed on the package. This way, the protective tape provides support to the semiconductor package during package grinding involving the mold material as well as the die. In the post-grind package, the grinded die surface may be exposed and substantially flush with the mold material. The protective tape may then be removed to prepare the post-grind package for connection with an external device or PCB. | 07-12-2012 |
Chu Kun Tan, Penang MY
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20090057850 | Surface Mountable Semiconductor Package with Solder Bonding Features - A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions. | 03-05-2009 |
20090219722 | CERAMIC LIGHT EMITTING DEVICE - A light emitting device comprising a ceramic substrate is disclosed. And embodiment of the substrate comprises a mounting portion, a peripheral wall extending from the mounting portion, and a reflective surface extending from the peripheral wall opposite the mounting portion. The reflective surface has a reflective material located thereon. The peripheral wall, the mounting portion, and the reflective surface form a well. A light emitter is located adjacent the mounting portion. A transparent material is located in the well. The peripheral wall is devoid of the reflective material. | 09-03-2009 |
Chun-Aun Tan, Penang MY
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20130230144 | SYSTEM AND METHOD FOR AUTOMATED X-RAY INSPECTION - An automated X-ray inspection system employing phase shift profilometry (PSP) and three dimensional (3D) surface modeling for improving inspection of an object, includes at least one projector for projecting light to the object, at least one optical lens for imaging a light pattern obtained from the object to at least one camera, the at least one camera being adapted to capture a plurality of images of the object. The light passing from the projector lens of the at least one projector illuminates the object thereby generating the light pattern to be imaged from the object to the at least one camera via the at least one optical lens. | 09-05-2013 |
Chun Yee Tan, Penang MY
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20100157958 | METHOD, DEVICE AND SYSTEM FOR TEMPORARILY SELECTING A TIME SLOT - Temporarily selecting a TDMA timeslot by a radio communication device to thereby allow the radio communication device to communicate, through at least one repeater station, with a talkgroup of other radio communication devices is disclosed. The radio communication device has an assigned default timeslot for communicating with the talkgroup. The radio communication device determines if the default timeslot is available for the radio communication device to communicate with the talkgroup and searches for an available timeslot, when the default timeslot is unavailable. The radio communication device temporarily selects the available timeslot as a temporary selected group timeslot for the talkgroup. | 06-24-2010 |
Chye Boon Tan, Penang MY
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20150312989 | SYSTEM AND DEVICE FOR DRIVING A PLURALITY OF HIGH POWERED LED UNITS - A system for driving a plurality of high powered LED units, the system comprising a single driver for providing ripple free constant direct current to a plurality of high powered LED lamp units, wherein the single driver comprises a digital controller programmable to adjust the ripple free constant direct current at every predetermined time interval based on detection and computation of the duration taken for the energy to be discharged to the LED lamp unit to adjust the ripple free constant direct current. The above system achieves a one driver to many LED lamp units such that it alleviates or eliminates the need to have a driver attached to each LED lamp unit. | 10-29-2015 |
Eang Keong Tan, Penang MY
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20110153061 | Master Teaching Jig - A disk carrier for teaching disk positioning in a substrate changing system. The disk carrier composed of a panel having a disk opening configured to receive a disk and a plurality of beam sensors disposed around the disk opening to project beams parallel to a surface of the disk when secured within the disk opening. The plurality of beam sensors may be composed of at least one beam sensor on each of a front side and rear side of the panel. | 06-23-2011 |
Eng Hock Tan, Penang MY
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20100224382 | NOISE ELIMINATION BRAKE FOR AUTOMATIC SPINDLE LOCKING MECHANISM - A rotary power tool of the invention has a motor, a motor shaft driven by the motor, an output shaft coupled to the motor shaft via an automatic spindle locking mechanism, a housing portion surrounding the output shaft, and a braking member that is non-rotatable relative to the housing portion. The braking member exercises a braking torque on the output shaft whenever it rotates. | 09-09-2010 |
Eric Thian Aun Tan, Penang MY
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20080301397 | Method and arrangements for utilizing NAND memory - A method of utilizing NAND type memory is disclosed herein. Operating system type instructions executable by a processor can be stored in a NAND based memory. The instructions can have logical addresses that can be utilized by the processor to fetch the operating system instructions. The method can store address conversions in the NAND based memory, where the address conversions can relate logical addresses to a physical address. At least one validity flag can be assigned to the address conversions. The processor can perform a direct read of the operating system instructions from the NAND based memory in response to a first setting of a validity flag and the processor can perform an indirect read of the operating system instructions by fetching an address conversion from the NAND based memory in response to a second setting of the at least one validity flag. | 12-04-2008 |
Fern Nee Tan, Penang MY
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20090001512 | Providing a moat capacitance - In one embodiment, the present invention includes an apparatus having core logic formed on a die, input/output (IO) buffers surrounding the core logic, and a moat capacitance surrounding the IO buffers and extending to an edge of the die. Other embodiments are described and claimed. | 01-01-2009 |
Gin Ghee Tan, Penang MY
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20110147788 | SEMICONDUCTOR DEVICE WITH A LIGHT EMITTING SEMICONDUCTOR DIE - A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements. | 06-23-2011 |
20120146213 | HIGH PERFORMANCE LOW PROFILE QFN/LGA - A method for manufacturing a semiconductor device is disclosed. In one embodiment a semiconductor die is formed overlying a substrate. The semiconductor die is flip chip mounted to the substrate, wherein the substrate comprises a plurality of conductive traces. The semiconductor die and substrate are encapsulated with an encapsulating material. A top side of the encapsulating material is subjected to one of polishing, etching, and grinding to expose a top side of the semiconductor die. Finally, the bottom side of the substrate is subjected to one of polishing, etching, and grinding to remove the substrate and to reduce a thickness of the plurality of conductive traces. | 06-14-2012 |
Guan Tien Tan, Penang MY
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20090125285 | DECOMPOSITION OF NONLINEAR DYNAMICS USING MULTIPLE MODEL APPROACH AND GAP METRIC ANALYSIS - Multiple models for various stages of a non-linear process control are developed by clustering perturbation data obtained from the nonlinear process so as to permit multiple local data regions to be identified as a function of substantial similarity between the data, wherein the data of first data set represent the non-linear process. A discrete model corresponding to each of the local data regions is generated. The number of the discrete models may be reduced as a function of prediction error between actual outputs of the process and predicted outputs of the models and as a function of a gap metric based on closed loop similarity and frequency response similarity between the models. | 05-14-2009 |
Hai Boon Tan, Penang MY
Patent application number | Description | Published |
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20150312989 | SYSTEM AND DEVICE FOR DRIVING A PLURALITY OF HIGH POWERED LED UNITS - A system for driving a plurality of high powered LED units, the system comprising a single driver for providing ripple free constant direct current to a plurality of high powered LED lamp units, wherein the single driver comprises a digital controller programmable to adjust the ripple free constant direct current at every predetermined time interval based on detection and computation of the duration taken for the energy to be discharged to the LED lamp unit to adjust the ripple free constant direct current. The above system achieves a one driver to many LED lamp units such that it alleviates or eliminates the need to have a driver attached to each LED lamp unit. | 10-29-2015 |
Hiang Teik Tan, Penang MY
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20100127776 | AMPLIFIER WITH BIAS CIRCUIT PROVIDING IMPROVED LINEARITY - An amplifying device includes a cascode amplifier and a biasing circuit. The cascode amplifier is configured to receive an input signal and to output an amplified output signal corresponding to the input signal. The biasing circuit is configured to bias the cascode amplifier, the biasing circuit including a first current mirror and a second current mirror stacked on the first current mirror. The biasing circuit improves linearity of the cascode amplifier across a wide temperature range. | 05-27-2010 |
Kheng Leng Tan, Penang MY
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20090129085 | OPTICAL DEVICE - An exemplary embodiment of an optical device may include a lead frame with a plurality of leads and a reflector housing formed around the lead frame. The reflector housing includes a first end face and a second end face and a peripheral sidewall extending between the first end face and the second end face. The reflector housing includes a first pocket with a pocket opening in the first end face and a second pocket with a pocket opening in the second end face. At least one LED die is mounted in the first pocket of the reflector housing, and a light transmitting encapsulant is disposed in the first pocket and encapsulating the at least one LED die. | 05-21-2009 |
20100320485 | MULTI-CHIP PACKAGED LED LIGHT SOURCE - A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer. | 12-23-2010 |
20120211785 | HIGH POWER PLASTIC LEADED CHIP CARRIER WITH INTEGRATED METAL REFLECTOR CUP AND DIRECT HEAT SINK - A Plastic Leaded Chip Carrier (PLCC) package is disclosed. The PLCC package includes a lead frame with an integrated reflector cup. The reflector cup is directly connected to a heat sink, which improves the ability of the PLCC package to distribute heat away from the light source that is provided in the reflector cup. | 08-23-2012 |
20130062655 | HIGH THERMAL CONDUCTIVITY AND LOW DEGRADATION DIE ATTACH WITH DUAL ADHESIVE - A package for a light source, a semiconductor device, and methods of manufacturing the same are disclosed. In particular, a Light Emitting Diode (LED) dice is attached to a bonding pad of the light source package by two discrete types of different adhesives. One of the adhesives may be curable under exposure to Ultraviolet (UV) light and the other adhesive may be cured under thermal radiation, but is stable when exposed to UV light. | 03-14-2013 |
20130215611 | HYBRID CANOPY LIGHTING FOR OPTIMUM LIGHT BEAM SHAPING - A lighting system and method are disclosed. Specifically, the lighting system includes a hybrid canopy that can provide an optimum light beam shape for a number of different lighting applications. The hybrid canopy is equipped with lighting clusters of different types, thereby enabling a broader beam output without sacrificing beam intensity or brightness. | 08-22-2013 |
20140146531 | ILLUMINATION DEVICE WITH COMBINATION OF DISCRETE LIGHT EMITTING DIODE AND ORGANIC LIGHT EMITTING DIODE COMPONENTS - An illumination device, system, and method are disclosed. The illumination device includes one or more first light sources and one or more second light sources. The one or more first light sources may correspond to discrete light sources whereas the one or more second light sources may correspond to sheet or film-type light sources, such as Organic Light Emitting Diode (OLED) sheets. | 05-29-2014 |
20140153219 | Cooling System Utilizing Potential Energy - A cooling system utilizing a potential energy that provides cooling with low power consumption is disclosed. The cooling system may comprise a heat dissipating member, a support structure, a movable assembly, and a coil. In one embodiment, the movable assembly may be configured to oscillate above the heat dissipating member by utilizing induction from the coil and the potential energy to generate air flow that provide cooling on the heat dissipating member. In other embodiments, the movable assembly may be configured to oscillate substantially within the recess of the heat dissipating member. | 06-05-2014 |
20140160746 | SYSTEM, DEVICE, AND METHOD FOR ADJUSTING COLOR OUTPUT THROUGH ACTIVE COOLING MECHANISM - An illumination device, system, and method are disclosed. The illumination device includes an active cooling mechanism and a controller for the same. When the controller activates or deactivates the active cooling mechanism, one or more optical elements on the illumination device are automatically moved, thereby adjusting at least one characteristic of the light emitted by the illumination device. | 06-12-2014 |
20140168975 | LIGHTING FIXTURE WITH FLEXIBLE LENS SHEET - A lighting system and lighting fixture cover are disclosed. Specifically, the lighting system can provide an optimum light beam shape for a number of different lighting applications. The lighting system includes a PCB and cover with one or more lenses and one or more snap-fit locking mechanisms to secure the cover to the PCB. The cover enables a narrow beam output without sacrificing beam intensity or brightness. The cover simplifies the assembly process of a lighting fixture. | 06-19-2014 |
20140184096 | MINIMIZED COLOR SHIFT LIGHTING ARRANGEMENT DURING DIMMING - An illumination device, system, and method are disclosed. The illumination system includes a first set of light sources and a second set of light sources, driven by a first driver and second driver, respectively. The system further includes a dimming control system that implemented dimming control logic. The dimming control logic coordinates the operation of the first and second drivers such that the first and second sets of light sources are activated and deactivated so as to achieve substantially constant color temperature during dimming operations. | 07-03-2014 |
20140252943 | Lighting Device With Spectral Converter - In one embodiment, a light-emitting device having a body, a reflector, a light source die, and a spectral converter is disclosed. The spectral converter may be formed adjacent to, but distanced away from, the light source die. The spectral converter may be configured to spectrally adjust a portion of the light output having a predetermined spectral content. In another embodiment, a system for illumination having a plurality of lighting assemblies is disclosed. Each of the lighting assemblies comprises a spectral converter configured to spectrally adjust a portion of the light output so that the plurality of lighting assemblies are configured to emit substantially similar spectral output. In yet another embodiment, a lighting apparatus having the spectral converter is disclosed. | 09-11-2014 |
20140254127 | Lighting Device And Apparatus With Spectral Converter Within A Casing - In one embodiment, a light-emitting device having a substrate, a casing, a plurality of light source dies, a plurality of spectral converters and a plurality of optical structures is disclosed. The spectral converters may be configured to spectrally adjust a portion of the light output of the light source die into a first and second converted spectral output that is substantially different from one another. In another embodiment, a system for illumination having a plurality of lighting assemblies has been disclosed. Each of the lighting assemblies comprises a light source die and a spectral converter. The spectral converter is configured to spectrally adjust the light output of the light source die so that the plurality of lighting assemblies are configured to emit substantially different spectral output. In yet another embodiment, a lighting apparatus having a primary spectral converter and a secondary spectral converter is disclosed. | 09-11-2014 |
20140353701 | LIGHT SOURCE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A package for a light source is disclosed. In particular, a Plastic Leaded Chip Carrier (PLCC) is described which provides enhanced heat dissipating properties. Moreover, the PLCC is described as comprising a single-gage leadframe, which provides for enhanced design flexibility and reduced manufacturing costs. Methods of manufacturing light source packages are also disclosed. | 12-04-2014 |
20150211714 | Light-Emitting Device With Partial Roughened Illumination Surface - In one embodiment, a light-emitting device having a reflector, an emitter and an encapsulant is disclosed. The encapsulant may have a plurality of optical structures. Each of the plurality of optical structures may be configured to attenuate light transmitting towards a first direction by re-directing towards a second direction. In another embodiment, a flashlight having a roughened area with micro-optics is disclosed. Each of the micro-optics is configured to redirect light transmitting towards a direction forming an angle relative to a longitudinal axis to a point along the longitudinal axis. In yet another embodiment, a lighting-emitting device having roughened area to reduce light along a longitudinal axis is disclosed. | 07-30-2015 |
20150228608 | Semiconductor Device With An Interlocking Wire Bond - In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed. | 08-13-2015 |
20150228611 | SEMICONDUCTOR DEVICE WITH AN INTERLOCKING STRUCTURE - In one embodiment, a semiconductor device having a die attach pad, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. The die attach pad may be sandwiched between the semiconductor die and the die attach pad. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock structure formed integrally with the die attach pad. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed. | 08-13-2015 |
Kiah Ling Tan, Penang MY
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20080318364 | PROCESS APPLYING DIE ATTACH FILM TO SINGULATED DIE - Methods and systems of applying a plurality of pieces of die attach film to a plurality of singulated dice are provided. The method can involve making intervals between rows and columns of a plurality of pieces of die attach film. The interval can be made by expanding an underlaid expandable film on which the plurality of pieces of die attach film are placed or by removing portions of the die attach film between rows and columns of the plurality of pieces of die attach film. The method can further involve placing a plurality of singulated dice back side down on the plurality of pieces of die attach film. | 12-25-2008 |
Kia Kuang Tan, Penang MY
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20100071936 | Thermally-Efficient Metal Core Printed Circuit Board With Selective Electrical And Thermal Connectivity - Methods for controlling thermal conductivity paths in a metal core circuit board, as well as methods to provide selective electrical isolation, are described. In one embodiment, grooves are formed in an aluminum substrate surrounding areas where electrical components are to be mounted on the substrate. The grooves are oxidized along with the opposing surface of the substrate to create a vertical oxide ring around the area for electrical and lateral thermal isolation. This also allows the substrate to be made relatively thick for mechanical strength. Other features include forming copper around oxidized sides of the substrate for connection between top and bottom copper layers; plating up copper to be co-planar with a raised dielectric layer; forming indentions in the substrate for containing a dielectric so the dielectric is co-planar with the remaining surface; forming copper vias through the substrate; and planarizing the substrate surface so that conductors and dielectric layers are co-planar. | 03-25-2010 |
20100326492 | Photovoltaic Cell Support Structure Assembly - A plurality of CPV cells are mounted on a common ALOX™ plate. A copper interconnection layer is deposited over an insulating aluminum oxide surface of the ALOX™ plate. The interconnection layer connects all the CPV cells in series, so no wires are needed. In one embodiment, each CPV cell is mounted on a ceramic submount or an ALOX™ submount having an electrically insulating aluminum oxide layer formed in its bottom surface. Vias through the submount couple the cell electrodes to the copper interconnection pattern on the ALOX™ plate. The ALOX™ plate may be the heat sink or may be bolted or soldered to a separate heat sink. In one embodiment, edges of the ALOX™ plate are bent upwards, and side panels are affixed to the ALOX™ plate to create a box that supports a Fresnel lens that directs sunlight to each of the cells (e.g. nine) mounted on the ALOX™ plate. | 12-30-2010 |
20110024086 | Diffusion Bonding Circuit Submount Directly To Vapor Chamber - A method for providing a high in-plane and through-plane thermal conductivity path between a heat producing electronic device and a heat sink is described. A vapor chamber, or other type of heat spreader, is provided that has a substantially flat top copper surface and a substantially flat bottom copper surface. A ceramic submount is also provided, where the submount has a top copper metallization layer patterned for connection to electrodes of a heat-producing die, and where the submount has a bottom copper metallization layer. Prior to a working fluid being introduced into the vapor chamber, and prior to a die being mounted on the submount, the top copper surface of the vapor chamber is diffusion bonded to the bottom copper metallization layer of the ceramic submount under heat and pressure. The working fluid is then introduced into the vapor chamber, and the chamber is sealed. Dies are then mounted on the submount. The bottom of the vapor chamber is then affixed over a heat sink. | 02-03-2011 |
20110108245 | Circuit Board Forming Diffusion Bonded Wall of Vapor Chamber - A method for providing a high in-plane and through-plane thermal conductivity path between a heat producing electronic device and a heat sink is described. A vapor chamber is formed of a bottom metal shell and a top plate which are diffusion bonded together at their edges. The top plate is itself a circuit board that may be a metal core type, a ceramic type, or any bondable composite material. The metal core circuit board is preferably aluminum, and the dielectric regions on its top surface are aluminum oxide regions. A metal circuit layer is formed on the dielectric regions for interconnecting electronic devices mounted on the circuit board. Since the back surface of the circuit board is directly in contact with the working fluid in the vapor chamber, there is the ultimate in thermal coupling between the circuit board and a heat sink connected to the back of the vapor chamber. | 05-12-2011 |
20110121326 | Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition - A submount for an LED has relatively large copper pads formed on its top surface using an electroless process so that no electrical bias circuitry is required for the submount. The copper pads are then coated with nickel using an electroless process. The nickel layer is then coated with silver using an electroless process, such as an immersion silver process. In one embodiment, the silver layer is less than one micron thick. The Ni layer prevents a reduction in reflectivity of the Ag after long periods of use while conducting the high current (300 mA to >1 amp) needed for high power LEDs. The silver layer surrounds at least 75% of the periphery of the LED die and extends at least 1 mm around the periphery of the die to reflect the LED light. | 05-26-2011 |
20110122630 | Solid State Lamp Having Vapor Chamber - A solid state lamp has a form that replaces a standard screw-in or plug-in type light bulb. One or more LEDs are mounted on a thermally conductive submount, which is mounted on the top surface of a substantially round and flat vapor chamber. The vapor chamber efficiently spreads the heat and also conducts heat vertically. The vapor chamber is affixed to a substantially round mounting base of a metal housing. In this way, the very small LED dies appear to the mounting base as much larger heat sources producing less heat per unit area, and the thermal resistance of the heat path is greatly reduced. The housing has ventilation openings for cooling a bottom surface of the mounting base. The top of the vapor chamber is highly reflective, and the housing has a high emissivity coating. A standard base is attached to the housing for connection to an AC mains voltage. | 05-26-2011 |
Kim Pin Tan, Penang MY
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20110084727 | APPLICATION-SPECIFIC INTEGRATED CIRCUIT EQUIVALENTS OF PROGRAMMABLE LOGIC AND ASSOCIATED METHODS - Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs. | 04-14-2011 |
20130002295 | APPLICATION-SPECIFIC INTEGRATED CIRCUIT EQUIVALENTS OF PROGRAMMABLE LOGIC AND ASSOCIATED METHODS - Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs. | 01-03-2013 |
20130314122 | APPLICATION-SPECIFIC INTEGRATED CIRCUIT EQUIVALENTS OF PROGRAMMABLE LOGIC AND ASSOCIATED METHODS - Providing ASIC equivalents of FPGAs is facilitated and made more efficient and economical by using an ASIC architecture including a plurality of so-called hybrid logic elements (“HLEs”), each of which can provide a portion of the full functionality of an FPGA logic element (“LE”). The functionality of each FPGA LE implementing a user's logic design can be mapped to one or more HLEs without re-synthesis of the user's logic. Only as many HLEs as are necessary are used to perform the functions of each LE. The one-for-one equivalence between each LE and either (1) one HLE or (2) a group of HLEs facilitates mapping (without re-synthesis) in either direction between FPGA and ASIC designs. | 11-28-2013 |
Loon Kwang Tan, Penang MY
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20100181644 | IC PACKAGE WITH CAPACITORS DISPOSED ON AN INTERPOSAL LAYER - An integrated circuit (IC) package with a plurality of chip capacitors placed on a surface of a die is disclosed. The chip capacitors may be placed on top of the die with an interposal substrate layer. Placing chip capacitors on top of the die may reduce the size of the packaging substrate required. One or more wires may be used to connect the chip capacitors on the interposal layer to the packaging substrate. The IC package may include a lid and a thermal interface material (TIM) placed on top of the die. The lid may be shaped such that a protruding portion of the lid contacts the die directly through the TIM to improve heat dissipation. | 07-22-2010 |
20110272785 | IC PACKAGE WITH CAPACITORS DISPOSED ON AN INTERPOSAL LAYER - An integrated circuit (IC) package with a plurality of chip capacitors placed on a surface of a die is disclosed. The chip capacitors may be placed on top of the die with an interposal substrate layer. Placing chip capacitors on top of the die may reduce the size of the packaging substrate required. One or more wires may be used to connect the chip capacitors on the interposal layer to the packaging substrate. The IC package may include a lid and a thermal interface material (TIM) placed on top of the die. The lid may be shaped such that a protruding portion of the lid contacts the die directly through the TIM to improve heat dissipation. | 11-10-2011 |
Meng Whui Tan, Penang MY
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20080260262 | SYSTEM AND METHOD FOR OPTICALLY MEASURING A PARAMETER OF AN OBJECT - A system and method for optically measuring a parameter of an object uses a first segment of the object captured as a first frame of image data using a first imaging region of an image sensor array and a second segment of the object as a second frame of image data using a second imaging region of the image sensor array, which is larger than the first imaging region, to determine a displaced distance of the object relative to the image sensor array. | 10-23-2008 |
Phey-Chuin Tan, Penang MY
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20140028348 | Via-Configurable High-Performance Logic Block Involving Transistor Chains - A via-configurable logic block architecture for a Structured ASIC has a plurality of MOSFET transistor chains connected to one another through vias. In one embodiment there are three chains and the first transistor chain is a NFET transistor chain, the second transistor chain is a PFET transistor chain, and the third transistor chain is a NFET transistor chain. The first, second and third transistor chains are formed into devices made of transistors that are selected from a voltage threshold group consisting of LVT, SVT and HVT devices, where the first and third transistor chains are formed into devices from a voltage threshold group that is different from one another. In another embodiment transistor drive strength may be varied in the transistor chains of the logic block. In yet another embodiment both voltage threshold and drive strength may be varied together in a symmetrical manner. | 01-30-2014 |
Seng Hai Tan, Penang MY
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20110104544 | METHOD AND APPARATUS FOR DISASSEMBLING A HERMETICALLY SEALED BATTERY - A battery pack includes a cover coupled to a housing, wherein the cover and the housing are hermetically sealed to enclose one or more batteries. A wire is integrally molded within a perimeter of the cover to allow for the removal of the cover from the housing upon application of current to the wire. The wire is molded within the cover so as to be co-located along an edge of the housing. First and second contacts are coupled to the wire and remain exposed on the cover. The cover can be separated from the housing in response to current being applied to the first and second contacts and pulling of the wire. | 05-05-2011 |
Shan Chong Tan, Penang MY
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20100162054 | DETECTION OF AND RECOVERY FROM AN ELECTRICAL FAST TRANSIENT/BURST (EFT/B) ON A UNIVERSAL SERIAL BUS (USB) DEVICE - An Electrical Fast Transient/Burst (EFT/B) detection and recovery system for a Universal Serial Bus (USB) device. The system includes a USB core and a burst controller. The USB core provides serial communications with a host device through a USB data channel. The burst controller is coupled to the USB core. The burst controller detects an EFT/B event and automatically reconnects the USB core to the host device in response to recognition of a suspend state of the USB core by the host device. | 06-24-2010 |
20120105661 | ROW AND COLUMN JUMPING FOR PIXEL READOUT USING BURST SWITCHING MODE - An imaging apparatus is described for obtaining images. The imaging apparatus includes a pixel array, a row decoder, a column decoder, and a trigger circuit. The pixel array integrates electrical signals corresponding to incident light from a scene. The row decoder enables a selected row of pixels within the pixel array. The column decoder enables readout of a pixel in a selected column of the selected row within the pixel array. The trigger circuit generates one or more burst pulses to traverse through a corresponding number of decoder stages that correspond to pixels which are identified for discarding. Each burst pulse has a duration that is less than a stipulated minimum pulse duration of a typical decoder pulse of the decoders. By using shorter burst pulses, the trigger circuit can quickly jump to a desired row and/or column of pixels for readout, while conserving power. | 05-03-2012 |
20120274606 | OPTICAL NAVIGATION SYSTEM WITH OBJECT DETECTION - An optical finger navigation system with object detection is provided for preventing cursor movement if a user's finger has been lifted from the navigation surface. The optical finger navigation system may include a light source, an image sensor and an object detection engine. The object detection engine may be operatively coupled with the image sensor and the light source to selectively report motion data upon determining the presence of an object by comparing a scaled-up pixel value with a threshold value. The lift detection engine may be incorporated in a microcontroller, wherein the microcontroller may be added to a navigation system to provide an additional object detection feature. | 11-01-2012 |
20150301627 | Reduction of Silicon Die Size for a Navigational Sensor using Ultra High Frame Rate Acquisition - A navigation device having a small navigation sensor pixel array capable of ultra high speed imaging is proposed. A first image and a second image of a plurality of images are selected according to a predetermined difference between the corresponding acquisition times of the first image and the second image. The first image and the second image are compared to determine an amount of overlap between the first image and the second image. The predetermined difference is adjusted for subsequent image comparisons according to the amount of overlap between the first image and the second image. | 10-22-2015 |
20150305127 | OPTICAL NAVIGATION SENSOR WITH INTEGRATED CHARGE PUMP - An optical navigation sensor includes: a driving circuit and a charge pump. The driving circuit is employed for driving a light source externally connected to the optical navigation sensor. The charge pump is employed for intermittently performing an operation of providing a first supply voltage to the light source. When the driving circuit drives the light source, the charge pump does not perform the operation of providing the first supply voltage to the light source. | 10-22-2015 |
Siow Ming Tan, Penang MY
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20150211897 | Alignment Structure For An Encoder - In one embodiment, an encoder system comprising an encoder assembly and an encoder alignment structure is disclosed. The encoder assembly may include at least a detector, a hub, a housing, an index sensor of the detector, and a coding member having an index mark. The encoder alignment structure may have a projecting structure. The detector may be coupled with the housing, and the projecting structure may slideably engage the hub so as to align the index mark of the coding member with the index sensor of the detector in a first alignment arrangement. In another embodiment, an encoder assembly configured for receiving an alignment structure having a projecting structure is disclosed. | 07-30-2015 |
Soo Yong Tan, Penang MY
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20150151085 | SAFETY NEEDLE ASSEMBLIES AND RELATED METHODS - A safety needle assembly having a first hub attached to a flexible tube and a second hub attached to a needle projecting through the flexible tube. A needle guard is positioned in an interior cavity of the first hub. The needle guard has a proximal wall having an opening and two arms each with an end and wherein the two ends spaced from and biased toward the needle in a ready position. In a particular example, a support is located inside the cavity of the first hub and wherein the two ends of the two arms on the needle guard rest on the support in the ready position. | 06-04-2015 |
20150151088 | CATHETER ASSEMBLY WITH REUSABLE VALVE - A catheter assembly includes a catheter hub having an elastomeric septum that divides the catheter hub into a distal chamber and a proximal chamber. The septum also includes at least one slit that is closed and sealed when the septum is in an at-rest state. A septum activator is proximal the septum. When an external force pushes the activator against the septum, the activator deforms the septum so as to break the seal and create a flow path through the septum. A portion of the septum activator can be collapsible when subjected to the outside force. When the outside force is removed, the collapsible portion springs back to its at-rest shape, helping to pull the activator out of deforming engagement with the septum so that the septum can reseal. The activator can also be spring-biased away from engagement with the septum so that when the outside force is removed, the spring urges the activator out of engagement with the septum. With the activator removed, the septum slit can reseal. | 06-04-2015 |
20150151089 | CATHETER ASSEMBLY BLOOD CONTROL DEVICE AND RELATED METHODS - A catheter assembly includes a catheter hub and an introducer needle. The introducer needle extends through the catheter hub and through a catheter tube so as to assist placement of the catheter tube into a patient's blood vessel. Blood flashback into the catheter tube and/or catheter hub can indicate when the catheter tube is properly positioned within the blood vessel. After proper catheter tube placement is confirmed through blood flashback, the introducer needle is withdrawn. A septum blocks flashback blood from flowing proximally out of the catheter hub. One or more air vents enable air within the hub to vent when flashback blood enters the catheter hub. A porous hydrophobic material covers the one or more air vents. The hydrophobic material allows the air to flow therethrough and through the vents, but repels blood, blocking blood from flowing through the air vents. | 06-04-2015 |
Tat Hin Tan, Penang MY
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20090113272 | ERROR CORRECTION CODING IN FLASH MEMORY DEVICES - Systems and/or methods that facilitate error correction of data are presented. An error correction code (ECC) control component facilitates enabling or disabling error correction of data being written to or read from memory, such as flash memory, based on ECC indicator data associated with a piece of data. The ECC control component can analyze data, parity code, and/or indicator data associated with the incoming data and/or data stored in the memory location where the incoming data is to be written to determine whether parity code can be written for the incoming data and/or whether error correction can be enabled with respect to the incoming data. Error correction can be enabled when an indicator bit associated with the data is unprogrammed (e.g., bit set to ‘1’ state) and can be disabled by programming the indicator bit (e.g., bit set to a ‘0’ state). | 04-30-2009 |
Tat Kin Tan, Penang MY
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20090016362 | FAST PATH PACKET DESTINATION MECHANISM FOR NETWORK MOBILITY VIA SECURE PKI CHANNEL - Disclosed is a method for reducing routing overheads during data transmission to a destination mobile router of a plurality of mobile routers roaming in a network. The method comprises registering by top level mobile routers with a central authority server, sending data packets by a corresponding node of the network to the destination mobile router operationally attached to a corresponding top level mobile router, locating a position of the destination mobile router by identifying attachment of the destination mobile router to the corresponding top level mobile router from the information registered by the plurality of mobile routers with the central authority server, routing the data packet directly to the corresponding top level mobile router to which the destination mobile router is operationally attached and receiving the data packet by the destination mobile router from the corresponding top level mobile router, thereby reducing routing overheads in the network. | 01-15-2009 |
20110141976 | FAST PATH PACKET DESTINATION MECHANISM FOR NETWORK MOBILITY VIA SECURE PKI CHANNEL - Disclosed is a method for reducing routing overheads during data transmission to a destination mobile router of a plurality of mobile routers roaming in a network. The method comprises registering by top level mobile routers with a central authority server, sending data packets by a corresponding node of the network to the destination mobile router operationally attached to a corresponding top level mobile router, locating a position of the destination mobile router by identifying attachment of the destination mobile router to the corresponding top level mobile router from the information registered by the plurality of mobile routers with the central authority server, routing the data packet directly to the corresponding top level mobile router to which the destination mobile router is operationally attached and receiving the data packet by the destination mobile router from the corresponding top level mobile router, thereby reducing routing overheads in the network. | 06-16-2011 |
Tee Wee Tan, Penang MY
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20110285434 | HETEROGENEOUS PHYSICAL MEDIA ATTACHMENT CIRCUITRY FOR INTEGRATED CIRCUIT DEVICES - An integrated circuit includes physical media attachment (“PMA”) circuitry that includes two different kinds of transceiver channels for serial data signals. One kind of transceiver channel is adapted for transceiving relatively low-speed serial data signals. The other kind of transceiver channel is adapted for transceiving relatively high-speed serial data signals. A high-speed channel is alternatively usable as phase-locked loop (“PLL”) circuitry for providing a clock signal for use by other high- and/or low-speed channels. A low-speed channel can alternatively get a clock signal from separate low-speed PLL circuitry. | 11-24-2011 |
Tek Seng Tan, Penang MY
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20100055848 | Inspection of underfill in integrated circuit package - In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package substrate. A data processor analyzes the camera image to determine an occurrence of an unacceptable condition of the underfill material. Pre-heating and/or post-heating of the package substrate before and/or after dispensing the underfill material by a contact-less heater ensures uniform spreading of the underfill material. | 03-04-2010 |
Tien Wei Tan, Penang MY
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20110037082 | Smart Integrated Semiconductor Light Emitting System Including Light Emitting Diodes And Application Specific Integrated Circuits (ASIC) - A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC) on the substrate, and at least one light emitting diode (LED) on the substrate in electrical communication with the application specific integrated circuit (ASIC). The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated system having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions. | 02-17-2011 |
20120091466 | Smart Integrated Semiconductor Light Emitting System Including Nitride Based Light Emitting Diodes (LED) And Application Specific Integrated Circuits (ASIC) - A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC), and at least one light emitting diode (LED) that includes a Group-III nitride based material such as GaN, InGaN, AlGaN, AlInGaN or other (Ga, In or Al) N-based materials. The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated LED circuit having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions. | 04-19-2012 |
20140175966 | LED LAMP - A lamp comprises an LED light source for emitting light. A combined heat sink and reflector is thermally coupled to the LED light source. The heat sink and reflector comprise an internal surface for reflecting the light and an exterior surface. The internal surface and the external surface are uncovered such that heat is dissipated from the interior surface and the exterior surface. | 06-26-2014 |
Yen Siang Tan, Penang MY
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20150138037 | ANTENNA ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME - According to various aspects, exemplary embodiments are disclosed of antenna assemblies and methods of manufacturing the same. In an exemplary embodiment, a method generally includes forming (e.g., molding, etc.) a sleeve over and/or between a first portion of a first component (e.g., a bushing, etc.) and a second portion of a second component (e.g., adaptor, etc.). The sleeve is coupled to the first and second portions of the respective first and second components. The method may also include removably attaching an antenna connector subassembly to the first component such that a printed circuit board assembly of the antenna connector subassembly is covered by the sleeve. The method may additionally include overmolding a sheath over the sleeve and one or more radiating elements of a multiband antenna assembly that includes the antenna connector subassembly, whereby the sleeve covers and protects the printed circuit board assembly during the overmolding. | 05-21-2015 |
Yi Chun Tan, Penang MY
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20110153061 | Master Teaching Jig - A disk carrier for teaching disk positioning in a substrate changing system. The disk carrier composed of a panel having a disk opening configured to receive a disk and a plurality of beam sensors disposed around the disk opening to project beams parallel to a surface of the disk when secured within the disk opening. The plurality of beam sensors may be composed of at least one beam sensor on each of a front side and rear side of the panel. | 06-23-2011 |
Zi Hao Tan, Penang MY
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20110310018 | OPTICAL NAVIGATION SYSTEM WITH LIFT DETECTION - An optical navigation system with a lift detection module is provided for preventing cursor movement if the optical navigation system has been lifted from the navigation surface. The optical navigation system may include an image sensor, a controller and a lift detection module. The lift detection module may be operatively coupled with the image sensor and the controller to selectively report a motion data upon determining a lift by comparing the average of the photosensitive pixel elements with a pixel element threshold value and the surface quality value with a surface quality threshold value. The lift detection module may be incorporated in a microcontroller, wherein the microcontroller may be added to a navigation system to provide an additional lift detection feature. | 12-22-2011 |
20120274606 | OPTICAL NAVIGATION SYSTEM WITH OBJECT DETECTION - An optical finger navigation system with object detection is provided for preventing cursor movement if a user's finger has been lifted from the navigation surface. The optical finger navigation system may include a light source, an image sensor and an object detection engine. The object detection engine may be operatively coupled with the image sensor and the light source to selectively report motion data upon determining the presence of an object by comparing a scaled-up pixel value with a threshold value. The lift detection engine may be incorporated in a microcontroller, wherein the microcontroller may be added to a navigation system to provide an additional object detection feature. | 11-01-2012 |
20150301618 | SUB-FRAME ACCUMULATION METHOD AND APPARATUS FOR KEEPING REPORTING ERRORS OF AN OPTICAL NAVIGATION SENSOR CONSISTENT ACROSS ALL FRAME RATES - A method for making a lower frame rate of an optical navigation sensor mimic a higher frame rate of the optical navigation sensor includes: receiving a motion delta of the optical navigation sensor at the lower frame rate; dividing the motion delta into a smaller number of parts; dividing a time period of the lower frame rate to generate a time threshold which is shorter than the time period of the lower frame rate; receiving a clock signal for updating a counter; and outputting a first part of the delta when the counter reaches the time threshold. | 10-22-2015 |